GB1565039A - Creación de Inventos y Patentes con Inteligencia Artificial

GB1565039A – Boards for use in printed circuits and their manufacture
– Google Patents

GB1565039A – Boards for use in printed circuits and their manufacture
– Google Patents
Boards for use in printed circuits and their manufacture

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Publication number
GB1565039A

GB1565039A
GB10631/78A
GB1063178A
GB1565039A
GB 1565039 A
GB1565039 A
GB 1565039A
GB 10631/78 A
GB10631/78 A
GB 10631/78A
GB 1063178 A
GB1063178 A
GB 1063178A
GB 1565039 A
GB1565039 A
GB 1565039A
Authority
GB
United Kingdom
Prior art keywords
metal
film
deposited
vapor
board
Prior art date
1977-03-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
GB10631/78A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Eneos Corp

Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1977-03-18
Filing date
1978-03-17
Publication date
1980-04-16

1978-03-17
Application filed by Nippon Mining Co Ltd
filed
Critical
Nippon Mining Co Ltd

1980-04-16
Publication of GB1565039A
publication
Critical
patent/GB1565039A/en

Status
Expired
legal-status
Critical
Current

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Classifications

H—ELECTRICITY

H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

H05K3/00—Apparatus or processes for manufacturing printed circuits

H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

H05K3/146—By vapour deposition

Description

PATENT SPECIFICATION ( 11) 1 565 039
\ ( 21) Application No 10631/78 ( 22) Filed 17 Mar 1978 ( 19) c ( 31) Convention Application No 52/029241 ( 32) Filed 18 Mar 1977 in, ( 33) Japan (JP) \ ( 44) Complete Specification Published 16 Apr 1980 X ( 51) INT CL C 25 D 5/56 ( 52) Index at Acceptance C 7 B 120 303 304 GD 13 ( 54) BOARDS FOR USE IN PRINTED CIRCUITS AND THEIR MANUFACTURE ( 71) We, NIPPON MINING CO LIMITED, a Japanese Company of 2-10-1 Toranomon, Minato-Ku, Tokyo, Japan, do hereby declare the invention for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly
described in and by the following statement:-
The present invention relates to a method of making a raw board for use in printed circuits 5 The raw board for use in printed circuits have been hitherto made by heatpressing copper foil with an adhesive on a sheet of a plastic polymer such as phenol resin, epoxy resins and the like.
In such a case, a copper foil having a thickness of at least 30 gt or so have usually been employed, because in the case where an excessively thin copper foil was used, wrinkles and 10 breaking of the copper foil are apt to occur at the stages of producing and cutting the copper foil and the foil could not be easily adhered to a substrate in desired conditions at the stage of heat-pressing the copper foil onto a plastic film.
On the contrary, in the case where the copper foil having about 30 g of thickness is used, side etching phenomenon takes place when a circuit is printed on the copper foil and copper 15 portions other than necessary portions are dissolved to be removed by etching treatment, and there is found problems such that breaking of circuits takes place and/or a minute pattern cannot be obtained.
An object of the present invention is to overcome the above problems as seen in prior art and find an improvement of the method for producing a raw board for use in printed circuits 20 According to the present invention, previous production of a metallic foil such as copper foil, as in prior arts, is not required Also, a surface treatment or an adhesion treatment of a metallic foil, which is hitherto needed for making the metallic layer on the surface of a substrate for use in printed circuits, is not required at all Further, adhesion of a metallic layer onto a substrate for use in printed circuits may be simplified and it is also possible to make the 25 thickness of a metallic layer ultra thin.
As a result, the side etching phenomenon occurring in an etching operation after printing a circuit can scarcely be seen For such a reason, problems encountered in using a raw board for use in printed circuits can be eliminated.
According to the present invention there is provided a method of making a board suitable 30 for use in printed circuit manufacture, comprising the steps of subjecting a film of a flexible plastics material to vapor deposition of a metal so as to deposit the metal directly onto a surface of the film, immersing the film in an electrolytic bath including a brightener as an additive, the bath being maintained at a temperature of 50 to 60 WC, so that a metal layer is electroplated onto the surface of the metal previously vapor-deposited on the surface of the 35 film thereby to produce a flexible metal-clad board for use in printed circuits.
Illustrative of the flexible plastics film are polyvinylchloride film, polyethylene telephthalate film, polyimide film and the like, and preferably polyimide film available from du Pont under the designation «KAPTON» and a polyester resin film available from du Pont under the designation «MYLAR» «KAPTON» and «MYLAR» are Registered Trade Marks 40 A production method of the raw board according to the present invention will be illustrated by way of example in the sequence of the steps used hereafter.
First a plastics film is subjected to a degreasing treatment in a conventional manner such as, for example, by immersing the film in an aqueous caustic alkali solution, to remove grease content on the film if desired This step is not necessary if the film is perfectly clean 45 2 1,565,039 Following the degreasing treatment of the foil, pretreatments of its surface to be adhered with a metal, such as cleaning, activation and the like, are carried out with a chemical treatment or a physical treatment The chemical treatment may be conducted with an aqueous acid solution and water The pretreatment may be omitted when the film can be obtained in clean state 5 Also, the plastics film can be subjected to conventional pretreatments, for example, as disclosed in L Holland, Vacuum Deposition of Thin Films, Chapman and Hall Limited, (London), especially pages 44-103.
