GB1479556A – Method for cleaning hole walls to be provided with a metal layer
– Google Patents
GB1479556A – Method for cleaning hole walls to be provided with a metal layer
– Google Patents
Method for cleaning hole walls to be provided with a metal layer
Info
Publication number
GB1479556A
GB1479556A
GB45878/75A
GB4587875A
GB1479556A
GB 1479556 A
GB1479556 A
GB 1479556A
GB 45878/75 A
GB45878/75 A
GB 45878/75A
GB 4587875 A
GB4587875 A
GB 4587875A
GB 1479556 A
GB1479556 A
GB 1479556A
Authority
GB
United Kingdom
Prior art keywords
hole walls
solution
weight loss
metallisation
permanganate solution
Prior art date
1974-11-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB45878/75A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1974-11-07
Filing date
1975-11-05
Publication date
1977-07-13
1975-11-05
Application filed by Kollmorgen Corp
filed
Critical
Kollmorgen Corp
1977-07-13
Publication of GB1479556A
publication
Critical
patent/GB1479556A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
C23C18/18—Pretreatment of the material to be coated
C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C18/22—Roughening, e.g. by etching
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
C08J7/12—Chemical modification
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/0011—Working of insulating substrates or insulating layers
H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Abstract
Perforated plastic printed circuit boards having metallised hole walls are produced. Before the metallisation, the hole walls must be freed from resin deposits produced during drilling of the holes. This is performed using alkaline permanganate solution. The solution has a pH-value of at least 13 and a temperature of between 35 and 70 DEG C. In trials, a weight loss was firstly established in connection with the action of such a solution, followed surprisingly by a weight increase and thereupon once again by a weight loss. The treatment of the hole walls with the permanganate solution is terminated before the occurrence of the second weight loss phase. With printed circuit boards which have printed conductors made from insulated wire and cut through by the perforation, the insulation of the wire ends present at the hole walls can be removed simultaneously by the permanganate solution. The exposed wire ends are firmly connected to the metallisation layer during metallisation of the hole walls.
GB45878/75A
1974-11-07
1975-11-05
Method for cleaning hole walls to be provided with a metal layer
Expired
GB1479556A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US52189074A
1974-11-07
1974-11-07
Publications (1)
Publication Number
Publication Date
GB1479556A
true
GB1479556A
(en)
1977-07-13
Family
ID=24078571
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB45878/75A
Expired
GB1479556A
(en)
1974-11-07
1975-11-05
Method for cleaning hole walls to be provided with a metal layer
Country Status (13)
Country
Link
JP
(1)
JPS595616B2
(en)
AT
(1)
AT346957B
(en)
AU
(1)
AU500570B2
(en)
CH
(1)
CH619823A5
(en)
DE
(1)
DE2550598C3
(en)
DK
(1)
DK154600C
(en)
ES
(1)
ES442440A1
(en)
FR
(1)
FR2290822A1
(en)
GB
(1)
GB1479556A
(en)
IT
(1)
IT1052168B
(en)
NL
(1)
NL180684C
(en)
SE
(1)
SE447045B
(en)
ZA
(1)
ZA756783B
(en)
Cited By (10)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4425380A
(en)
1982-11-19
1984-01-10
Kollmorgen Technologies Corporation
Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
DE3325133A1
(en)
*
1982-07-12
1984-01-12
Rogers Corp., 06263 Rogers, Conn.
MICROWAVE CIRCUIT BOARD AND METHOD FOR THEIR PRODUCTION
US4601783A
(en)
*
1985-05-31
1986-07-22
Morton Thiokol, Inc.
High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
US4601784A
(en)
*
1985-05-31
1986-07-22
Morton Thiokol, Inc.
Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
US4820548A
(en)
*
1984-06-07
1989-04-11
Enthone, Incorporated
Three step process for treating plastics with alkaline permanganate solutions
DE3806884C1
(en)
*
1988-03-03
1989-09-21
Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
Through-plated contact printed circuit and method for fabricating it
US4948630A
(en)
*
1984-06-07
1990-08-14
Enthone, Inc.
Three step process for treating plastics with alkaline permanganate solutions
US5032427A
(en)
*
1988-04-25
1991-07-16
Macdermid, Incorporated
Process for preparation printed circuit through-holes for metallization
US5213840A
(en)
*
1990-05-01
1993-05-25
Macdermid, Incorporated
Method for improving adhesion to polymide surfaces
EP2760260A4
(en)
*
2011-09-22
2015-08-19
Uyemura C & Co Ltd
Desmear solution and desmear method
Families Citing this family (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE3110415C2
(en)
*
1981-03-18
1983-08-18
Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern
Process for the manufacture of printed circuit boards
US4515829A
(en)
*
1983-10-14
1985-05-07
Shipley Company Inc.
