AU621657B2 – Organic solvent solutions of phosphate esters of epoxy resins
– Google Patents
AU621657B2 – Organic solvent solutions of phosphate esters of epoxy resins
– Google Patents
Organic solvent solutions of phosphate esters of epoxy resins
Download PDF
Info
Publication number
AU621657B2
AU621657B2
AU41169/89A
AU4116989A
AU621657B2
AU 621657 B2
AU621657 B2
AU 621657B2
AU 41169/89 A
AU41169/89 A
AU 41169/89A
AU 4116989 A
AU4116989 A
AU 4116989A
AU 621657 B2
AU621657 B2
AU 621657B2
Authority
AU
Australia
Prior art keywords
component
employed
amount
percent
moles
Prior art date
1988-09-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU41169/89A
Other versions
AU4116989A
(en
Inventor
John L. Massingill Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1988-09-07
Filing date
1989-09-07
Publication date
1992-03-19
1989-09-07
Application filed by Dow Chemical Co
filed
Critical
Dow Chemical Co
1990-03-15
Publication of AU4116989A
publication
Critical
patent/AU4116989A/en
1992-03-19
Application granted
granted
Critical
1992-03-19
Publication of AU621657B2
publication
Critical
patent/AU621657B2/en
2009-09-07
Anticipated expiration
legal-status
Critical
Status
Ceased
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08G59/14—Polycondensates modified by chemical after-treatment
C—CHEMISTRY; METALLURGY
C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08G59/14—Polycondensates modified by chemical after-treatment
C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
Description
To: The Commissioner of Patents Agent: Phillips, Ormonde Fitzpatrick Byi RICHARD G. WATERMAN General Patent Counsel i i r i 1 iB Pi i: Br:
B!B
Note: No legalization or other witness required.
I
AUSTRALIA
Patents Act COMPLETE SPECIFICATION
(ORIGINAL)
621657 Class Int. Class Application Number: Lodged: Complete Spezification Lodged: Accepted: Published: Priority Related Art: 0tc a 0) St 9 0 S tO9
I,
S 00
SC
Applicant(s): 9 49 arc The Dow Chemical Company 2030 Dow Center, Abbott Road, Midland, Michigan 48640, UNITED STATES OF AMERICA Address for Service is: PHILLIPS ORMONDE FITZPATRICK Patent and Trade Mark Attorneys 367 Collins Street Melbourne 3000 AUSTRALIA Complete Specification for the invention entitled: ORGANIC SOLVENT SOLUTIONS OF PHOSPHATE ESTERS OF EPOXY RESINS Our Ref 145671 POF Code: 1037/1037 The following statement is a full description of this invention, including the best method of performing it known to applicant(s): 1- 6006 i f a s a hi 1 i i s i f
F
1 -1A- ORGANIC SOLVENT SOLUTIONS OF PHOSPHATE ESTERS OF EPOXY RESINS The present invention pertains to organic solutions of phosphate esters of epoxy resins.
t, tAdvanced aromatic epoxy resins are well known t* 5 for their extremely useful combination of properties
S
t such as flexibility, adhesion, corrosion resistance, .i chemical resistance and solvent resistance.
Unfortunately, they also have some well known disadvantages, for example, sensitivity to ultraviolet light, relatively high viscosities and limited formability.
Epoxy phosphate esters have been prepared by various processes for water thinnable coating formulations. It has been unexpectedly discovered that these phosphate esters, when employed in non-aqueous formulations, give outstanding barrier properties to the C: «resulting coatings when compared to the base resins from which they are derived. Epoxy resin phosphate esters and methylol-containing curing agents can be formulated to give bake coatings with exceptional improvements in flexibility and formability with retention of traditional epoxy protection.
