AU512805B2

AU512805B2 – Control ofan electroless copper plating bath
– Google Patents

AU512805B2 – Control ofan electroless copper plating bath
– Google Patents
Control ofan electroless copper plating bath

Info

Publication number
AU512805B2

AU512805B2
AU30760/77A
AU3076077A
AU512805B2
AU 512805 B2
AU512805 B2
AU 512805B2
AU 30760/77 A
AU30760/77 A
AU 30760/77A
AU 3076077 A
AU3076077 A
AU 3076077A
AU 512805 B2
AU512805 B2
AU 512805B2
Authority
AU
Australia
Prior art keywords
plating bath
copper plating
electroless copper
ofan
control
Prior art date
1976-11-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
AU30760/77A
Other versions

AU3076077A
(en

Inventor
R. J. Karas J. P. and Funk C. R Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Technologies Corp

Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1976-11-22
Filing date
1977-11-18
Publication date
1980-10-30

1977-11-18
Application filed by Kollmorgen Technologies Corp
filed
Critical
Kollmorgen Technologies Corp

1979-05-24
Publication of AU3076077A
publication
Critical
patent/AU3076077A/en

1980-10-30
Application granted
granted
Critical

1980-10-30
Publication of AU512805B2
publication
Critical
patent/AU512805B2/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

C—CHEMISTRY; METALLURGY

C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL

C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL

C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating

C23C18/1601—Process or apparatus

C23C18/1633—Process of electroless plating

C23C18/1675—Process conditions

C—CHEMISTRY; METALLURGY

C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL

C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL

C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating

C23C18/1601—Process or apparatus

C23C18/1619—Apparatus for electroless plating

C—CHEMISTRY; METALLURGY

C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL

C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL

C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating

C23C18/1601—Process or apparatus

C23C18/1633—Process of electroless plating

C23C18/1675—Process conditions

C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

AU30760/77A
1976-11-22
1977-11-18
Control ofan electroless copper plating bath

Expired

AU512805B2
(en)

Applications Claiming Priority (2)

Application Number
Priority Date
Filing Date
Title

US74411076A

1976-11-22
1976-11-22

USUS744,110

1976-11-22

Publications (2)

Publication Number
Publication Date

AU3076077A

AU3076077A
(en)

1979-05-24

AU512805B2
true

AU512805B2
(en)

1980-10-30

Family
ID=24991471
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

AU30760/77A
Expired

AU512805B2
(en)

1976-11-22
1977-11-18
Control ofan electroless copper plating bath

Country Status (14)

Country
Link

JP
(1)

JPS5365226A
(en)

AT
(1)

AT354213B
(en)

AU
(1)

AU512805B2
(en)

CA
(1)

CA1112523A
(en)

CH
(1)

CH637995A5
(en)

DE
(2)

DE2759952C2
(en)

ES
(1)

ES464266A1
(en)

FR
(1)

FR2371522A1
(en)

GB
(1)

GB1588758A
(en)

IL
(1)

IL53298A
(en)

IT
(1)

IT1116376B
(en)

NL
(1)

NL7712683A
(en)

SE
(1)

SE442410B
(en)

ZA
(1)

ZA775495B
(en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

JPS5953348B2
(en)

*

1977-12-16
1984-12-24
株式会社日立製作所

Automatic management method and device for main components of chemical copper plating solution

US4276323A
(en)

*

1979-12-21
1981-06-30
Hitachi, Ltd.
Process for controlling of chemical copper plating solution

US4707377A
(en)

*

1983-10-31
1987-11-17
International Business Machines Corporation
Copper plating

JPS6096767A
(en)

*

1983-10-31
1985-05-30
インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション
Copper plating process

JPS61110799A
(en)

*

1984-10-30
1986-05-29
インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン
Controller of metal plating cell

US4623554A
(en)

*

1985-03-08
1986-11-18
International Business Machines Corp.
Method for controlling plating rate in an electroless plating system

ES2039403T3
(en)

*

1986-10-31
1993-10-01
Amp-Akzo Corporation (A Delaware Corp.)

METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER.

US4908242A
(en)

*

1986-10-31
1990-03-13
Kollmorgen Corporation
Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

US4774101A
(en)

*

1986-12-10
1988-09-27
American Telephone And Telegraph Company, At&T Technologies, Inc.
Automated method for the analysis and control of the electroless metal plating solution

JPS63149278U
(en)

*

1987-03-19
1988-09-30

DE3718584A1
(en)

*

1987-06-03
1988-12-15
Norddeutsche Affinerie

METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE

US4842886A
(en)

*

1987-11-04
1989-06-27
International Business Machines Corporation
Method for electroless plating

AU3304389A
(en)

*

1988-04-29
1989-11-02
Kollmorgen Corporation
Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

GB2225026A
(en)

*

1988-11-22
1990-05-23
American Chem & Refining Co
Electroless gold plating composition

JP2005206931A
(en)