Following the pretreatments, a metal is vapor deposited on a surface of the film with a vacuum evaporation method or the like 10 Preferably, a metal to be vapor deposited on the surface of the foil is a metal such as copper, nickel, or tin, an alloy of any two or all of these metals, or a Cu-Zn alloy, which has superior conductivity and adhesiveness to the foil and is relatively easy to be dissolved and removed upon being etched.
The vapor deposition may be carried out as aforesaid using one metal alone or an alloy 15 including Cu-Zn alloy Further, separate metals or an alloy of at least two kinds of metals as mentioned above may be deposited in two layers As a result, a decrease of the adhesion strength between the metal and the film, and formation of an oxidation coating effected by the metals may be avoided An effective adhesion between the metals and a metal subsequently used may be obtained 20 The thickness of a metal layer to be vapor deposited is above about 0 05 g, and preferably 0.1 0 3 g The thickness is of such a degree that the layer serves as an electric conductor in the subsequent electrodepositing step carried out by an electroplating method which will be later described.
In the electrical metal-depositing treatment, the U B A C (Registered Trade Mark) and 25 preferably the U B A C #1 brightener which is avilable from Udylite Div, OMIC can be used as an additive, and the electrolytic metal-depositing treatment increases the thickness of the metal layer previously existing on the film to about 1 10 gt or so An electrolyte temperature ranges from 50 to 60 WC.
The metal to be electrolytically deposited may be copper alone or an alloy of copper and at 30 least one metal selected from nickel, tin and zinc.
In case of electrolytically depositing the metal on the surface of a metal layer previously vapor deposited, the metal may be used alone or as an alloy and it may also be deposited in a single layer or double layers.
The metal layer thus formed may have optional thickness required for a raw board for use 35 in printed circuits.
Passing through these steps, the raw board made according to the present invention may be obtained A printed circuit board is made by printing a required circuit on the raw board thus obtained and dissolving and removing unnecessary portions of the metal layer by an etching operation in a conventional manner 40 According to the present invention, continuous production of the long raw film for use in printed circuits is possible by using a roll of a flexible film.
The following examples further illustrate preferred operations within the scope of the present invention.
EXAMPLE 1 45
In this example, «KAPTON» available from du Pont which was a flexible film of 300 mm in width, 400 m in length and 50 gt in thickness, was used The film was immersed in 10 % aqueous Na OH solution for 5 minutes at 70 WC and then washed to degrease same Thereafter it was air dried for one minute at 180 WC.
The film thus treated was subjected to copper vapor depositing treatment using sputtering 50 method until the thickness of the deposited copper layer became to 0 1 g.
The deposited copper layer obtained was used as a cathode in the subsequent electroplating step.
In the electroplating treatment, a pure copper plate was used as an anode to carry out the electroplating treatment using the following conditions: 55 Cathode current density 1 6 A/dm 2 Temperature 55 C Cu So 4 5 H 20 concentration (gins/liter 225 Acid concentration in terms of H 2504 (gms/liter) 50 60 Additive (U B A C #1 me/liter) 4 HCI concentration mg/C The foil so treated had 10,u of thickness in the copper layer deposited and 1 6 kg/cm of peeling strength in a peeling test 65 1,565,039 Example 2
In the same manner as described in example 1, polyethylene telephthalate film in roll form of 500 mm in width, 200 m in length and 38 gu in thickness is treated under the following conditions:
Cathode current density (A/dm 2) 2 0 5 Temperature (‘C) 60 Cu So 4 5 H 20 (gms/liter) 200 Acid concentration in terms of H 2504 (gins/liter 45 Additive (U B A C #1) me/liter 5 10 HCI concentration mg/e The thus treated foil has 12 gu of thickness in the deposited Cu layer and 1 5 kg/cm of peel strength in a peeling test.
In addition to the results of the foregoing examples, there can scarcely be found pin holes 15 although the deposited layer is extremely thin, because a metal is directly vapor-deposited onto an insulating substrate and a metal has been electro-plated onto the metal surface vapor deposited thereon to make a raw board for use in printed circuits For example, the following results may be obtained.
( 1 It is not needed to adhere a metallic foil onto a substrate 20 ( 2 Continuous production is possible in case of using a long film in roll form For example, a board with 100 2000 m film can be continuously produced.
( 3) Circuits having high reliability may be obtained because scarcely any pin holes are present in the surface of the metal vapor deposited onto a clean substrate.
( 4) The thickness of the metallic layer may be optionally selected because the layer is 25 formed by an electroplating method.
( 5) Where an extremely thin metallic layer is deposited, the etching operation is easily carried out and side etching is substantially absent thus enabling manufacture of a precise and minute circuit.
( 6) Troubles such as pits, dents, scratches, stain and the like which arise during the period 30 of handling the product do not take place and the product can effectively be used with extremely thin thickness because an adhesion treatment of a metallic foil or a treatment for the adhesion of same is not required.
The invention may be embodied in other specific forms without departing from the essential characteristics thereof The present embodiments are therefore to be considered in 35 all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (9)

