GB1268317A – Improvements in or relating to the manufacture of conductor plates
– Google Patents
GB1268317A – Improvements in or relating to the manufacture of conductor plates
– Google Patents
Improvements in or relating to the manufacture of conductor plates
Info
Publication number
GB1268317A
GB1268317A
GB23120/70A
GB2312070A
GB1268317A
GB 1268317 A
GB1268317 A
GB 1268317A
GB 23120/70 A
GB23120/70 A
GB 23120/70A
GB 2312070 A
GB2312070 A
GB 2312070A
GB 1268317 A
GB1268317 A
GB 1268317A
Authority
GB
United Kingdom
Prior art keywords
layer
varnish
depositing
electrically conducting
holes
Prior art date
1969-05-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23120/70A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1969-05-14
Filing date
1970-05-13
Publication date
1972-03-29
1970-05-13
Application filed by Siemens AG
filed
Critical
Siemens AG
1972-03-29
Publication of GB1268317A
publication
Critical
patent/GB1268317A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
H05K3/42—Plated through-holes or plated via connections
H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/22—Secondary treatment of printed circuits
H05K3/28—Applying non-metallic protective coatings
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/01—Dielectrics
H05K2201/0137—Materials
H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09209—Shape and layout details of conductors
H05K2201/09372—Pads and lands
H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/05—Patterning and lithography; Masks; Details of resist
H05K2203/0502—Patterning and lithography
H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
H05K2203/1377—Protective layers
H05K2203/1383—Temporary protective insulating layer
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/3452—Solder masks
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/49155—Manufacturing circuit on or in base
Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Abstract
1,268,317. Printed circuits. SIEMENS A.G. 13 May, 1970 [14 May, 1969], No. 23120/70. Heading H1R. A process for the manufacture of a conductor plate comprises the steps of depositing a layer of solder-resistant varnish on to the surface of a conductor plate, drilling holes in the coated plate, depositing a layer of electrically conducting material electrolessly on to the varnish layer and on to the walls of the holes, depositing a further layer of varnish which is resistant to electrodeposition on to part of the conducting layer, so as to leave the walls of the holes and the areas immediately surrounding the holes exposed, depositing a metallic layer electrolytically on to the exposed areas, and removing the second varnish layer and the electrically conducting layer underlying it. A layer of etchresistant metal, such as tin, may be applied electrolytically to the metallic layer prior to the removal of the second varnish layer. The electrically conducting layer and the metallic layer may be made of copper. The second varnish layer may be removed by dissolving, and the electrically conducting material may beremoved by etching. The conductor plate may be in the form of a multi-layer printed circuit board.
GB23120/70A
1969-05-14
1970-05-13
Improvements in or relating to the manufacture of conductor plates
Expired
GB1268317A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
DE19691924775
DE1924775B2
(en)
1969-05-14
1969-05-14
METHOD OF MANUFACTURING A CIRCUIT BOARD
Publications (1)
Publication Number
Publication Date
GB1268317A
true
GB1268317A
(en)
1972-03-29
Family
ID=5734245
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB23120/70A
Expired
GB1268317A
(en)
1969-05-14
1970-05-13
Improvements in or relating to the manufacture of conductor plates
Country Status (9)
Country
Link
US
(1)
US3675318A
(en)
JP
(1)
JPS5026020B1
(en)
BE
(1)
BE750411A
(en)
CH
(1)
CH504148A
(en)
DE
(1)
DE1924775B2
(en)
FR
(1)
FR2047563A5
(en)
GB
(1)
GB1268317A
(en)
LU
(1)
LU60904A1
(en)
NL
(1)
NL7006717A
(en)
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2246243A
(en)
*
1990-05-18
1992-01-22
Nippon Cmk Kk
Printed wiring boards
Families Citing this family (18)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
JPS5217779U
(en)
*
1975-07-22
1977-02-08
JPS53121371U
(en)
*
1977-03-04
1978-09-27
DE2838982B2
(en)
*
1978-09-07
1980-09-18
Standard Elektrik Lorenz Ag, 7000 Stuttgart
Method of manufacturing multilevel printed circuit boards
DE2920940A1
(en)
*
1979-05-21
1980-12-04
Schering Ag
METHOD FOR PRODUCING PRINTED CIRCUITS
DE3137279C2
(en)
*
1981-09-18
1986-12-11
Wilhelm Ruf KG, 8000 München
Process for the production of multilayer printed circuit boards as well as multilayer printed circuit board produced by the process
JPS59181094A
(en)
*
1983-03-30
1984-10-15
日本メクトロン株式会社
Method of conducting between circuit boards via through hole
DE3427015A1
(en)
*
1984-07-21
1986-01-30
Nippon Mektron, Ltd., Tokio/Tokyo
METHOD FOR PRODUCING VIA CONTACTS IN PRINTED CIRCUITS
EP0227857B1
(en)
*
1985-12-30
1990-03-28
Ibm Deutschland Gmbh
Process for making printed circuits
US5142775A
(en)
*
1990-10-30
1992-09-01
International Business Machines Corporation
Bondable via
US5802714A
(en)
*
1994-07-19
1998-09-08
Hitachi, Ltd.
Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
WO1996015651A1
(en)
*
1994-11-09
1996-05-23
Blaupunkt-Werke Gmbh
Method of producing a feedthrough on a circuit board
US5509200A
(en)
*
1994-11-21
1996-04-23
International Business Machines Corporation
Method of making laminar stackable circuit board structure
US6349456B1
(en)
*
1998-12-31
2002-02-26
Motorola, Inc.
Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes
TWI286826B
(en)
*
2001-12-28
2007-09-11
Via Tech Inc
Semiconductor package substrate and process thereof
JP4772702B2
(en)
*
2007-01-11
2011-09-14
富士通株式会社
Printed circuit board, printed circuit board unit, and method for detecting amount of rise of conductor
US8104171B2
(en)
*
2008-08-27
2012-01-31
Advanced Semiconductor Engineering, Inc.
Method of fabricating multi-layered substrate
CN106455333A
(en)
*
2016-11-15
2017-02-22
清远市富盈电子有限公司
Manufacturing process of PCB metal covered edge plate with gong side and copper burr improved
CN110545634A
(en)
*
2019-08-29
2019-12-06
江苏上达电子有限公司
Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper
Family Cites Families (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3371249A
(en)
*
1962-03-19
1968-02-27
Sperry Rand Corp
Laminar circuit assmebly
US3334395A
(en)
*
1962-11-26
1967-08-08
Northrop Corp
Method of making a metal printed circuit board
1969
1969-05-14
DE
DE19691924775
patent/DE1924775B2/en
active
Pending
1970
1970-05-08
NL
NL7006717A
patent/NL7006717A/xx
unknown
1970-05-11
US
US35959A
patent/US3675318A/en
not_active
Expired – Lifetime
1970-05-11
CH
CH693770A
patent/CH504148A/en
not_active
IP Right Cessation
1970-05-11
FR
FR7016966A
patent/FR2047563A5/fr
not_active
Expired
1970-05-12
LU
LU60904D
patent/LU60904A1/xx
unknown
1970-05-13
GB
GB23120/70A
patent/GB1268317A/en
not_active
Expired
1970-05-14
JP
JP45040591A
patent/JPS5026020B1/ja
active
Pending
1970-05-14
BE
BE750411D
patent/BE750411A/en
unknown
Cited By (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2246243A
(en)
*
1990-05-18
1992-01-22
Nippon Cmk Kk
Printed wiring boards
GB2246243B
(en)
*
1990-05-18
1994-06-29
Nippon Cmk Kk
Printed wiring board and method of manufacturing same
Also Published As
Publication number
Publication date
DE1924775B2
(en)
1971-06-09
JPS5026020B1
(en)
1975-08-28
FR2047563A5
(en)
1971-03-12
LU60904A1
(en)
1970-07-16
US3675318A
(en)
1972-07-11
BE750411A
(en)
1970-11-16
DE1924775A1
(en)
1971-03-11
NL7006717A
(en)
1970-11-17
CH504148A
(en)
1971-02-28
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None