GB1064099A – Improvements in or relating to apparatus comprising a semiconductor cirucuit element
– Google Patents
GB1064099A – Improvements in or relating to apparatus comprising a semiconductor cirucuit element
– Google Patents
Improvements in or relating to apparatus comprising a semiconductor cirucuit element
Info
Publication number
GB1064099A
GB1064099A
GB1364564A
GB1364564A
GB1064099A
GB 1064099 A
GB1064099 A
GB 1064099A
GB 1364564 A
GB1364564 A
GB 1364564A
GB 1364564 A
GB1364564 A
GB 1364564A
GB 1064099 A
GB1064099 A
GB 1064099A
Authority
GB
United Kingdom
Prior art keywords
terminal
pressure member
cooling body
bolt
semi
Prior art date
1963-04-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1364564A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1963-04-05
Filing date
1964-04-02
Publication date
1967-04-05
1964-04-02
Application filed by Philips Electronic and Associated Industries Ltd
filed
Critical
Philips Electronic and Associated Industries Ltd
1967-04-05
Publication of GB1064099A
publication
Critical
patent/GB1064099A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
1,064,099. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. April 2, 1964 [April 5, 1963], No. 13645/64. Heading H1K. Part of a terminal or an insulator carrying a terminal is clamped between a cooling body and a pressure member, the clamping means also holding the metal envelope of a semi-conductor device to the body. In the Fig. 1 arrangement the envelope 6 is bolted to finned cooling body 6 and clamps pressure member 7 over the head of terminal bolt 12 and the base of insulating terminal support 14. Rotation of the bolt and support is prevented by engagement of the bolt head with mating recess 18 and of the support with the edges 8 of the pressure member. Heat transfer to the fins is facilitated if the base of the envelope has a raised portion about the threaded stem which passes through hole 9 to directly engage the cooling body. In a further assembly, Fig. 3, the cooling body has lateral fins 32 and recesses for bolt head 35 and the enlarged base 41 of an insulating terminal post. The latter carries two terminals for the semiconductor controlled rectifier 32, Fig. 6 (not shown) and its rotation is prevented by threading its essentially semi-circular stem through a matching hole in the pressure member 34.
GB1364564A
1963-04-05
1964-04-02
Improvements in or relating to apparatus comprising a semiconductor cirucuit element
Expired
GB1064099A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
NL291220
1963-04-05
Publications (1)
Publication Number
Publication Date
GB1064099A
true
GB1064099A
(en)
1967-04-05
Family
ID=19754600
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB1364564A
Expired
GB1064099A
(en)
1963-04-05
1964-04-02
Improvements in or relating to apparatus comprising a semiconductor cirucuit element
Country Status (8)
Country
Link
AT
(1)
AT256179B
(en)
CH
(1)
CH431728A
(en)
DE
(1)
DE1489150A1
(en)
DK
(1)
DK114990B
(en)
ES
(1)
ES298258A1
(en)
GB
(1)
GB1064099A
(en)
NL
(1)
NL291220A
(en)
SE
(1)
SE315045B
(en)
0
NL
NL291220D
patent/NL291220A/xx
unknown
1964
1964-04-01
DE
DE19641489150
patent/DE1489150A1/en
active
Pending
1964-04-02
SE
SE406364A
patent/SE315045B/xx
unknown
1964-04-02
CH
CH419464A
patent/CH431728A/en
unknown
1964-04-02
GB
GB1364564A
patent/GB1064099A/en
not_active
Expired
1964-04-02
AT
AT286664A
patent/AT256179B/en
active
1964-04-02
DK
DK164164A
patent/DK114990B/en
unknown
1964-04-03
ES
ES0298258A
patent/ES298258A1/en
not_active
Expired
Also Published As
Publication number
Publication date
NL291220A
(en)
AT256179B
(en)
1967-08-10
DE1489150A1
(en)
1969-04-24
CH431728A
(en)
1967-03-15
SE315045B
(en)
1969-09-22
ES298258A1
(en)
1964-06-01
DK114990B
(en)
1969-08-25
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