2003-12-26
2005-08-04
Sumitomo Electric Ind Ltd
Method for producing metal powder

JP5116068B2
(en)

*

2004-09-07
2013-01-09
Jx日鉱日石金属株式会社

Method for stabilizing electroless gold plating solution

Family Cites Families (3)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US3375178A
(en)

*

1964-05-28
1968-03-26
Continental Oil Co
Method of confirming the occurrence of plating in electroless nickel-plating

FR1522048A
(en)

*

1966-05-06
1968-04-19
Photocircuits Corp

Non-galvanic deposit of metals

JPS5921386B2
(en)

*

1976-04-13
1984-05-19
株式会社東芝

Automatic plating speed control method for electroless plating

1977

1977-09-13
ZA
ZA00775495A
patent/ZA775495B/en
unknown

1977-11-03
IL
IL53298A
patent/IL53298A/en
unknown

1977-11-11
DE
DE2759952A
patent/DE2759952C2/en
not_active
Expired

1977-11-11
DE
DE19772751104
patent/DE2751104A1/en
not_active
Ceased

1977-11-17
NL
NL7712683A
patent/NL7712683A/en
not_active
Application Discontinuation

1977-11-18
AT
AT827777A
patent/AT354213B/en
not_active
IP Right Cessation

1977-11-18
ES
ES464266A
patent/ES464266A1/en
not_active
Expired

1977-11-18
CA
CA291,214A
patent/CA1112523A/en
not_active
Expired

1977-11-18
AU
AU30760/77A
patent/AU512805B2/en
not_active
Expired

1977-11-21
CH
CH1419677A
patent/CH637995A5/en
not_active
IP Right Cessation

1977-11-21
GB
GB48323/77A
patent/GB1588758A/en
not_active
Expired

1977-11-22
JP
JP14147477A
patent/JPS5365226A/en
active
Granted

1977-11-22
IT
IT51901/77A
patent/IT1116376B/en
active

1977-11-22
FR
FR7734995A
patent/FR2371522A1/en
active
Granted

1977-11-22
SE
SE7713192A
patent/SE442410B/en
not_active
IP Right Cessation

Also Published As

Publication number
Publication date

CA1112523A
(en)

1981-11-17

ZA775495B
(en)

1978-07-26

FR2371522A1
(en)

1978-06-16

IT1116376B
(en)

1986-02-10

AT354213B
(en)

1979-12-27

IL53298A0
(en)

1978-01-31

FR2371522B1
(en)

1980-02-15

NL7712683A
(en)

1978-05-24

DE2751104A1
(en)

1978-05-24

JPS5365226A
(en)

1978-06-10

ES464266A1
(en)

1978-08-01

IL53298A
(en)

1981-02-27

AU3076077A
(en)

1979-05-24

CH637995A5
(en)

1983-08-31

SE442410B
(en)

1985-12-23

DE2759952C2
(en)

1984-03-08

SE7713192L
(en)

1978-05-23

JPS5753857B2
(en)

1982-11-15

ATA827777A
(en)

1979-05-15

GB1588758A
(en)

1981-04-29

Similar Documents

Publication
Publication Date
Title

DE2964079D1
(en)

1982-12-30

An electroless copper plating process

JPS51149134A
(en)

1976-12-21

Nonncyanideeseries silver plating bath

AU512805B2
(en)

1980-10-30

Control ofan electroless copper plating bath

JPS5464025A
(en)

1979-05-23

Acidic copper plating bath

DE3066952D1
(en)

1984-04-19

Electroless copper plating solution

AU509685B2
(en)

1980-05-22

Electroless Copper Plating

JPS5418875A
(en)

1979-02-13

Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate

AU501210B2
(en)

1979-06-14

Electroless copper plating bath

JPS5370931A
(en)

1978-06-23

Nonnelectrolytic copper plating method

GB1547028A
(en)

1979-06-06

Electroless gold plating baths

AU511275B2
(en)

1980-08-07

Tin electroplating bath

AU506628B2
(en)

1980-01-17

Electroless plating

GB2004914B
(en)

1982-03-31

Palladium plating baths

JPS5448646A
(en)

1979-04-17

Copper electroplating

JPS52106331A
(en)

1977-09-06

Plating bath

ZA762314B
(en)

1977-10-26

Electroless plating substrates

JPS5217334A
(en)

1977-02-09

Electroless copper plating solution

JPS51135836A
(en)

1976-11-25

Electroless copper plating solusion

ZA77431B
(en)

1977-12-28

Electroless copper plating

AU509072B2
(en)

1980-04-17

Electroless copper plating solution

JPS53142328A
(en)

1978-12-12

Solution for nonnelectrolytic copper plating

GB1555434A
(en)

1979-11-07

Electroless copper plating solutions

JPS5285935A
(en)

1977-07-16

Peeling solution for copper plating

JPS52152831A
(en)

1977-12-19

Substitution copper plating solution

JPS5288227A
(en)

1977-07-23

Chemical copper plating solution

Download PDF in English

None