GB1555227A – Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
– Google Patents
GB1555227A – Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
– Google Patents
Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
Info
Publication number
GB1555227A
GB1555227A
GB23167/76A
GB2316776A
GB1555227A
GB 1555227 A
GB1555227 A
GB 1555227A
GB 23167/76 A
GB23167/76 A
GB 23167/76A
GB 2316776 A
GB2316776 A
GB 2316776A
GB 1555227 A
GB1555227 A
GB 1555227A
Authority
GB
United Kingdom
Prior art keywords
mounting
dual
printed circuit
circuit boards
socket contacts
Prior art date
1975-06-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23167/76A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Augat Inc
Original Assignee
Augat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1975-06-30
Filing date
1976-06-04
Publication date
1979-11-07
1976-06-04
Application filed by Augat Inc
filed
Critical
Augat Inc
1979-11-07
Publication of GB1555227A
publication
Critical
patent/GB1555227A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K13/04—Mounting of components, e.g. of leadless components
H05K13/043—Feeding one by one by other means than belts
H05K13/0439—Feeding one by one by other means than belts incorporating means for treating the terminal leads only before insertion
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K13/02—Feeding of components
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K7/00—Constructional details common to different types of electric apparatus
H05K7/02—Arrangements of circuit components or wiring on supporting structure
H05K7/10—Plug-in assemblages of components, e.g. IC sockets
H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
GB23167/76A
1975-06-30
1976-06-04
Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
Expired
GB1555227A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US05/591,413
US3983623A
(en)
1975-06-30
1975-06-30
Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
Publications (1)
Publication Number
Publication Date
GB1555227A
true
GB1555227A
(en)
1979-11-07
Family
ID=24366389
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB23167/76A
Expired
GB1555227A
(en)
1975-06-30
1976-06-04
Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
Country Status (9)
Country
Link
US
(1)
US3983623A
(en)
JP
(1)
JPS525488A
(en)
BE
(1)
BE843588A
(en)
CA
(1)
CA1063218A
(en)
DE
(1)
DE2626274A1
(en)
FR
(1)
FR2316765A1
(en)
GB
(1)
GB1555227A
(en)
NL
(1)
NL7607186A
(en)
SE
(1)
SE426629B
(en)
Families Citing this family (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
JPS58197686A
(en)
*
1982-05-11
1983-11-17
山一電機工業株式会社
Method of aligning and implanting sleeve terminal
JPS59883A
(en)
*
1982-06-28
1984-01-06
山一電機工業株式会社
Method of arranging and implanting sleeve terminal
JPH0267800A
(en)
*
1988-09-02
1990-03-07
Tdk Corp
Method and device for automatically inserting electronic parts with lead wire
US6563299B1
(en)
*
2000-08-30
2003-05-13
Micron Technology, Inc.
Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
Family Cites Families (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2937358A
(en)
*
1955-04-18
1960-05-17
Gen Electric
Printed circuit sandwiched in glass
US3611562A
(en)
*
1969-12-05
1971-10-12
Thomas & Betts Corp
Method of attaching microcircuit packs to a panel board
US3834015A
(en)
*
1973-01-29
1974-09-10
Philco Ford Corp
Method of forming electrical connections
1975
1975-06-30
US
US05/591,413
patent/US3983623A/en
not_active
Expired – Lifetime
1976
1976-05-21
CA
CA253,167A
patent/CA1063218A/en
not_active
Expired
1976-06-04
GB
GB23167/76A
patent/GB1555227A/en
not_active
Expired
1976-06-11
DE
DE19762626274
patent/DE2626274A1/en
not_active
Withdrawn
1976-06-24
JP
JP51073899A
patent/JPS525488A/en
active
Pending
1976-06-29
SE
SE7607399A
patent/SE426629B/en
unknown
1976-06-30
NL
NL7607186A
patent/NL7607186A/en
not_active
Application Discontinuation
1976-06-30
FR
FR7619979A
patent/FR2316765A1/en
active
Granted
1976-06-30
BE
BE168463A
patent/BE843588A/en
not_active
IP Right Cessation
Also Published As
Publication number
Publication date
CA1063218A
(en)
1979-09-25
BE843588A
(en)
1976-10-18
FR2316765B1
(en)
1981-12-31
SE426629B
(en)
1983-01-31
FR2316765A1
(en)
1977-01-28
SE7607399L
(en)
1976-12-31
JPS525488A
(en)
1977-01-17
DE2626274A1
(en)
1977-01-27
US3983623A
(en)
1976-10-05
NL7607186A
(en)
1977-01-03
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Legal Events
Date
Code
Title
Description
1980-01-23
PS
Patent sealed [section 19, patents act 1949]