WHAT WE CLAIM IS: 40

1 A method of making a board suitable for use in printed circuit manufacture, comprising the steps of subjecting a film of a flexible plastics material to vapor deposition of a metal so as to deposit the metal directly onto a surface of the film, immersing the film in an electrolytic bath including a brightener as an additive, the bath being maintained at a temperature of 50 to 60 ‘C, so that a metal layer is electroplated onto the surface of the metal previously 45 vapor-deposited on the surface of the film thereby to produce a flexible metal-clad board for use in pnnted circuits.

2 The method according to claim 1, wherein the plastics material is selected from polyvinyl chloride, polyethylene telephthalqte and polyimide.
so

3 The method according to claim 1 or claim 2, wherein the metal to be vapor-deposited is 50 selected from Cu, Ni, Sn, an alloy thereof, and a Cu-Zn alloy.

4 The method according to claim 1, 2 or 3, wherein a single metal is vapor-deposited.

The method according to claim 1, 2 or 3, wherein a combination of at least two metals is vapor-deposited.

6 The method according to any of claims 1 to 5, wherein the metal to be electroplated 55 onto the surface of the vapor-deposited metal is at least one metal selected from Cu, Ni, Sn, Zn and alloys thereof.

7 The method according to any one of the preceding claims, wherein the film is an elongated strip form is subjected to metal coating by a continuous process involving the vapor deposition and electroplating steps 60

8 A method of making a board suitable for use in printed circuit manufacture according to claim 1, and substantially as hereinbefore described with reference to the Examples.

9 A flexible board for use in printed circuit manufacture, when produced by the method claimed in any one of the preceding claims 1 to 8.
4 1,565,039 4 For the Applicants.
GRAHAM WATl & CO.
Chartered Patent Agents, 8, Grays Inn Square, London, 5 WC 1 R 5 AH Printed for Her Majesty’s Stationery Office, by Croydon Printing Company Limited Croydon Surrey 1980.
Published by The Patent Office 25 Southampton Buildings London WC 2 A I AY from which copies may be obtained.

GB10631/78A
1977-03-18
1978-03-17
Boards for use in printed circuits and their manufacture

Expired

GB1565039A
(en)

Applications Claiming Priority (1)

Application Number
Priority Date
Filing Date
Title

JP2924177A

JPS53115069A
(en)

1977-03-18
1977-03-18
Method of producing printed circuit board

Publications (1)

Publication Number
Publication Date

GB1565039A
true

GB1565039A
(en)

1980-04-16

Family
ID=12270739
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

GB10631/78A
Expired

GB1565039A
(en)

1977-03-18
1978-03-17
Boards for use in printed circuits and their manufacture

Country Status (5)

Country
Link

US
(1)

US4193849A
(en)

JP
(1)

JPS53115069A
(en)

DE
(1)

DE2810523C2
(en)

GB
(1)

GB1565039A
(en)

LU
(1)

LU79267A1
(en)

Cited By (1)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

FR2503523A1
(en)

1981-04-03
1982-10-08
Gen Electric

PRINTED CIRCUIT, LAMINATED PRODUCT FOR MANUFACTURING SUCH CIRCUIT AND METHOD FOR MANUFACTURING THE SAME

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Title

US4357395A
(en)

1980-08-22
1982-11-02
General Electric Company
Transfer lamination of vapor deposited foils, method and product

US4455181A
(en)

1980-09-22
1984-06-19
General Electric Company
Method of transfer lamination of copper thin sheets and films

US4383003A
(en)

1980-09-22
1983-05-10
General Electric Company
Transfer lamination of copper thin sheets and films, method and product

GB2091634B
(en)

1981-01-22
1984-12-05
Gen Electric
Transfer lamination of vapour deposited copper thin sheets and films

