AU4813999A – Electric component
– Google Patents
AU4813999A – Electric component
– Google Patents
Electric component
Info
Publication number
AU4813999A
AU4813999A
AU48139/99A
AU4813999A
AU4813999A
AU 4813999 A
AU4813999 A
AU 4813999A
AU 48139/99 A
AU48139/99 A
AU 48139/99A
AU 4813999 A
AU4813999 A
AU 4813999A
AU 4813999 A
AU4813999 A
AU 4813999A
Authority
AU
Australia
Prior art keywords
electric component
electric
component
Prior art date
1998-06-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU48139/99A
Inventor
Leif Bergstedt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1998-06-15
Filing date
1999-06-15
Publication date
2000-01-05
1999-06-15
Application filed by Telefonaktiebolaget LM Ericsson AB
filed
Critical
Telefonaktiebolaget LM Ericsson AB
2000-01-05
Publication of AU4813999A
publication
Critical
patent/AU4813999A/en
Status
Abandoned
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/46—Manufacturing multilayer circuits
H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/01—Dielectrics
H05K2201/0137—Materials
H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/01—Dielectrics
H05K2201/0183—Dielectric layers
H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/01—Dielectrics
H05K2201/0183—Dielectric layers
H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/03—Conductive materials
H05K2201/0332—Structure of the conductor
H05K2201/0364—Conductor shape
H05K2201/0367—Metallic bump or raised conductor not used as solder bump
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09209—Shape and layout details of conductors
H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 – H05K2201/095
H05K2201/09672—Superposed layout, i.e. in different planes
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
AU48139/99A
1998-06-15
1999-06-15
Electric component
Abandoned
AU4813999A
(en)
Applications Claiming Priority (3)
Application Number
Priority Date
Filing Date
Title
SE9802157A
SE513875C2
(en)
1998-06-15
1998-06-15
Electrical component and a multilayer circuit board
SE9802157
1998-06-15
PCT/SE1999/001063
WO1999066518A1
(en)
1998-06-15
1999-06-15
Electric component
Publications (1)
Publication Number
Publication Date
AU4813999A
true
AU4813999A
(en)
2000-01-05
Family
ID=20411738
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU48139/99A
Abandoned
AU4813999A
(en)
1998-06-15
1999-06-15
Electric component
Country Status (6)
Country
Link
US
(1)
US6421225B2
(en)
EP
(1)
EP1095385B1
(en)
AU
(1)
AU4813999A
(en)
DE
(1)
DE69926896T2
(en)
SE
(1)
SE513875C2
(en)
WO
(1)
WO1999066518A1
(en)
Families Citing this family (18)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP1990832A3
(en)
*
2000-02-25
2010-09-29
Ibiden Co., Ltd.
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
KR20030060898A
(en)
*
2000-09-25
2003-07-16
이비덴 가부시키가이샤
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
US7038143B2
(en)
*
2002-05-16
2006-05-02
Mitsubishi Denki Kabushiki Kaisha
Wiring board, fabrication method of wiring board, and semiconductor device
US6987307B2
(en)
*
2002-06-26
2006-01-17
Georgia Tech Research Corporation
Stand-alone organic-based passive devices
US6900708B2
(en)
*
2002-06-26
2005-05-31
Georgia Tech Research Corporation
Integrated passive devices fabricated utilizing multi-layer, organic laminates
US7260890B2
(en)
*
2002-06-26
2007-08-28
Georgia Tech Research Corporation
Methods for fabricating three-dimensional all organic interconnect structures
US7489914B2
(en)
*
2003-03-28
2009-02-10
Georgia Tech Research Corporation
Multi-band RF transceiver with passive reuse in organic substrates
US7054599B2
(en)
*
2003-05-08
2006-05-30
Lockheed Martin Corporation
High density interconnect structure for use on software defined radio
TWI314745B
(en)
*
2004-02-02
2009-09-11
Ind Tech Res Inst
Method and apparatus of non-symmetrical electrode of build-in capacitor
US8345433B2
(en)
*
2004-07-08
2013-01-01
Avx Corporation
Heterogeneous organic laminate stack ups for high frequency applications
US20060011376A1
(en)
*
2004-07-16
2006-01-19
General Electric Company
Multi-axial electrically conductive cable with multi-layered core and method of manufacture and use
JP2007142109A
(en)
*
2005-11-17
2007-06-07
Tdk Corp
Electronic part
US7439840B2
(en)
2006-06-27
2008-10-21
Jacket Micro Devices, Inc.