37,261-F -lA- I, i
:I
Ti-‘ U C. I The present invention is directed to a curable composition which comprises a non-aqueous solution composition which comprises a mixture of: the product resulting from reacting at least one epoxy-containing compound containing an average of more than one vicinal epoxide group per molecule; with at least one phosphorous-containing compound; and at least one organic solvent for compound and (II) a curing quantity of at least one curing agent for component which cures through aliphatic hydroxyl groups. Optionally, water may be reacted with components and to form the product of component More particularly, the present invention is directed to a curable composition which comprises a non-aqueous solution composition which comprises a mixture of: the product resulting from reacting at least one epoxy-containing compound containing an average of more than one vicinal epoxide group per molecule; with at least one phosphorous-containing compound selected from the group consisting of phosphoric acid; super phosphoric acid; and 25 a combination of and and wherein component is employed in an amount which provides a ratio of moles of component to component of from 0.02:1 to 5:1; and at least one organic solvent for component and wherein component is employed in an amount of from to 10 percent by weight based upon the combined weight of components and and component is employed in an amount of from 10 to 90 percent by weight based upon the combined weight of components and and (II) a curing quantity of at least one curing agent for component which cures through aliphatic hydroxyl groups Qs pneser\A Lkr\ Ccme -~rerii(\ i r r i ,:i i r j i i i i;, -3basOed upon the oombind weight @f ecmpnntS and Even more particularly, the present invention pertains to a composition containing as a first component a phosphate ester of an epoxy resin and as a second component one or more organic solvents.
The composition of the present invention is a nonaqueous solution or a composition which is essentially free of water. Curable compositions of the present invention can also be prepared.
Component of the present invention, i.e., the epoxy phosphate ester compositions of the present 15 invention are prepared by any suitable means such as Sdescribed by Martin in U.S. Patent 4,289,812, by Martin S in U.S. Patent 4,164,487, by Martin et al. in U.S.
Patent 4,256,844 or by Langer et al. in U.S. Patent S! 4,613,661.
Suitably, the epoxy phosphate ester can be prepared by reacting as a first component an epoxy resin having an average of more than one vicinal epoxy group per molecule with a second component a 25 2 phosphoric acid source at a temperature suitably from to 250°C, more suitably from 100 0 C to 200 0 C, most Ac suitably from 110 0 C to 180 0 C; at pressures suitably from 0 psia to 200 psia, more suitably from 0 psia to 150 psia, most suitably from 0 psia to 100 psia for a period of time suitably from 0.2 to 10, more suitably from to 6, most suitably from 1 to 3 hours. Higher reaction temperatures require shorter reaction times to complete the reaction, whereas lower temperatures require longer reaction times to complete the reaction. The reactants are employed in quantities which provide a molar ratio ©IQ I37,261-F -3i Cj-3 T O’ n compound suitably from 0.02:1 to 5:1, more suitably from 0.2:1 to 2:1, most suitably from 0.5:1 to 1:1.
In preparing component of the present invention, if desired, the epoxy groups of the epoxycontaining compound, if any remain after reaction of the epoxy-containing compound with the phosphorus-containing compound, can be totally or partially hydrolyzed by reaction with water. The hydrolysis reaction can be conducted in the manner described by Davis et al. in employed to prepare the epoxy phosphate esters include, for example, phosphoric acid, super phosphoric acid, other condensed forms of phosphoric acid, aqueous solutions containing at least 18% H3PO4, phosphoric esters and combinations thereof.
Suitable epoxy resins which can be employed to l prepare the epoxy phosphate esters include any epoxy resin having an average of more than one vicinal epoxy group per molecule. These include, aliphatic, Scycloaliphatic, or aromatic based epoxy resins.
Suitable such epoxy resins include, for example but not to be limited to, those epoxy resins represented by the following formulas I, II, III, IV or V 37,261-F i S- e r i w rpr h px hsht sesicueayeoyIi::: Formula I 0
H
2 C -CH2
(X)
4 OH (X) 4 0 0 q O-CH 2 -C-CH2 0 0 CH2-C -CH2 R ‘n Formula II
(X)
4 H2C- C-CH 2
-O
I
(X)
4
(X)
4 (A)4 0 0
CH
2 -C -CH2
I
I
a 0 0 a aa C a p 0a -4 C Ca a 9 a;.