US4431710A
(en)

1981-01-22
1984-02-14
General Electric Company
Laminate product of ultra thin copper film on a flexible aluminum carrier

US4402998A
(en)

1982-01-04
1983-09-06
Western Electric Co., Inc.
Method for providing an adherent electroless metal coating on an epoxy surface

US4444848A
(en)

1982-01-04
1984-04-24
Western Electric Co., Inc.
Adherent metal coatings on rubber-modified epoxy resin surfaces

US4582564A
(en)

1982-01-04
1986-04-15
At&T Technologies, Inc.
Method of providing an adherent metal coating on an epoxy surface

US4452664A
(en)

1983-08-01
1984-06-05
General Electric Company
Method for predetermining peel strength at copper/aluminum interface

US4996584A
(en)

1985-01-31
1991-02-26
Gould, Inc.
Thin-film electrical connections for integrated circuits

US4863808A
(en)

1985-09-13
1989-09-05
Gould Inc.
Copper-chromium-polyimide composite

US4969979A
(en)

1989-05-08
1990-11-13
International Business Machines Corporation
Direct electroplating of through holes

TW208110B
(en)

1990-06-08
1993-06-21
Furukawa Circuit Foil Kk

US5137791A
(en)

1990-09-13
1992-08-11
Sheldahl Inc.
Metal-film laminate resistant to delamination

US5112462A
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1990-09-13
1992-05-12
Sheldahl Inc.
Method of making metal-film laminate resistant to delamination

US6060175A
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1990-09-13
2000-05-09
Sheldahl, Inc.
Metal-film laminate resistant to delamination

US6007652A
(en)

1990-11-05
1999-12-28
Murata Manufacturing Co., Ltd.
Method of preparing metal thin film having excellent transferability

US5830533A
(en)

1991-05-28
1998-11-03
Microelectronics And Computer Technology Corporation
Selective patterning of metallization on a dielectric substrate

US5685970A
(en)

1992-07-01
1997-11-11
Gould Electronics Inc.
Method and apparatus for sequentially metalized polymeric films and products made thereby

US5527998A
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1993-10-22
1996-06-18
Sheldahl, Inc.
Flexible multilayer printed circuit boards and methods of manufacture

US6171714B1
(en)

1996-04-18
2001-01-09
Gould Electronics Inc.
Adhesiveless flexible laminate and process for making adhesiveless flexible laminate

US5773198A
(en)

1996-06-07
1998-06-30
Motorola, Inc.
Method of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layer

US6165309A
(en)

1998-02-04
2000-12-26
General Electric Co.
Method for improving the adhesion of metal films to polyphenylene ether resins

US6268070B1
(en)

1999-03-12
2001-07-31
Gould Electronics Inc.
Laminate for multi-layer printed circuit

RU2447629C2
(en)

2010-06-16
2012-04-10
Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования «Юго-Западный государственный университет» (ЮЗГУ)
Method for metal coating holes in multilayer printed-circuit boards

CN102021576B
(en)

2010-09-30
2012-06-27
深圳市信诺泰创业投资企业(普通合伙)
Method for continuously producing flexible copper clad laminates

CN102517618B
(en)

2011-12-28
2014-08-13
厦门建霖工业有限公司
Copper drawing and electroplating method for plastic substrate

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Blaupunkt Werke Gmbh

Process for the production of an assembly for electrical devices

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1968-12-04
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Siemens Ag

Process for the production of circuit boards provided with conductor tracks

DE2304685C3
(en)

1973-01-31
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Siemens Ag, 1000 Berlin Und 8000 Muenchen

Process for the production of microscopic metal or metal alloy structures

1977

1977-03-18
JP
JP2924177A
patent/JPS53115069A/en
active
Pending

1978

1978-03-10
DE
DE2810523A
patent/DE2810523C2/en
not_active
Expired

1978-03-15
US
US05/886,826
patent/US4193849A/en
not_active
Expired – Lifetime

1978-03-17
LU
LU79267A
patent/LU79267A1/en
unknown

1978-03-17
GB
GB10631/78A
patent/GB1565039A/en
not_active
Expired

Cited By (1)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

FR2503523A1
(en)

1981-04-03
1982-10-08
Gen Electric

PRINTED CIRCUIT, LAMINATED PRODUCT FOR MANUFACTURING SUCH CIRCUIT AND METHOD FOR MANUFACTURING THE SAME

Also Published As

Publication number
Publication date

LU79267A1
(en)

1978-06-29

DE2810523A1
(en)

1978-09-21

US4193849A
(en)

1980-03-18

JPS53115069A
(en)

1978-10-07

DE2810523C2
(en)

1982-12-09

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