Methods and apparatuses for high-performing multi-layer inductors
US7808434B2
(en)
*
2006-08-09
2010-10-05
Avx Corporation
Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7989895B2
(en)
2006-11-15
2011-08-02
Avx Corporation
Integration using package stacking with multi-layer organic substrates
US8325461B2
(en)
*
2008-08-08
2012-12-04
Hamilton Sundstrand Corporation
Printed wiring board feed-through capacitor
US10372213B2
(en)
*
2016-09-20
2019-08-06
Facebook Technologies, Llc
Composite ribbon in a virtual reality device
US10993333B2
(en)
*
2017-07-15
2021-04-27
Sanmina Corporation
Methods of manufacturing ultra thin dielectric printed circuit boards with thin laminates
Family Cites Families (15)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
NL267988A
(en)
*
1960-08-15
1900-01-01
US3886415A
(en)
*
1968-04-01
1975-05-27
Itek Corp
Capacitor with photo-conductive dielectric
US3806775A
(en)
*
1971-10-19
1974-04-23
Du Pont
Polyolefin capacitor construction
US3778689A
(en)
*
1972-05-22
1973-12-11
Hewlett Packard Co
Thin film capacitors and method for manufacture
JPS6040383B2
(en)
*
1978-07-05
1985-09-10
東レ株式会社
Polypropylene composite biaxially stretched film
DE2851557C2
(en)
1978-11-29
1982-04-01
Hoechst Ag, 6000 Frankfurt
Biaxially stretched polypropylene composite film for use as an electrical insulating film
JPS60214941A
(en)
*
1984-04-10
1985-10-28
株式会社 潤工社
Printed substrate
US5065253A
(en)
1987-12-25
1991-11-12
Pioneer Electronic Corporation
Disk player with disk tilt or pickup position responsive noise reduction
US5065284A
(en)
1988-08-01
1991-11-12
Rogers Corporation
Multilayer printed wiring board
JP3019541B2
(en)
*
1990-11-22
2000-03-13
株式会社村田製作所
Wiring board with built-in capacitor and method of manufacturing the same
FR2684333B1
(en)
1991-12-03
1999-07-16
Bollore Technologies
TWO-STRETCH TWO-LAYER PLASTIC FILM.
US5800575A
(en)
*
1992-04-06
1998-09-01
Zycon Corporation
In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5625528A
(en)
1992-10-21
1997-04-29
Devoe; Daniel F.
Monolithic, buried-substrate, ceramic multiple capacitors isolated, one to the next, by dual-dielectric-constant, three-layer-laminate isolation layers
US5625655A
(en)
1994-07-29
1997-04-29
Combustion Engineering, Inc.
Fuel transfer tube quick operating remote closure device
US5796587A
(en)
1996-06-12
1998-08-18
International Business Machines Corporation
Printed circut board with embedded decoupling capacitance and method for producing same
1998
1998-06-15
SE
SE9802157A
patent/SE513875C2/en
unknown
1999
1999-06-15
DE
DE69926896T
patent/DE69926896T2/en
not_active
Expired – Lifetime
1999-06-15
US
US09/333,880
patent/US6421225B2/en
not_active
Expired – Lifetime
1999-06-15
AU
AU48139/99A
patent/AU4813999A/en
not_active
Abandoned
1999-06-15
EP
EP99931703A
patent/EP1095385B1/en
not_active
Expired – Lifetime
1999-06-15
WO
PCT/SE1999/001063
patent/WO1999066518A1/en
active
IP Right Grant
Also Published As
Publication number
Publication date
US6421225B2
(en)
2002-07-16
DE69926896D1
(en)
2005-09-29
EP1095385A1
(en)
2001-05-02
WO1999066518A1
(en)
1999-12-23
SE513875C2
(en)
2000-11-20
DE69926896T2
(en)
2006-03-30
SE9802157L
(en)
1999-12-16
EP1095385B1
(en)
2005-08-24
SE9802157D0
(en)
1998-06-15
US20010011606A1
(en)
2001-08-09
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Legal Events
Date
Code
Title
Description
2001-03-08
MK6
Application lapsed section 142(2)(f)/reg. 8.3(3) – pct applic. not entering national phase
