AU546818B2

AU546818B2 – Method of forming a wire bond
– Google Patents

AU546818B2 – Method of forming a wire bond
– Google Patents
Method of forming a wire bond

Info

Publication number
AU546818B2

AU546818B2
AU76893/81A
AU7689381A
AU546818B2
AU 546818 B2
AU546818 B2
AU 546818B2
AU 76893/81 A
AU76893/81 A
AU 76893/81A
AU 7689381 A
AU7689381 A
AU 7689381A
AU 546818 B2
AU546818 B2
AU 546818B2
Authority
AU
Australia
Prior art keywords
forming
wire bond
bond
wire
Prior art date
1980-10-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Ceased

Application number
AU76893/81A
Other versions

AU7689381A
(en

Inventor
Johannes B.P. Janssen
Wilhelmus J.J. Lorenz
Hermanus A. Van De Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Koninklijke Philips NV

Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1980-10-29
Filing date
1981-10-28
Publication date
1985-09-19

1981-10-28
Application filed by Philips Gloeilampenfabrieken NV
filed
Critical
Philips Gloeilampenfabrieken NV

1982-05-06
Publication of AU7689381A
publication
Critical
patent/AU7689381A/en

1985-09-19
Application granted
granted
Critical

1985-09-19
Publication of AU546818B2
publication
Critical
patent/AU546818B2/en

2001-10-28
Anticipated expiration
legal-status
Critical

Status
Ceased
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

H—ELECTRICITY

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H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

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H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

H01L24/78—Apparatus for connecting with wire connectors

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H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof

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H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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H01L2224/8518—Translational movements

H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

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H01L2924/20—Parameters

H01L2924/207—Diameter ranges

H01L2924/20754—Diameter ranges larger or equal to 40 microns less than 50 microns

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H01L2924/30105—Capacitance

AU76893/81A
1980-10-29
1981-10-28
Method of forming a wire bond

Ceased

AU546818B2
(en)

Applications Claiming Priority (2)

Application Number
Priority Date
Filing Date
Title

NL8005922

1980-10-29

NL8005922A

NL8005922A
(en)

1980-10-29
1980-10-29

METHOD FOR FORMING A WIRE JOINT

Publications (2)

Publication Number
Publication Date

AU7689381A

AU7689381A
(en)

1982-05-06

AU546818B2
true

AU546818B2
(en)

1985-09-19

Family
ID=19836074
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

AU76893/81A
Ceased

AU546818B2
(en)

1980-10-29
1981-10-28
Method of forming a wire bond

Country Status (18)

Country
Link

JP
(1)

JPS5916409B2
(en)

KR
(1)

KR890000585B1
(en)

AU
(1)

AU546818B2
(en)

BE
(1)

BE890887A
(en)

BR
(1)

BR8106902A
(en)

CA
(1)

CA1178664A
(en)

CH
(1)

CH654142A5
(en)

DD
(1)

DD205294A5
(en)

DE
(1)

DE3141842A1
(en)

ES
(1)

ES506580A0
(en)

FR
(1)

FR2493044B1
(en)

GB
(1)

GB2086297B
(en)

HK
(1)

HK40885A
(en)

IT
(1)

IT1139570B
(en)

MY
(1)

MY8500623A
(en)

NL
(1)

NL8005922A
(en)

PL
(1)

PL133893B1
(en)

SG
(1)

SG21984G
(en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US4476365A
(en)

*

1982-10-08
1984-10-09
Fairchild Camera & Instrument Corp.
Cover gas control of bonding ball formation

US4549059A
(en)

*

1982-11-24
1985-10-22
Nec Corporation
Wire bonder with controlled atmosphere

US4476366A
(en)

*

1983-02-01
1984-10-09
Fairchild Camera & Instrument Corp.
Controlled bonding wire ball formation

US4594493A
(en)

*

1983-07-25
1986-06-10
Fairchild Camera & Instrument Corp.
Method and apparatus for forming ball bonds

FR2555813B1
(en)

*

1983-09-28
1986-06-20
Hitachi Ltd

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE

US4705204A
(en)

*

1985-03-01
1987-11-10
Mitsubishi Denki Kabushiki Kaisha
Method of ball forming for wire bonding

US5031821A
(en)

*

1988-08-19
1991-07-16
Hitachi, Ltd.
Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method

