GB1289026A – – Google Patents
GB1289026A – – Google Patents
Info
Publication number
GB1289026A
GB1289026A
GB1289026DA
GB1289026A
GB 1289026 A
GB1289026 A
GB 1289026A
GB 1289026D A
GB1289026D A
GB 1289026DA
GB 1289026 A
GB1289026 A
GB 1289026A
Authority
GB
United Kingdom
Prior art keywords
tip
refractory material
soldering
leads
metallic layer
Prior art date
1969-09-02
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1969-09-02
Filing date
1970-08-18
Publication date
1972-09-13
1970-08-18
Application filed
filed
Critical
1972-09-13
Publication of GB1289026A
publication
Critical
patent/GB1289026A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
H01L21/67005—Apparatus not specifically provided for elsewhere
H01L21/67011—Apparatus for manufacture or treatment
H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
B—PERFORMING OPERATIONS; TRANSPORTING
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
B23K3/04—Heating appliances
B23K3/047—Heating appliances electric
B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/341—Surface mounted components
H05K3/3421—Leaded components
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/3494—Heating methods for reflowing of solder
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49121—Beam lead frame or beam lead device
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/49155—Manufacturing circuit on or in base
Abstract
1289026 Soldering INTERNATIONAL BUSINESS MACHINES CORP 18 Aug 1970 [2 Sept 1969] 39633/70 Heading B3R [Also in Division H5] A soldering tool, particularly for reflow soldering the leads 1 of an integrated circuit chip 2 to terminals 3 on a circuit board 5, has a tip 8 of refractory material which is electrically non- conductive and a heating element 7 comprising a metallic layer intimately bonded to and penetrating into the refractory material of the tip. The refractory material may be glass, ceramic or beryllium oxide and the metallic layer may be molybdenum-manganese or tungsten applied as a penetrating paste. The tip may hold the chip 2 mechanically or by vacuum and has locating slots 11 for the leads 1.
GB1289026D
1969-09-02
1970-08-18
Expired
GB1289026A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US85439669A
1969-09-02
1969-09-02
Publications (1)
Publication Number
Publication Date
GB1289026A
true
GB1289026A
(en)
1972-09-13
Family
ID=25318579
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB1289026D
Expired
GB1289026A
(en)
1969-09-02
1970-08-18
Country Status (4)
Country
Link
US
(1)
US3576969A
(en)
DE
(1)
DE2042024A1
(en)
FR
(1)
FR2060924A5
(en)
GB
(1)
GB1289026A
(en)
Families Citing this family (20)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3731866A
(en)
*
1971-01-04
1973-05-08
Cogar Corp
Apparatus for removing and replacing multi-pinned components mounted on circuit boards
US3786228A
(en)
*
1971-12-15
1974-01-15
Roesch K Inc
Electric soldering iron tip
US3765590A
(en)
*
1972-05-08
1973-10-16
Fairchild Camera Instr Co
Structure for simultaneously attaching a plurality of semiconductor dice to their respective package leads
FR2205800B1
(en)
*
1972-11-09
1976-08-20
Honeywell Bull Soc Ind
US4009973A
(en)
*
1975-08-21
1977-03-01
Applied Power Inc.
Seal for hydraulic pumps and motors
US4315128A
(en)
*
1978-04-07
1982-02-09
Kulicke And Soffa Industries Inc.
Electrically heated bonding tool for the manufacture of semiconductor devices
US4583676A
(en)
*
1982-05-03
1986-04-22
Motorola, Inc.
Method of wire bonding a semiconductor die and apparatus therefor
US4637542A
(en)
*
1982-09-22
1987-01-20
Control Data Corporation
Process for soldering and desoldering apertured leadless packages
US4518110A
(en)
*
1982-09-22
1985-05-21
Control Data Corporation
Device for soldering/desoldering apertured lendless packages
DE3722726A1
(en)
*
1987-07-09
1989-01-19
Productech Gmbh
HEATED STAMP
US4828162A
(en)
*
1988-02-29
1989-05-09
Hughes Aircraft Company
Moving jaw reflow soldering head
US4967058A
(en)
*
1988-04-13
1990-10-30
Kabushiki Kaisha Toshiba
Power heating member
US4835847A
(en)
*
1988-04-20
1989-06-06
International Business Machines Corp.
Method and apparatus for mounting a flexible film electronic device carrier on a substrate
US5010227A
(en)
*
1989-02-15
1991-04-23
Todd Thomas W
Soldering apparatus and method of using the same
JPH0669610B2
(en)
*
1989-03-14
1994-09-07
カシオ計算機株式会社
Heater chip and bonding method using the same
DE59008864D1
(en)
*
1990-07-13
1995-05-11
Siemens Ag
Ceramic soldering iron.
US5278393A
(en)
*
1992-06-29
1994-01-11
Henry Kim
Electrically heated desoldering unit having adjustable stop means preventing circuit board damage for desoldering electronic components having rows of leads
US5603857A
(en)
*
1995-02-24
1997-02-18
Assembly Technologies International, Inc.
Handheld electric heater for removing or replacing surface-mounted integrated circuits from a circuit board
US6288365B1
(en)
*
1999-05-18
2001-09-11
Mcammond Matthew J.
Soldering assembly
US10537031B2
(en)
2017-03-22
2020-01-14
Service Support Specialties, Inc.
Reflow soldering apparatus, system and method
Family Cites Families (8)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2474312A
(en)
*
1946-09-21
1949-06-28
Polychrome Corp
Stylus
US2606987A
(en)
*
1949-06-14
1952-08-12
Thomas W Winstead
Heat sealing element for thermo-plastic film
US3146692A
(en)
*
1959-06-11
1964-09-01
Roll A Grill Corp Of America
Direct-contact glass plate toaster
US3105136A
(en)
*
1960-02-02
1963-09-24
Ashenfard Samuel
Heat exchange system and heating element therefor
US3136878A
(en)
*
1960-06-23
1964-06-09
Itt
Soldering iron
US3230338A
(en)
*
1962-07-02
1966-01-18
Ibm
Selective heating apparatus
US3382564A
(en)
*
1965-09-27
1968-05-14
Gen Dynamics Corp
Soldering apparatus and method for microelectronic circuits
US3478191A
(en)
*
1967-01-23
1969-11-11
Sprague Electric Co
Thermal print head
1969
1969-09-02
US
US854396A
patent/US3576969A/en
not_active
Expired – Lifetime
1970
1970-08-10
FR
FR7032127A
patent/FR2060924A5/fr
not_active
Expired
1970-08-18
GB
GB1289026D
patent/GB1289026A/en
not_active
Expired
1970-08-25
DE
DE19702042024
patent/DE2042024A1/en
active
Pending
Also Published As
Publication number
Publication date
DE2042024A1
(en)
1971-03-04
FR2060924A5
(en)
1971-06-18
US3576969A
(en)
1971-05-04
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Legal Events
Date
Code
Title
Description
1973-01-24
PS
Patent sealed [section 19, patents act 1949]
1981-03-25
PCNP
Patent ceased through non-payment of renewal fee
