GB1081376A

GB1081376A – Method of producing a semiconductor device
– Google Patents

GB1081376A – Method of producing a semiconductor device
– Google Patents
Method of producing a semiconductor device

Info

Publication number
GB1081376A

GB1081376A
GB45469/65A
GB4546965A
GB1081376A
GB 1081376 A
GB1081376 A
GB 1081376A
GB 45469/65 A
GB45469/65 A
GB 45469/65A
GB 4546965 A
GB4546965 A
GB 4546965A
GB 1081376 A
GB1081376 A
GB 1081376A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
mesa
oct
leave
Prior art date
1964-10-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
GB45469/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Telefunken Patentverwertungs GmbH

Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1964-10-31
Filing date
1965-10-27
Publication date
1967-08-31

1965-10-27
Application filed by Telefunken Patentverwertungs GmbH
filed
Critical
Telefunken Patentverwertungs GmbH

1967-08-31
Publication of GB1081376A
publication
Critical
patent/GB1081376A/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/0001—Technical content checked by a classifier

H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/02—Contacts, special

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/043—Dual dielectric

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/049—Equivalence and options

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S148/00—Metal treatment

Y10S148/145—Shaped junctions

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S438/00—Semiconductor device manufacturing: process

Y10S438/914—Doping

Y10S438/921—Nonselective diffusion

Abstract

1,081,376. Semi-conductor devices. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. Oct. 27, 1965 [Oct. 31, 1964], No. 45469/65. Heading H1K. Material is removed from a semi-conductor body to leave a mesa or similar upstanding portion, the sidefaces of which are then masked (e.g. by an oxide layer 9 as shown, Fig. 4) to leave uncovered the whole of the upper face 11 into which an impurity is diffused. A plane PN junction extending across the mesa or similar portion is thereby produced. Either before or after the diffusion process, the space left by the removal of semi-conductor material may be filled with insulating material 10, such as quartz glass, to provide a plane support for conducting paths 12.

GB45469/65A
1964-10-31
1965-10-27
Method of producing a semiconductor device

Expired

GB1081376A
(en)

Applications Claiming Priority (1)

Application Number
Priority Date
Filing Date
Title

DET0027337

1964-10-31

Publications (1)

Publication Number
Publication Date

GB1081376A
true

GB1081376A
(en)

1967-08-31

Family
ID=25999956
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

GB45469/65A
Expired

GB1081376A
(en)

1964-10-31
1965-10-27
Method of producing a semiconductor device

Country Status (5)

Country
Link

US
(1)

US3445303A
(en)

JP
(1)

JPS4917914B1
(en)

DE
(1)

DE1439737B2
(en)

FR
(1)

FR1451676A
(en)

GB
(1)

GB1081376A
(en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

NL153374B
(en)

*

1966-10-05
1977-05-16
Philips Nv

PROCESS FOR THE MANUFACTURE OF A SEMICONDUCTOR DEVICE PROVIDED WITH AN OXIDE LAYER AND SEMI-CONDUCTOR DEVICE MANUFACTURED ACCORDING TO THE PROCEDURE.

USRE28653E
(en)

*

1968-04-23
1975-12-16

Method of fabricating semiconductor devices

FR2156420A2
(en)

*

1971-04-08
1973-06-01
Thomson Csf
Beam-lead mesa diode prodn – for high reliability

IT963303B
(en)

*

1971-07-29
1974-01-10
Licentia Gmbh

SEMICONDUCTOR LASER

US3912556A
(en)

*

1971-10-27
1975-10-14
Motorola Inc
Method of fabricating a scannable light emitting diode array

US3878553A
(en)

*

1972-12-26
1975-04-15
Texas Instruments Inc
Interdigitated mesa beam lead diode and series array thereof

JPS5631898B2
(en)

*

1974-01-11
1981-07-24

GB1531238A
(en)

*

1975-01-09
1978-11-08
Standard Telephones Cables Ltd
Injection lasers

FR2328286A1
(en)