0 8 0 CC 0 C 08 9 C 0 C a 8 4 00 8 8 a a C C CC C 4 a 00 C C CC 400 0 00 Formula III 0 0 -CH2-C-CH2 0 0 -CH 2 -C-CH2 0 R R
(X)
4 (X) 3 m 0 CH2-C- CH2
R
(X)
4 6h- I r- A f zr. 0 0 a p A *0
C
S 0 0 00 S 0 5 0 60 0 5 0 S Vt 44 0 6 Formula IV 0
H
2 C- CH 2
-C-
R
(X)
4
Q()
(X)
4
OH
CH
2 -C -CH 2
-C
I
(X)
4
Q(X)
4 Qmm
(X)
4 0 CH2-C -CHd 2
I
CH2 0 CH2 CH2
-C-H
CH,
0~ 1′ 1
I
Formula V o0 0 /0
-C
2 -C-CH2 0 -CH 2 -C-CH2 0 -CH 2 -C–CH2
IR
P (X)4 (X)4
(X)
4 wherein each A is independently a divalent hydrocarbyl S 5 group having suitably from 1 to 12, more suitably from 1 to 6, most suitably from 1 to 4, carbon atoms; each A’ is independently a divalent hydrocarbyl group having I from 1 to 10, more suitably from 1 to 4, most suitably 20 from 1 to 2, carbon atoms; each Q is independently hydrogen or an alkyl group having from 1 to 4 carbon atoms; each R is independently hydrogen or an alkyl group having from 1 to 3 carbon atoms; each X is tic t independently hydrogen, a hydrocarbyl or hydrocarbyloxy jI 25 group having suitably from 1 to 12, more suitably from 1 to 6, most suitably from 1 to 4, carbon atoms or a halogen atom, preferably chlorine or bromine; m has a value suitably from 0.01 to 8, more suitably from 1 to 6, most suitably from 2 to 4; n has a value of zero or 1; n’ has an average value suitably from 0 to 200, more suitably from 0 to 150, most suitably from 0 to 100; each p suitably has a value from zero to 10, more suitably from 0 to 8, most suitably from 0 to 6; and 3 each p’ suitably has a value from zero to 8, more suitably from 1 to 6, most suitably from 2 to 4.
37,261-F -8i i I 1 7 I Preferred epoxy-containing compounds which can be employed to prepare the epoxy phosphate esters are the diglycidyl ethers of bisphenol A, bisphenol F, bisphenol K and bisphenol S.
The epoxy resins which are employed to prepare the phosphorylated and optionally fully or partially hydrolyzed epoxy resins of the present invention preferably have epoxide equivalent weights (EEWs) of from to 100,000, more preferably from 170 to 50,000, most preferably from 400 to 10,000.
4444 4 1 Cl’ 4 4 4 41 4 4i~ 44,44 -8a- Ql o L=I i -4
A\
-9the phosphorylated and optionally fully or ially hydrolyzed epoxy resins of the ent invention suitably have epoxi uivalent weights (EEWs) of from 90 to 100 more suitably from 170 to 50,000, most -a1tably from 400 to 10,000.
Component of the present invention comprises at least one organic solvent for component Suitable organic solvents which can be employed herein include, for example, alcohols, glycols, glycol ethers, ketones, aromatic hydrocarbons, cyclic ethers, esters, chlorinated solvents and combinations thereof.
Particularly suitable solvents include, for example, toluene, benzene, xylene, methyl ethyl ketone, methyl isobutyl ketone, diethylene glycol methyl ether, dipropylene glycol methyl ether, ethylene glycol hexyl ether, mixtures of acetone and methylene chloride, Smixtures of alcohols and methylene chloride, any and i’ 20 combination thereof.
The amount of solvent to be employed is practically any amount *tich provides the system with the desired applicatic viscosity viscosities are made appropriate for the coating application equipment used. Viscosities can range, for example, from 100 (0.1 pascal second) to 1000 centipoise (1 pascal second); more suitably from 100 ops (0.1 Pa-s) to 500 ops (0.5 i Pa-s); and even more suitably from 100 cps (0.1 Pa-s) to 300 ops (0.3 Pa-s). Suitable amounts of solvent used include, for example, from 10 to 90, more suitably from 10 to 80, most suitably from 20 to 80, parts by weight based upon the combined weight of components (A) 3 and I 37,261-F -9r r io: The phosphorylated and, if desired, totally or partially hydrolyzed epoxy resins of the present invention can be cured by the use of curing agents which cure through the aliphatic hydroxyl groups contained in the phosphorylated and optionally totally or partially hydrolyzed epoxy resin. Suitable such curing agents include, for example, alkylolated urea-aldehyde resins, alkylolated melamine-aldehyde epoxy resins, polyisocyanates, blocked polyisocyanates, alkylolated phenol-aldehyde resins and combinations thereof.
