GB1447808A – Beam lead semiconductor device
– Google Patents
GB1447808A – Beam lead semiconductor device
– Google Patents
Beam lead semiconductor device
Info
Publication number
GB1447808A
GB1447808A
GB4133074A
GB4133074A
GB1447808A
GB 1447808 A
GB1447808 A
GB 1447808A
GB 4133074 A
GB4133074 A
GB 4133074A
GB 4133074 A
GB4133074 A
GB 4133074A
GB 1447808 A
GB1447808 A
GB 1447808A
Authority
GB
United Kingdom
Prior art keywords
header
leads
beam lead
semiconductor device
metal
Prior art date
1973-11-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4133074A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1973-11-21
Filing date
1974-09-23
Publication date
1976-09-02
1974-09-23
Application filed by Raytheon Co
filed
Critical
Raytheon Co
1976-09-02
Publication of GB1447808A
publication
Critical
patent/GB1447808A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01079—Gold [Au]
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49121—Beam lead frame or beam lead device
Abstract
1447808 Semi-conductor devices RAYTHEON CO 23 Sept 1974 [21 Nov 1973] 41330/74 Heading H1K A beam lead package comprises a metal header 10 having a surface 18 with an aperture 12 therein, and leads 14 embedded in insulation 16 so that the ends of the leads 14 are coplanar with the surface 18. The header 10 supports a transistor 22 whose beam leads such as 24, 28 are welded to the header 10 and the leads 14. The header 10 is hermetically sealed in a metal can 36. The insulator 16 may be formed by fusing glass powder or a glass preform in the header 10 and bonding it to a wire loop and the header 10 which have previously been oxidized. The leads 14 are formed by shearing off the wire loop at the surface 18 which is then lapped to a smooth finish. A plurality of apertures 12 may be provided, and the header may support a plurality of components.
GB4133074A
1973-11-21
1974-09-23
Beam lead semiconductor device
Expired
GB1447808A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US00418018A
US3857993A
(en)
1973-11-21
1973-11-21
Beam lead semiconductor package
Publications (1)
Publication Number
Publication Date
GB1447808A
true
GB1447808A
(en)
1976-09-02
Family
ID=23656332
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB4133074A
Expired
GB1447808A
(en)
1973-11-21
1974-09-23
Beam lead semiconductor device
Country Status (8)
Country
Link
US
(1)
US3857993A
(en)
JP
(1)
JPS5081781A
(en)
CA
(1)
CA999384A
(en)
CH
(1)
CH581390A5
(en)
DE
(1)
DE2454605C2
(en)
FR
(1)
FR2251915B1
(en)
GB
(1)
GB1447808A
(en)
SE
(1)
SE7413820L
(en)
Families Citing this family (13)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3918147A
(en)
*
1974-03-25
1975-11-11
Corning Glass Works
Hermetic enclosure for electronic component
US4099200A
(en)
*
1976-03-26
1978-07-04
Raytheon Company
Package for semiconductor beam lead devices
NL181963C
(en)
*
1979-06-26
1987-12-01
Philips Nv
SEMICONDUCTOR LASER DEVICE.
US4675626A
(en)
*
1985-11-27
1987-06-23
Rogers Corporation
Carrier assembly for mounting a rolled coplanar delay line
DE3732075A1
(en)
*
1987-09-23
1989-04-06
Siemens Ag
HERMETICALLY SEALED GLASS METAL HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
DE3822167A1
(en)
*
1988-06-30
1990-02-08
Liess Hans Dieter Prof Dr Ing
Light barrier
US5102029A
(en)
*
1990-06-22
1992-04-07
Watkins-Johnson Company
Microwave integrated circuit package to eliminate alumina substrate cracking and method
US6229088B1
(en)
*
1998-01-09
2001-05-08
Legacy Technologies, Inc.
Low profile electronic enclosure
US7211877B1
(en)
*
1999-09-13
2007-05-01
Vishay-Siliconix
Chip scale surface mount package for semiconductor device and process of fabricating the same
US6744124B1
(en)
*
1999-12-10
2004-06-01
Siliconix Incorporated
Semiconductor die package including cup-shaped leadframe
US7595547B1
(en)
2005-06-13
2009-09-29
Vishay-Siliconix
Semiconductor die package including cup-shaped leadframe
US6992251B1
(en)
*
2004-08-31
2006-01-31
Sung Jung Minute Industry Co., Ltd.
Rectification chip terminal structure
JPWO2008059693A1
(en)
*
2006-11-15
2010-02-25
株式会社大真空
Electronic component package
Family Cites Families (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3239596A
(en)
*
1963-02-25
1966-03-08
Sylvania Electric Prod
Support for electrical elements having separate conductive segments for connecting the elements to support leads
US3262022A
(en)
*
1964-02-13
1966-07-19
Gen Micro Electronics Inc
Packaged electronic device
US3405442A
(en)
*
1964-02-13
1968-10-15
Gen Micro Electronics Inc
Method of packaging microelectronic devices
US3486892A
(en)
*
1966-01-13
1969-12-30
Raytheon Co
Preferential etching technique
YU34342B
(en)
*
1969-08-11
1979-04-30
Inst Za Elektroniko In Vakuums
Socket for electronic components and micro-circuits
US3747829A
(en)
*
1971-12-13
1973-07-24
Raytheon Co
Semiconductor lead bonding machine
1973
1973-11-21
US
US00418018A
patent/US3857993A/en
not_active
Expired – Lifetime
1974
1974-09-13
CA
CA209,210A
patent/CA999384A/en
not_active
Expired
1974-09-23
GB
GB4133074A
patent/GB1447808A/en
not_active
Expired
1974-10-30
FR
FR7436263A
patent/FR2251915B1/fr
not_active
Expired
1974-11-04
SE
SE7413820A
patent/SE7413820L/xx
unknown
1974-11-18
DE
DE2454605A
patent/DE2454605C2/en
not_active
Expired
1974-11-21
CH
CH1551474A
patent/CH581390A5/xx
not_active
IP Right Cessation
1974-11-21
JP
JP49134161A
patent/JPS5081781A/ja
active
Pending
Also Published As
Publication number
Publication date
FR2251915A1
(en)
1975-06-13
DE2454605A1
(en)
1975-06-19
CA999384A
(en)
1976-11-02
CH581390A5
(en)
1976-10-29
DE2454605C2
(en)
1986-11-20
SE7413820L
(en)
1975-05-22
US3857993A
(en)
1974-12-31
FR2251915B1
(en)
1979-02-23
JPS5081781A
(en)
1975-07-02
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Legal Events
Date
Code
Title
Description
1977-01-13
PS
Patent sealed [section 19, patents act 1949]
1988-05-18
PCNP
Patent ceased through non-payment of renewal fee