US5628922A
(en)

*

1995-07-14
1997-05-13
Motorola, Inc.
Electrical flame-off wand

DE19618320A1
(en)

*

1996-04-30
1997-11-13
F&K Delvotec Bondtechnik Gmbh

Device for «ball» bonding

JP2003163235A
(en)

*

2001-11-29
2003-06-06
Shinkawa Ltd
Apparatus for wire bonding

TWI229022B
(en)

*

2002-06-20
2005-03-11
Esec Trading Sa
Device with electrodes for the formation of a ball at the end of a wire

JP6093954B2
(en)

*

2012-10-05
2017-03-15
株式会社新川

Antioxidant gas blowing unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

CH568656A5
(en)

*

1974-03-20
1975-10-31
Transistor Ag
Welding of contact blobs to semiconductor lead wires – uses electric DC light arc of preset current strength for melting lead wire end

NL7406783A
(en)

*

1974-05-21
1975-11-25
Philips Nv

PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE.

GB1536872A
(en)

*

1975-05-15
1978-12-20
Welding Inst
Electrical inter-connection method and apparatus

GB1468974A
(en)

*

1975-05-23
1977-03-30
Ferranti Ltd
Manufacture of semiconductor devices

GB1600021A
(en)

*

1977-07-26
1981-10-14
Welding Inst
Electrical inter-connection method and apparatus

1980

1980-10-29
NL
NL8005922A
patent/NL8005922A/en
not_active
Application Discontinuation

1981

1981-10-22
CA
CA000388476A
patent/CA1178664A/en
not_active
Expired

1981-10-22
DE
DE3141842A
patent/DE3141842A1/en
active
Granted

1981-10-26
GB
GB8132183A
patent/GB2086297B/en
not_active
Expired

1981-10-26
BR
BR8106902A
patent/BR8106902A/en
unknown

1981-10-26
PL
PL1981233586A
patent/PL133893B1/en
unknown

1981-10-26
CH
CH6815/81A
patent/CH654142A5/en
not_active
IP Right Cessation

1981-10-26
FR
FR8120025A
patent/FR2493044B1/en
not_active
Expired

1981-10-26
JP
JP56170252A
patent/JPS5916409B2/en
not_active
Expired

1981-10-27
ES
ES506580A
patent/ES506580A0/en
active
Granted

1981-10-27
IT
IT24731/81A
patent/IT1139570B/en
active

1981-10-27
DD
DD81234387A
patent/DD205294A5/en
unknown

1981-10-27
BE
BE0/206365A
patent/BE890887A/en
not_active
IP Right Cessation

1981-10-28
AU
AU76893/81A
patent/AU546818B2/en
not_active
Ceased

1981-10-28
KR
KR1019810004107A
patent/KR890000585B1/en
active

1984

1984-03-12
SG
SG219/84A
patent/SG21984G/en
unknown

1985

1985-05-23
HK
HK408/85A
patent/HK40885A/en
unknown

1985-12-30
MY
MY623/85A
patent/MY8500623A/en
unknown

Also Published As

Publication number
Publication date

FR2493044B1
(en)

1986-03-28

FR2493044A1
(en)

1982-04-30

JPS5916409B2
(en)

1984-04-16

GB2086297B
(en)

1983-12-21

NL8005922A
(en)

1982-05-17

DD205294A5
(en)

1983-12-21

ES8301390A1
(en)

1982-11-16

MY8500623A
(en)

1985-12-31

DE3141842C2
(en)

1990-09-20

PL133893B1
(en)

1985-07-31

IT8124731D0
(en)

1981-10-27

JPS57102036A
(en)

1982-06-24

IT1139570B
(en)

1986-09-24

CH654142A5
(en)

1986-01-31

DE3141842A1
(en)

1982-10-21

CA1178664A
(en)

1984-11-27

KR890000585B1
(en)

1989-03-21

KR830008394A
(en)

1983-11-18

HK40885A
(en)

1985-05-31

GB2086297A
(en)

1982-05-12

ES506580A0
(en)

1982-11-16

SG21984G
(en)

1985-01-04

AU7689381A
(en)

1982-05-06

BE890887A
(en)

1982-04-27

BR8106902A
(en)

1982-07-13

PL233586A1
(en)

1982-05-10

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