Particularly suitable curing agents include, for example, methylolated urea-formaldehyde resins, methylolated melamine-formaldehyde resins, methylolated phenol-formaldehyde resins, toluene diisocyanate, 4,4′-diphenylmethanediisocyanate, isophorone diisocyanate and its liquid derivatives sold under the Stradenames of Rubinate» M LF-168 or Rubinate'» LF-179 by Rubinate Chemicals, Inc. of Wilmington, Delaware, or ISONATE» 143L or ISONATE T M 181 by The Dow Chemical Company of Midland, Michigan, a biuret or isocyanurate from hexamethylene diisocyanate, and a cyclic trimer of hexamethylene diisocyanate and toluene diisocyanate.
I S 25 The isocyanates can also be prepolymers of the aforementioned isocyanates and polyols such as polypropylene glycols, triols such as trimethylolpropane or glycerine or their reaction products with propylene oxide, butylene oxide or mixtures thereof having equivalent weights of from 85 to 1000. The isocyanates can be blocked with phenols, such as phenol, 4-chlorophenol, o-secbutylphenol, lactams such as caprolactam and ketoximes or aldoximes such as acetaldehyde oxime or methyl ethyl ketoxime, and any combination thereof.
37,261-F to 10 percent by weight based upon the combined weight of components and and component is employed in an, amount of from 10 to 90 percent by weight based upon i the combined weight of components and and (II) a /2 I 41 -11- Coatings capable of being cured at room temperature can be obtained by use of the aforementioned isocyanates which contain no blocking agent. From an industrial standpoint, the blocked isocyanates are preferred since they will ‘provide one package systems.
The ketoxime or lactam blocked isocyanates are preferred from an ecology standpoint and for providing the appropriate cure temperatures.
The curing agents are employed in any quantity which will effectively cure the phosphorylated and Soptionally, totally or partially hydrolyzed epoxy resin.
Suitable such effective amounts will depend upon the 4I particular epoxy resin being cured and the particular 15 curing agent being employed; however, suitable such Samounts can include, for example from 1 to 90, more suitably from 4 to 50, ost suitably from 4 to percent by weight based upon the weight of the resin.
20 compositions of the present invention e u can be blended with other materials or additives 4 such as fillers, pigments, dyes, flow modifiers, thickeners, reinforcing agents, catalysts, and S 25 combinations thereof.
The additives are added to the composition rq of the present invention in functionally equivalent, amounts, for example, pigments and/or dyes are added 1 30 to the composition in quantities which will provide the composition with the desired color. Pigments and/or dyes, for example, are suitably employed in amounts of from 20 to 200, more suitably from 50 to 150, most suitably from 50 to 100 percent by weight based upon the weight of the resin and curing agent.
37,261-F -11peren bywih ae uo h egt ftersn Th copsiin ofte rsntiveto -12- The modifiers such as thickeners and flow modifiers can be suitably employed in amounts of from 0.01 to 20, more suitably from 0.1 to 10, most suitably from 0.1 to 2 percent by weight based upon the weight of resin and curing agent.
Reinforcing materials which can be employed herein include, for example, natural and synthetic fibers in the form of, for example, woven, mat, monofilament and multifilament. Suitable reinforcing materials include, for example, glass, ceramics, nylon, rayon, cotton, aramid, graphite and combinations thereof.
Suitable fillers which can be employed herein include, for example, inorganic oxides, 4 ceramic microspheres, plastic microspheres and combinations thereof.
The fillers can be employed in amounts suitably from 5 to 100, more suitably from 10 to most suitably from 10 to 30 percent by weight based upon the weight of the resin and curing agent.
The following examples are illustrative of the invention.
Example 1 Phosphorylation of Advanced Epoxy Resin, EEW 1675, with Approximately 1 phr H 3 PO4 (as 110 Percent Acid) in Ethylene Glycol Monobutyl Ether (70 Percent Solids) An advanced bisphenol A based epoxy resin having an epoxide equivalent weight (EEW) of 1675 available from The Dow Chemical Company as D.E.R.
TM 667, 37,261-F -12- 6006 -13- (500 grams, 0.06 mole) and solvent, ethylene glycol monobutyl ether (193 grams, 1.63 moles), were placed in a 2-liter round bottom, 5-neck pyrex flask equipped with a mechanical stirrer, temperature controller, nitrogen pad, condenser and addition funnel. The resin was stirred slowly as the temperature was raised to 125 0 C to dissolve the resin. When the resin was dissolved, super phosphoric acid (5 grams, 0.054 mole), in 21 grams solvent was added to the resin solution and allowed to Sreact for 30 minutes. Water (10 grams, 0.56 mole) was added and the mixture stirred for two hours to give the epoxy resin phosphate ester solid solution (70 percent C Z solids).