Through-hole plating
JPS60154416U
(en)
*
1984-03-23
1985-10-15
三国 慶耿
Snowplow snow chute
AT1147U1
(en)
*
1996-01-10
1996-11-25
Grundmann Schliesstechnik
LOCKING CYLINDER AND OR FLAT KEY
WO1999011847A1
(en)
1997-09-01
1999-03-11
Maschinenfabrik Rieter Ag
Regulated drawing frame
Family Cites Families (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3276106A
(en)
*
1963-07-01
1966-10-04
North American Aviation Inc
Preparation of multilayer boards for electrical connections between layers
US3276927A
(en)
*
1963-07-01
1966-10-04
North American Aviation Inc
Smoothing of mechanically drilled holes
US3652351A
(en)
*
1970-05-13
1972-03-28
Carus Corp
Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions
GB1401600A
(en)
*
1972-12-13
1975-07-16
Kollmorgen Corp
Composition and process for the activation of resinous bodies for adherent metallization
DE2316720A1
(en)
*
1973-04-04
1974-10-31
Licentia Gmbh
Removal of colophony residues from electrical appts. – by agent contg. alcohols, hydrocarbon and wetting agent
1975
1975-10-28
ZA
ZA00756783A
patent/ZA756783B/en
unknown
1975-10-28
DK
DK485175A
patent/DK154600C/en
not_active
IP Right Cessation
1975-11-04
SE
SE7512335A
patent/SE447045B/en
not_active
IP Right Cessation
1975-11-05
GB
GB45878/75A
patent/GB1479556A/en
not_active
Expired
1975-11-05
AU
AU86328/75A
patent/AU500570B2/en
not_active
Expired
1975-11-05
NL
NLAANVRAGE7512992,A
patent/NL180684C/en
not_active
IP Right Cessation
1975-11-05
JP
JP50133932A
patent/JPS595616B2/en
not_active
Expired
1975-11-06
CH
CH1435375A
patent/CH619823A5/en
not_active
IP Right Cessation
1975-11-06
AT
AT845775A
patent/AT346957B/en
not_active
IP Right Cessation
1975-11-07
ES
ES442440A
patent/ES442440A1/en
not_active
Expired
1975-11-07
FR
FR7534080A
patent/FR2290822A1/en
active
Granted
1975-11-07
DE
DE752550598A
patent/DE2550598C3/en
not_active
Expired
1975-11-07
IT
IT52113/75A
patent/IT1052168B/en
active
Cited By (11)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE3325133A1
(en)
*
1982-07-12
1984-01-12
Rogers Corp., 06263 Rogers, Conn.
MICROWAVE CIRCUIT BOARD AND METHOD FOR THEIR PRODUCTION
US4425380A
(en)
1982-11-19
1984-01-10
Kollmorgen Technologies Corporation
Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
DE3341431A1
(en)
*
1982-11-19
1984-05-24
Kollmorgen Technologies Corp., Dallas, Tex.
METHOD FOR CLEANING HOLES IN PRINTED CIRCUIT BOARDS WITH PERMANGANIC AND BASIC SOLUTIONS
US4820548A
(en)
*
1984-06-07
1989-04-11
Enthone, Incorporated
Three step process for treating plastics with alkaline permanganate solutions
US4948630A
(en)
*
1984-06-07
1990-08-14
Enthone, Inc.
Three step process for treating plastics with alkaline permanganate solutions
US4601783A
(en)
*
1985-05-31
1986-07-22
Morton Thiokol, Inc.
High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
US4601784A
(en)
*
1985-05-31
1986-07-22
Morton Thiokol, Inc.
Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
DE3806884C1
(en)
*
1988-03-03
1989-09-21
Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
Through-plated contact printed circuit and method for fabricating it
US5032427A
(en)
*
1988-04-25
1991-07-16
Macdermid, Incorporated
Process for preparation printed circuit through-holes for metallization
US5213840A
(en)
*
1990-05-01
1993-05-25
Macdermid, Incorporated
Method for improving adhesion to polymide surfaces
EP2760260A4
(en)
*
2011-09-22
2015-08-19
Uyemura C & Co Ltd
Desmear solution and desmear method
Also Published As
Publication number
Publication date
JPS595616B2
(en)
1984-02-06
JPS5170268A
(en)
1976-06-17
ZA756783B
(en)
1976-10-27
SE447045B
(en)
1986-10-20
FR2290822A1
(en)
1976-06-04
CH619823A5
(en)
1980-10-15
FR2290822B1
(en)
1978-05-12
NL180684C
(en)
1987-04-01
ES442440A1
(en)
1977-04-01
DK154600B
(en)
1988-11-28
AT346957B
(en)
1978-12-11
IT1052168B
(en)
1981-06-20
AU8632875A
(en)
1977-05-12
AU500570B2
(en)
1979-05-24
DE2550598C3
(en)
1979-03-08
DE2550598B2
(en)
1978-07-13
NL7512992A
(en)
1976-05-11
DK485175A
(en)
1976-05-08
NL180684B
(en)
1986-11-03
SE7512335L
(en)
1976-05-08
ATA845775A
(en)
1978-04-15
DE2550598A1
(en)
1976-05-13
DK154600C
(en)
1989-04-17
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Legal Events
Date
Code
Title
Description
1977-11-23
PS
Patent sealed
1992-02-26
732
Registration of transactions, instruments or events in the register (sect. 32/1977)
1995-12-06
PE20
Patent expired after termination of 20 years
Effective date:
19951104