*

1975-10-14
1977-05-13
Thomson Csf

PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICES WITH VERY LOW THERMAL RESISTANCE, AND DEVICES OBTAINED BY THIS PROCEDURE

US4199384A
(en)

*

1979-01-29
1980-04-22
Rca Corporation
Method of making a planar semiconductor on insulating substrate device utilizing the deposition of a dual dielectric layer between device islands

JPH02125906A
(en)

*

1988-11-01
1990-05-14
Yoshiaki Tsunoda
Exhaust gas flow acceleration device for internal combustion engine

JPH06252400A
(en)

*

1992-12-28
1994-09-09
Sony Corp
Fabrication of lateral insulated gate type field effect transistor

Family Cites Families (4)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

NL125999C
(en)

*

1958-07-17

US3040218A
(en)

*

1959-03-10
1962-06-19
Hoffman Electronics Corp
Constant current devices

US3194699A
(en)

*

1961-11-13
1965-07-13
Transitron Electronic Corp
Method of making semiconductive devices

US3294600A
(en)

*

1962-11-26
1966-12-27
Nippon Electric Co
Method of manufacture of semiconductor elements

1964

1964-10-31
DE
DE19641439737
patent/DE1439737B2/en
not_active
Withdrawn

1965

1965-10-18
FR
FR35270A
patent/FR1451676A/en
not_active
Expired

1965-10-24
US
US504685A
patent/US3445303A/en
not_active
Expired – Lifetime

1965-10-27
GB
GB45469/65A
patent/GB1081376A/en
not_active
Expired

1965-11-01
JP
JP40066865A
patent/JPS4917914B1/ja
active
Pending

Also Published As

Publication number
Publication date

JPS4917914B1
(en)

1974-05-04

DE1439737A1
(en)

1969-06-26

US3445303A
(en)

1969-05-20

DE1439737B2
(en)

1970-05-06

FR1451676A
(en)

1966-01-07

Similar Documents

Publication
Publication Date
Title

GB945742A
(en)

GB1081376A
(en)

1967-08-31

Method of producing a semiconductor device

GB988903A
(en)

1965-04-14

Semiconductor devices and methods of making same

GB1148417A
(en)

1969-04-10

Integrated circuit structures including controlled rectifiers or their structural equivalents and method of making the same

GB1501483A
(en)

1978-02-15

Semiconductor device

GB1308764A
(en)

1973-03-07

Production of semiconductor components

GB1281769A
(en)

1972-07-12

Method for making transistor including gain determining step

GB1098760A
(en)

1968-01-10

Method of making semiconductor device

GB1074816A
(en)

1967-07-05

Improvements relating to semi-conductor devices

GB958247A
(en)

1964-05-21

Semiconductor devices and methods of fabricating same

JPS5216188A
(en)

1977-02-07

Semiconductor integrated circuit device and its producing method

JPS5235584A
(en)

1977-03-18

Manufacturing process of semiconductor device

GB1155723A
(en)

1969-06-18

Method of Making Semiconductor Structure

GB1030669A
(en)

1966-05-25

Semiconductor devices

JPS5317062A
(en)

1978-02-16

Production of semiconductor device

JPS5210081A
(en)

1977-01-26

Method for manufacturing semiconductor device

AU236258B2
(en)

1959-04-16

Method of producing pure silicon for electric semiconductor devices

GB1528029A
(en)

1978-10-11

Integrated injection logic semiconductor device

AU408507B2
(en)

1967-10-26

Method of diffusing an impurity into a semiconductor wafer

CA632690A
(en)

1961-12-12

Method of producing a silicon semiconductor device

AU415846B2
(en)

1969-02-27

Method of making junctions for semiconductor devices

AU4236658A
(en)

1959-04-16

Method of producing pure silicon for electric semiconductor devices

CA551310A
(en)

1958-01-07

Method for producing evaporation fused junction semiconductor devices

AU260387B2
(en)

1963-11-28

Method of producing electrical semiconductor devices

CA624777A
(en)

1961-08-01

Semiconductor etching method

Download PDF in English

None