The above resin was formulated with various levels of a phenol/formaldehyde resole curing agent available from BTL Specialty Resins Corp. as METHYLON 75108, to give formulations with 10 percent, 20 percent and 30 percent crosslinker. The solvent used to reduce application viscosity was DuPont Dibasic ester.
The above formulations were coated onto tin-free steel can stock using a drawdown bar.
The tin-free steel panels had a monolayer of chromium oxide on the surface. Prior to coating, the panels were washed with Aromatic 100 solvent from Exxon to remove oil and dirt particles followed by drying in an oven at 400 0 F (204.4 0 C) for 2 minutes. The coatings were cured by baking in an electric convection oven at 400’F (204.4°C) for 8, 10 or 15 minutes. The following tests were performed on the cured panels and the results are given in Table I.
37,261-F -13i i i 37,261-F -IA- *1 -14- METHYL ETHYL KETONE (MEK) RESISTANCE was determined by rubbing the coating surface with a 2 pound ball-pein hammer that had cheesecloth (10 plies) wrapped around the ball. The cheesecloth was saturated with MEK. No force other than the natural weight of the hammer and the force needed to guide the hammer back and forth across the coating was applied. One back and forth movement constituted one double rub. Counting was stopped when the coating was scratched or marred.
WEDGEBEND FLEXIBILITY was determined according to ASTM D 3281-84 modified by using an 8X jewelers lighted magnifying glass to read the test panels. The results were recorded as millimeters of failure from the 1 15 TO end of the panel.
o ‘6 0001 IMPACT RESISTANCE was performed at inch-pounds (usually just short of rupturing the tin-free steel (TFS)) according to ASTM D-2794-84. The panel was tested for adhesion by taping it with Scotch
TM
610 adhesive tape and removing the tape in a quick a 00 smooth motion. Adhesion failure or cracking of the coating was visualized by acidic copper sulfate and the S 25 test panels read under an 8X jewelers lighted magnifying glass. The panels were rated as follows: 0 no S, failure, 1 failure.
STEAM PROCESS RESISTANCE was determined by placing the test panels in a steam autoclave for 90 minutes at 250 0 F (121.1 0 C) at a pressure of about 15 psig (103.4 kPa). The test panels were stressed with a simple U-shaped form prior to being placed in the autoclave. The test panels were removed from the autoclave, immediately (within 15 minutes) dried and inspected for blush. The ratings were =zero for no 37,261-F -14- 4 1 L S tRA K blush and 1 for a slight haziness and 2 for a milky white appearance. The stressed area of the panel was cut with a razor blade in an X pattern. Scotch T M #610 adhesive tape was rubbed over the X and removed in a smooth, rapid motion. The adhesion ratings were 0 for no loss, 1 for slight ticking, 2 for a loss of 5 percent of the coating, 3 for a 10 percent loss of the coating and 4 for a gross failure, at least a loss of percent of the coating.
r. FILM THICKNESS was determined by using a 1; Fischer Multiscope. This tester determines film thickness by using magnetic properties of the steel substrate calibrated against a standard on the bare 15 5 (film free) substrate. Each panel had an average of fifteen measurements to determine the thickness of the panel. The range for acceptable coating thickness is approximately 0.13 to 0.35 mils (0.003302 to 0.00889 Smm).
COMPARATIVE EXPERIMENT A A solid bisphenol A based epoxy resin having an EEW of 1675 available from The Dow Chemical Company as
D.E.R.
M 667 (40 grams) was mixed with solvent (ethylene glycol monobutyl ether, 50 grams) along with phosphoric acid (as 85 percent aqueous solution, 0.6 gram, 1 percent by weight of resin solids) and mixed overnight on a roller at about 35 0 C until dissolved. Then a phenol/formaldehyde resole curing agent available from BTL Specialty Resins Corp. as METHYLON 75108, grams, 20 percent by weight of resin solids and a silicone flow modifier available from The General Electric Co. as SR882, 0.2 gram, were added. This formulation was mixed by rolling for one hour. Test 37,261-F i 4 37,261-F
I
-3-
I~
1 c: i;~s 4 1’ -16panels were coated, baked at 400 0 F (204.4°C) for either 8, 10 or 15 minutes and tested as in Example 1. The results are given in Table I. The amount of curing agent used was adjusted to also give formulations containing 10 percent and 30 percent by weight. These formulations were coated onto test panels, baked, and tested as described above. The results are given in Table I.
0 0 0
L
0r is:1 0r 0 0 1 0. t r r: i
I
«i ;iI 1;i: ‘1’ 37,261-F -16i _i -ir i i Li a 0 0 a a a 8 0 A 0 0 0 00 0 o 00 00 0 0 0 S 0 40 04 000 -0 0 0 0 00 o 0 0 00 0 080 000 0 00 TABLE I SAM- X- DRY AUTOCLAVE PEREI LINKER FILM BAKE MEK WEDGEBEND INCH-LB PLE RESIN BTL THICK. TIME DR LOSS, mm IREVERSE NO. 75108 MILS BLUSH ADHESION IMPACT 1 C.E. A* 10 0.29 8 60 21 0 0 1 2 C.E. A* 10 0.23 10 50 34 0 0 0 3 C.E. A* 10 0.19 15 30 21 0 0 1 4 C.E. A* 20 0.35 8 210 45 0 1 0 C.E. A* 20 0.21 10 20 75 0 1 .1 6 C.E. A* 20 0.20 15 250 77 0 0 0 7 C.E. A* 30 0.25 8 400 80 0 1 1 8 C.E. A* 30 0.31 10 500 45 0 0 1
\J>
I’
C.E. A* 0.19 15 500 0 A I *Not an example of the invention.
f I A a A A A TABLE I (Continued) SAM- X- DRY AUTOCLAVE LINKER FILM BAKE MEK WEDGEBEND INCH-LB NLE BTL THICK. TIME DR LOSS, mm REVERSE NO. 75108 MILS BLUSH ADHESION IMPACT 0 E -0 Ex. 1 10 0.13 8 10 241 0 0 1 11 Ex. 1 10 0.15 10 10 21 0 i 1 12 Ex. 1 10 0.22 15 10 30 0 0 0 13 Ex. 1 20 0.16 8 70 30 0 0 1 14 Ex. 1 20 0.17 10 40 29 0 1 I Ex. 1 20 0.21 15 90 28 0 0 0 16 Ex. 1 30 0.18 8 70 39 0 1 0 17 Ex. 1 30 0.23 10 120 430 1 1 18 Ex. 1 30 0.18 15 130 31 0 1 1 Ln
H
U’
S,4~ 37,261-F -6- A.t ~a1 .1 w I iK’ i 1 -19- Example 2 Phosphorylation of Advanced Epoxy Resin, EEW 3000, with 0.82 phr H3P04 (as 110 Percent Acid) in Ethylene Glycol Monobutyl Ether (50 Percent Solids) A solid bisphenol A based epoxy resin having an EEW of 3000 available from The Dow Chemical Company as
D.E.R.»
T 669E was phosphorylated by the procedure of Example 1. Coatings were prepared and tested as described in Example 1. The results are given in Table COMPARATIVE EXPERIMENT B t 4 The procedure of Comparative Experiment A was used to formulate, coat and test a composition with the solid epoxy resin having an EEW of 3000 rather than the resin having an EEW of 1675. The results are given in Table II.
0* 4 41 f
K
-19- 4
I,
i i i yi i
I
i t ^1 s ji 37,261-F
-A
a
S
TABLE I! SA-% X- DRY AUTOCLAVE LIKR FLSBKAEMEDEED-________ NHL NLO RSI BTL THICK. TIME DR LOSS, mm REVERSE N.75108 MILS BLUSH ADHESION IMPACT 19 C.E. B* 10 0.22 8 40 41 0 1 1 C.E. B* 10 0.30 10 43 49 0 0 1 21 C.E. B* 10 0.37 15 50 35 0 0 0 22 C.E. B* 20 0.28 8 26 47 0 0 1 23 C.E. B* 20 0.18 10 60 42 0 1 1 214 C.E. B* 20 0.19 15 60 55 0 0 1 C.E. B* 30 0.15 8 250 80 0 0 .1 26 C.E. B* 30 0.29 10 250 100 0 0 1 27 C.E. B* 30 0.143 15 500 100 1 1 1 *Not an example of the invention.
TABLE II (Continued) SAM- X- DRY ATCAE2 PE RSN LINKER FILM BAKE MEK WEDGEBEND
INCH-LB
NLO RSI BTL THICK. TIME DR LOSS, mm REVERSE N.75108 MILS BLUSH ADHESION IMPACT 28 Ex. 2 10 0.33 8 30 28 0 0 0 29 Ex. 2 10 0.28 10 410 22 0 0 0 Ex. 2 10 0.27 15 90 30 0 1 0 31 Ex. 2 20 0.33 8 90 30 0 0 1 32 Ex. 2 20 0.410 10 90 31 0 1 0 33 Ex. 2 20 0.36 15 90 28 0 341 Ex. 2 30 0.27 8 150 34l 0 1 0 Ex. 2 30 0.27 10 200 413 0 1 1 36 Ex. 2 30 0.26 15 200 31 0 0 0 (ru co 0
«RA
-8a- -22- Example 3 Phosphorylation of Advanced Epoxy Resin, EEW 900, with 1 phr H 3 P04 (as 110 Percent Acid) in Ethylene Glycol Monobutyl Ether Percent Solids) A solid bisphenol A based epoxy resin having an EEW of 900 available from The Dow Chemical Company as
D.E.R.
T 664 was phosphorylated by the procedure of Example 1. Coatings were prepared and tested as described in Example 1. The results are given in Table COMPARATIVE EXPERIMENT C The procedure of Comparative Experiment A was used to formulate, coat and test a composition with the solid epoxy resin having an EEW of 900 rather than the resin having an EEW of 1675. The results are given in Table III.
t t isi 37,261-F -22-
C:
I
‘A
TABLE III SAM- X- DRY MEK AUTOCLAVE PE RSN LINKER FILM BAKE DB. WEDGEBEND
INCH-LB
PLO RSI BTL THICK. TIME DUL. LOSS, mm REVERSE N.75108 MILS RUSBLUSH ADHESION IMPACT 37 C.E. C* 10 0.15 8 2 100 0 0 1 38 C.E. C* 10 0.21 10 2 100 0 0 1 39 C.E. C* 10 0.17 15 2 100 0 0 1 C.E. C* 20 0.18 8 2 35 0 0 1 ’41 C.E. C* 20 .0.17 10 2 27 0 0 0 42 C.E. C* 20 0.18 15 2 42 0 0 0 ’43 C.E. C* 30 0.13 8 14 60 0 0 .0 ’44 C.E. C* 30 0.15 10 ‘4 26 0 0 1 C.E. C* 30 0.15 15 5 214 0 0 1 *Not an example of the invention.
-y
A
a 0 *a a S. S TABLE III (Continued) SAM- X- DRY AUTOCLAVE PE RSN LINKER FILM BAKE MEK WEDGEBEND INCH-LB NLO RSI BTL THICK. TIME DR LOSS, mm REVERSE O.75108 MILS BLUSH ADHESION IMPACT ’46 Ex. 3 100.20 8 28 0 0 1 147 Ex. 3 10 0.23 10 10 141 0 0 1 418 Ex. 3 10 0.20 15 10 35 0 0 0 49 Ex. 3 20 0.20 8 20 38 0 0 0 Ex. 3 20 0.19 10 20 50 0 0 1 51 Ex. 3 20 0.20 15 10 144 0 0 0 52 Ex. 3 30 0.19 8 30 70 0 0 0 53 Ex. 3 30 0.16 10 30 147 0 0 1 5’4 Ex. 3 30 0.18 15 0 43 0 0 .1
N
0 1
U
at 37,261-F -11- Examole 4 Phosphorylation of Advanced Aromatic-Aliphatic Hybrid Epoxy Resin, EEW 1839, with 1 phr H 3 PO4 (as 110 Percent Acid) in Ethylene Glycol Monobutyl Ether Percent Solids) An advanced aromatic/aliphatic hybrid epoxy resin having an EEW of 1891, 95 grams, prepared from a blend of 50 wt. percent bisphenol A based liquid epoxy resin having an EEW of 180 and 50 wt. percent of an aromatic/aliphatic hybrid epoxy resin (diglycidyl ether of dipropc:
