GB1572332A - Creación de Inventos y Patentes con Inteligencia Artificial

GB1572332A – Plating of substrates by jet printing
– Google Patents

GB1572332A – Plating of substrates by jet printing
– Google Patents
Plating of substrates by jet printing

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Info

Publication number
GB1572332A

GB1572332A
GB21696/78A
GB2169678A
GB1572332A
GB 1572332 A
GB1572332 A
GB 1572332A
GB 21696/78 A
GB21696/78 A
GB 21696/78A
GB 2169678 A
GB2169678 A
GB 2169678A
GB 1572332 A
GB1572332 A
GB 1572332A
Authority
GB
United Kingdom
Prior art keywords
substrate
metal
jet printing
plating
ink composition
Prior art date
1977-06-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
GB21696/78A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

M&T Chemicals Inc

Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1977-06-07
Filing date
1978-05-23
Publication date
1980-07-30

1978-05-23
Application filed by M&T Chemicals Inc
filed
Critical
M&T Chemicals Inc

1980-07-30
Publication of GB1572332A
publication
Critical
patent/GB1572332A/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

238000007639
printing
Methods

0.000
title
claims
description
45

239000000758
substrate
Substances

0.000
title
claims
description
41

238000007747
plating
Methods

0.000
title
claims
description
35

229910052751
metal
Inorganic materials

0.000
claims
description
59

239000002184
metal
Substances

0.000
claims
description
59

239000000203
mixture
Substances

0.000
claims
description
51

238000000034
method
Methods

0.000
claims
description
32

RYGMFSIKBFXOCR-UHFFFAOYSA-N
Copper
Chemical compound

[Cu]
RYGMFSIKBFXOCR-UHFFFAOYSA-N
0.000
claims
description
14

239000010949
copper
Substances

0.000
claims
description
14

229910052802
copper
Inorganic materials

0.000
claims
description
14

150000003839
salts
Chemical class

0.000
claims
description
14

239000011135
tin
Substances

0.000
claims
description
14

229910045601
alloy
Inorganic materials

0.000
claims
description
13

239000000956
alloy
Substances

0.000
claims
description
13

239000004411
aluminium
Substances

0.000
claims
description
13

229910052782
aluminium
Inorganic materials

0.000
claims
description
13

XAGFODPZIPBFFR-UHFFFAOYSA-N
aluminium
Chemical compound

[Al]
XAGFODPZIPBFFR-UHFFFAOYSA-N
0.000
claims
description
13

PXHVJJICTQNCMI-UHFFFAOYSA-N
Nickel
Chemical compound

[Ni]
PXHVJJICTQNCMI-UHFFFAOYSA-N
0.000
claims
description
10

ATJFFYVFTNAWJD-UHFFFAOYSA-N
Tin
Chemical compound

[Sn]
ATJFFYVFTNAWJD-UHFFFAOYSA-N
0.000
claims
description
10

229910052718
tin
Inorganic materials

0.000
claims
description
10

229910000838
Al alloy
Inorganic materials

0.000
claims
description
9

239000011701
zinc
Substances

0.000
claims
description
9

HCHKCACWOHOZIP-UHFFFAOYSA-N
Zinc
Chemical compound

[Zn]
HCHKCACWOHOZIP-UHFFFAOYSA-N
0.000
claims
description
8

229910001092
metal group alloy
Inorganic materials

0.000
claims
description
8

229910052725
zinc
Inorganic materials

0.000
claims
description
7

150000002500
ions
Chemical class

0.000
claims
description
4

229910052759
nickel
Inorganic materials

0.000
claims
description
4

229910000831
Steel
Inorganic materials

0.000
claims
description
3

230000001747
exhibiting effect
Effects

0.000
claims
description
3

229910052709
silver
Inorganic materials

0.000
claims
description
3

239000004332
silver
Substances

0.000
claims
description
3

125000005402
stannate group
Chemical group

0.000
claims
description
3

239000010959
steel
Substances

0.000
claims
description
3

JPVYNHNXODAKFH-UHFFFAOYSA-N
Cu2+
Chemical compound

[Cu+2]
JPVYNHNXODAKFH-UHFFFAOYSA-N
0.000
claims
description
2

229910001128
Sn alloy
Inorganic materials

0.000
claims
description
2

229910052793
cadmium
Inorganic materials

0.000
claims
description
2

BDOSMKKIYDKNTQ-UHFFFAOYSA-N
cadmium atom
Chemical compound

[Cd]
BDOSMKKIYDKNTQ-UHFFFAOYSA-N
0.000
claims
description
2

229910001431
copper ion
Inorganic materials

0.000
claims
description
2

229910021645
metal ion
Inorganic materials

0.000
claims
description
2

229940071182
stannate
Drugs

0.000
claims
description
2

BQCADISMDOOEFD-UHFFFAOYSA-N
Silver
Chemical compound

[Ag]
BQCADISMDOOEFD-UHFFFAOYSA-N
0.000
claims
2

239000003795
chemical substances by application
Substances

0.000
claims
2

229910000881
Cu alloy
Inorganic materials

0.000
claims
1

229910000990
Ni alloy
Inorganic materials

0.000
claims
1

229910001297
Zn alloy
Inorganic materials

0.000
claims
1

239000000976
ink
Substances

0.000
description
42

KWYUFKZDYYNOTN-UHFFFAOYSA-M
Potassium hydroxide
Chemical compound

[OH-].[K+]
KWYUFKZDYYNOTN-UHFFFAOYSA-M
0.000
description
24

239000002253
acid
Substances

0.000
description
10

FYYHWMGAXLPEAU-UHFFFAOYSA-N
Magnesium
Chemical compound

[Mg]
FYYHWMGAXLPEAU-UHFFFAOYSA-N
0.000
description
7

229910052749
magnesium
Inorganic materials

0.000
description
7

239000011777
magnesium
Substances

0.000
description
7

NNFCIKHAZHQZJG-UHFFFAOYSA-N
potassium cyanide
Chemical compound

[K+].N#[C-]
NNFCIKHAZHQZJG-UHFFFAOYSA-N
0.000
description
7

150000002739
metals
Chemical class

0.000
description
6

XLYOFNOQVPJJNP-UHFFFAOYSA-N
water
Substances

O
XLYOFNOQVPJJNP-UHFFFAOYSA-N
0.000
description
6

239000005028
tinplate
Substances

0.000
description
5

VYZAMTAEIAYCRO-UHFFFAOYSA-N
Chromium
Chemical compound

[Cr]
VYZAMTAEIAYCRO-UHFFFAOYSA-N
0.000
description
4

XEEYBQQBJWHFJM-UHFFFAOYSA-N
Iron
Chemical compound

[Fe]
XEEYBQQBJWHFJM-UHFFFAOYSA-N
0.000
description
4

XUIMIQQOPSSXEZ-UHFFFAOYSA-N
Silicon
Chemical compound

[Si]
XUIMIQQOPSSXEZ-UHFFFAOYSA-N
0.000
description
4

-1
aluminium
Chemical class

0.000
description
4

229910052804
chromium
Inorganic materials

0.000
description
4

239000011651
chromium
Substances

0.000
description
4

KUNSUQLRTQLHQQ-UHFFFAOYSA-N
copper tin
Chemical compound

[Cu].[Sn]
KUNSUQLRTQLHQQ-UHFFFAOYSA-N
0.000
description
4

239000003792
electrolyte
Substances

0.000
description
4

229910052710
silicon
Inorganic materials

0.000
description
4

239000010703
silicon
Substances

0.000
description
4

SQGYOTSLMSWVJD-UHFFFAOYSA-N
silver(1+) nitrate
Chemical compound

[Ag+].[O-]N(=O)=O
SQGYOTSLMSWVJD-UHFFFAOYSA-N
0.000
description
4

229910000906
Bronze
Inorganic materials

0.000
description
3

OKKJLVBELUTLKV-UHFFFAOYSA-N
Methanol
Chemical compound

OC
OKKJLVBELUTLKV-UHFFFAOYSA-N
0.000
description
3

HEMHJVSKTPXQMS-UHFFFAOYSA-M
Sodium hydroxide
Chemical compound

[OH-].[Na+]
HEMHJVSKTPXQMS-UHFFFAOYSA-M
0.000
description
3

239000010974
bronze
Substances

0.000
description
3

ARUVKPQLZAKDPS-UHFFFAOYSA-L
copper(II) sulfate
Chemical compound

[Cu+2].[O-][S+2]([O-])([O-])[O-]
ARUVKPQLZAKDPS-UHFFFAOYSA-L
0.000
description
3

238000007598
dipping method
Methods

0.000
description
3

239000000243
solution
Substances

0.000
description
3

239000002904
solvent
Substances

0.000
description
3

JOXIMZWYDAKGHI-UHFFFAOYSA-N
toluene-4-sulfonic acid
Chemical group

CC1=CC=C(S(O)(=O)=O)C=C1
JOXIMZWYDAKGHI-UHFFFAOYSA-N
0.000
description
3

KRHYYFGTRYWZRS-UHFFFAOYSA-N
Fluorane
Chemical compound

F
KRHYYFGTRYWZRS-UHFFFAOYSA-N
0.000
description
2

GRYLNZFGIOXLOG-UHFFFAOYSA-N
Nitric acid
Chemical compound

O[N+]([O-])=O
GRYLNZFGIOXLOG-UHFFFAOYSA-N
0.000
description
2

CDBYLPFSWZWCQE-UHFFFAOYSA-L
Sodium Carbonate
Chemical compound

[Na+].[Na+].[O-]C([O-])=O
CDBYLPFSWZWCQE-UHFFFAOYSA-L
0.000
description
2

150000007513
acids
Chemical class

0.000
description
2

239000000654
additive
Substances

0.000
description
2

DOBRDRYODQBAMW-UHFFFAOYSA-N
copper(i) cyanide
Chemical compound

[Cu+].N#[C-]
DOBRDRYODQBAMW-UHFFFAOYSA-N
0.000
description
2

239000013078
crystal
Substances

0.000
description
2

230000001419
dependent effect
Effects

0.000
description
2

IOUCSUBTZWXKTA-UHFFFAOYSA-N
dipotassium;dioxido(oxo)tin
Chemical compound

[K+].[K+].[O-][Sn]([O-])=O
IOUCSUBTZWXKTA-UHFFFAOYSA-N
0.000
description
2

238000007641
inkjet printing
Methods

0.000
description
2

229910052742
iron
Inorganic materials

0.000
description
2

239000011133
lead
Substances

0.000
description
2

KWGKDLIKAYFUFQ-UHFFFAOYSA-M
lithium chloride
Chemical compound

[Li+].[Cl-]
KWGKDLIKAYFUFQ-UHFFFAOYSA-M
0.000
description
2

WPBNNNQJVZRUHP-UHFFFAOYSA-L
manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate
Chemical compound

[Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC
WPBNNNQJVZRUHP-UHFFFAOYSA-L
0.000
description
2

150000002823
nitrates
Chemical class

0.000
description
2

229910017604
nitric acid
Inorganic materials

0.000
description
2

LJCNRYVRMXRIQR-OLXYHTOASA-L
potassium sodium L-tartrate
Chemical class

[Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O
LJCNRYVRMXRIQR-OLXYHTOASA-L
0.000
description
2

229910001961
silver nitrate
Inorganic materials

0.000
description
2

235000011006
sodium potassium tartrate
Nutrition

0.000
description
2

150000003467
sulfuric acid derivatives
Chemical class

0.000
description
2

GZCWPZJOEIAXRU-UHFFFAOYSA-N
tin zinc
Chemical compound

[Zn].[Sn]
GZCWPZJOEIAXRU-UHFFFAOYSA-N
0.000
description
2

GTLDTDOJJJZVBW-UHFFFAOYSA-N
zinc cyanide
Chemical compound

[Zn+2].N#[C-].N#[C-]
GTLDTDOJJJZVBW-UHFFFAOYSA-N
0.000
description
2

TXUICONDJPYNPY-UHFFFAOYSA-N
(1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate
Chemical compound

C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2
TXUICONDJPYNPY-UHFFFAOYSA-N
0.000
description
1

OCUCCJIRFHNWBP-IYEMJOQQSA-L
Copper gluconate
Chemical class

[Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O
OCUCCJIRFHNWBP-IYEMJOQQSA-L
0.000
description
1

VEXZGXHMUGYJMC-UHFFFAOYSA-N
Hydrochloric acid
Chemical compound

Cl
VEXZGXHMUGYJMC-UHFFFAOYSA-N
0.000
description
1

PWHULOQIROXLJO-UHFFFAOYSA-N
Manganese
Chemical compound

[Mn]
PWHULOQIROXLJO-UHFFFAOYSA-N
0.000
description
1

ZOKXTWBITQBERF-UHFFFAOYSA-N
Molybdenum
Chemical compound

[Mo]
ZOKXTWBITQBERF-UHFFFAOYSA-N
0.000
description
1

229910021626
Tin(II) chloride
Inorganic materials

0.000
description
1

RTAQQCXQSZGOHL-UHFFFAOYSA-N
Titanium
Chemical compound

[Ti]
RTAQQCXQSZGOHL-UHFFFAOYSA-N
0.000
description
1

XSTXAVWGXDQKEL-UHFFFAOYSA-N
Trichloroethylene
Chemical group

ClC=C(Cl)Cl
XSTXAVWGXDQKEL-UHFFFAOYSA-N
0.000
description
1

229910052770
Uranium
Inorganic materials

0.000
description
1

240000008042
Zea mays
Species

0.000
description
1

235000005824
Zea mays ssp. parviglumis
Nutrition

0.000
description
1

235000002017
Zea mays subsp mays
Nutrition

0.000
description
1

229910000611
Zinc aluminium
Inorganic materials

0.000
description
1

RRXGIIMOBNNXDK-UHFFFAOYSA-N
[Mg].[Sn]
Chemical compound

[Mg].[Sn]
RRXGIIMOBNNXDK-UHFFFAOYSA-N
0.000
description
1

YVIMHTIMVIIXBQ-UHFFFAOYSA-N
[SnH3][Al]
Chemical compound

[SnH3][Al]
YVIMHTIMVIIXBQ-UHFFFAOYSA-N
0.000
description
1

230000000996
additive effect
Effects

0.000
description
1

229910052783
alkali metal
Inorganic materials

0.000
description
1

229910001514
alkali metal chloride
Inorganic materials

0.000
description
1

229910001963
alkali metal nitrate
Inorganic materials

0.000
description
1

229910052936
alkali metal sulfate
Inorganic materials

0.000
description
1

JRBRVDCKNXZZGH-UHFFFAOYSA-N
alumane;copper
Chemical compound

[AlH3].[Cu]
JRBRVDCKNXZZGH-UHFFFAOYSA-N
0.000
description
1

HXFVOUUOTHJFPX-UHFFFAOYSA-N
alumane;zinc
Chemical compound

[AlH3].[Zn]
HXFVOUUOTHJFPX-UHFFFAOYSA-N
0.000
description
1

239000007864
aqueous solution
Substances

0.000
description
1

239000002585
base
Substances

0.000
description
1

229910052790
beryllium
Inorganic materials

0.000
description
1

ATBAMAFKBVZNFJ-UHFFFAOYSA-N
beryllium atom
Chemical compound

[Be]
ATBAMAFKBVZNFJ-UHFFFAOYSA-N
0.000
description
1

NHMJUOSYSOOPDM-UHFFFAOYSA-N
cadmium cyanide
Chemical compound

[Cd+2].N#[C-].N#[C-]
NHMJUOSYSOOPDM-UHFFFAOYSA-N
0.000
description
1

238000004140
cleaning
Methods

0.000
description
1

229910017052
cobalt
Inorganic materials

0.000
description
1

239000010941
cobalt
Substances

0.000
description
1

GUTLYIVDDKVIGB-UHFFFAOYSA-N
cobalt atom
Chemical compound

[Co]
GUTLYIVDDKVIGB-UHFFFAOYSA-N
0.000
description
1

TVZPLCNGKSPOJA-UHFFFAOYSA-N
copper zinc
Chemical compound

[Cu].[Zn]
TVZPLCNGKSPOJA-UHFFFAOYSA-N
0.000
description
1

235000005822
corn
Nutrition

0.000
description
1

238000005238
degreasing
Methods

0.000
description
1

230000002939
deleterious effect
Effects

0.000
description
1

XHFGWHUWQXTGAT-UHFFFAOYSA-N
dimethylamine hydrochloride
Natural products

CNC(C)C
XHFGWHUWQXTGAT-UHFFFAOYSA-N
0.000
description
1

IQDGSYLLQPDQDV-UHFFFAOYSA-N
dimethylazanium;chloride
Chemical compound

Cl.CNC
IQDGSYLLQPDQDV-UHFFFAOYSA-N
0.000
description
1

TVQLLNFANZSCGY-UHFFFAOYSA-N
disodium;dioxido(oxo)tin
Chemical compound

[Na+].[Na+].[O-][Sn]([O-])=O
TVQLLNFANZSCGY-UHFFFAOYSA-N
0.000
description
1

238000001035
drying
Methods

0.000
description
1

230000005684
electric field
Effects

0.000
description
1

238000007654
immersion
Methods

0.000
description
1

229910052738
indium
Inorganic materials

0.000
description
1

APFVFJFRJDLVQX-UHFFFAOYSA-N
indium atom
Chemical compound

[In]
APFVFJFRJDLVQX-UHFFFAOYSA-N
0.000
description
1

LQBJWKCYZGMFEV-UHFFFAOYSA-N
lead tin
Chemical compound

[Sn].[Pb]
LQBJWKCYZGMFEV-UHFFFAOYSA-N
0.000
description
1

239000007788
liquid
Substances

0.000
description
1

229910052748
manganese
Inorganic materials

0.000
description
1

239000011572
manganese
Substances

0.000
description
1

239000000463
material
Substances

0.000
description
1

229910052750
molybdenum
Inorganic materials

0.000
description
1

239000011733
molybdenum
Substances

0.000
description
1

LGQLOGILCSXPEA-UHFFFAOYSA-L
nickel sulfate
Chemical compound

[Ni+2].[O-]S([O-])(=O)=O
LGQLOGILCSXPEA-UHFFFAOYSA-L
0.000
description
1

QELJHCBNGDEXLD-UHFFFAOYSA-N
nickel zinc
Chemical compound

[Ni].[Zn]
QELJHCBNGDEXLD-UHFFFAOYSA-N
0.000
description
1

150000002825
nitriles
Chemical class

0.000
description
1

229910000510
noble metal
Inorganic materials

0.000
description
1

239000010957
pewter
Substances

0.000
description
1

229910000498
pewter
Inorganic materials

0.000
description
1

IVDPWEKOUUEEBD-UHFFFAOYSA-N
potassium;copper(1+);dicyanide
Chemical compound

[K+].[Cu+].N#[C-].N#[C-]
IVDPWEKOUUEEBD-UHFFFAOYSA-N
0.000
description
1

LFAGQMCIGQNPJG-UHFFFAOYSA-N
silver cyanide
Chemical compound

[Ag+].N#[C-]
LFAGQMCIGQNPJG-UHFFFAOYSA-N
0.000
description
1

229940098221
silver cyanide
Drugs

0.000
description
1

229910000029
sodium carbonate
Inorganic materials

0.000
description
1

229940079864
sodium stannate
Drugs

0.000
description
1

239000001119
stannous chloride
Substances

0.000
description
1

235000011150
stannous chloride
Nutrition

0.000
description
1

239000000126
substance
Substances

0.000
description
1

229910052714
tellurium
Inorganic materials

0.000
description
1

PORWMNRCUJJQNO-UHFFFAOYSA-N
tellurium atom
Chemical compound

[Te]
PORWMNRCUJJQNO-UHFFFAOYSA-N
0.000
description
1

229910052716
thallium
Inorganic materials

0.000
description
1

BKVIYDNLLOSFOA-UHFFFAOYSA-N
thallium
Chemical compound

[Tl]
BKVIYDNLLOSFOA-UHFFFAOYSA-N
0.000
description
1

239000005029
tin-free steel
Substances

0.000
description
1

239000010936
titanium
Substances

0.000
description
1

229910052719
titanium
Inorganic materials

0.000
description
1

RYFMWSXOAZQYPI-UHFFFAOYSA-K
trisodium phosphate
Chemical compound

[Na+].[Na+].[Na+].[O-]P([O-])([O-])=O
RYFMWSXOAZQYPI-UHFFFAOYSA-K
0.000
description
1

JFALSRSLKYAFGM-UHFFFAOYSA-N
uranium(0)
Chemical compound

[U]
JFALSRSLKYAFGM-UHFFFAOYSA-N
0.000
description
1

238000009736
wetting
Methods

0.000
description
1

Classifications

C—CHEMISTRY; METALLURGY

C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR

C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR

C09D11/00—Inks

C09D11/30—Inkjet printing inks

C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes

C—CHEMISTRY; METALLURGY

C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL

C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL

C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating

C23C18/54—Contact plating, i.e. electroless electrochemical plating

Description

PATENT SPECIFICATION
ei ( 21) Application No 21696/78 ( 22) Filed 23 May 1978 en ( 31) Convention Application No ( 32) Filed 7 June 1977 in 804469 > ( 33) United States of America (US) W) ( 44) Complete Specification published 30 July 1980 ( 51) INT CL 3 C 23 C 3/00 ( 52) Index at acceptance C 7 F 1 A 1 Bl A 11 BB 2 E 2 H 2 H 2 U 2 Y 2 Z 1 2 Z 3 4 A 4 C 4 E 4 F 4 G 4 K 4 W ( 72) Inventor: ISHWAR RAMCHAND MANSUKHANI ( 54) PLATING OF SUBSTRATES BY JET PRINTING ( 71) We, M & T CHEMICALS INC, a corporation organized and existing under the laws of the State of Delaware, United States of America, with executive offices at 22 Gate House Road, Stamford, Connecticut, United States of America, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be particularly described in and
by the following statement:-
The present invention relates to processes for plating a substrate of a basis metal or metal alloy by jet printing of the substrate with at least one plating metal.
Ink jet printing is a recent development in the art of applying identifying and decorative indicia to a base In general terms, a liquid ink composition is forced, under pressure, through a very small orifice in an orifice block which contains a piezoelectric crystal vibrating at high frequency ( 50 100,000 vibrations per second) causing the ink composition passing through the orifice to be broken into minute droplets equal in number to the crystal vibrations The minute droplets are passed through a charging area where individual droplets receive an electrical charge in response to a video signal, the amplitude of the charge being dependent on the amplitude of the video signal The droplets then pass through an electrical field of fixed intensity, causing a varied deflection of the individual droplets dependent on the intensity of the charge associated therewith, after which the deflected drops are allowed to impinge on the base medium which is to receive the decorative or informative printed indicia Apparatus suitable for carrying out the ink jet printing process is described in detail in U S Patent Specifications
3,465,350 and 3,465,351 and it is in connection with an apparatus and process such as are described in the aforementioned U S Patent Specifications that the ink composition used in the present invention is designed to function.
In addition to the requirement of appropriate wetting of the metal surface to be printed, the ink droplets must adhere strongly to the surface, after application and drying, so that the printed matter is resistant to both physical rubbing or abrasive action and also is resistant 50 to moisture The ability of the ink composition to form and retain a desired image on a metal surface in the presence of moisture and the ability to resist removal by moisture is of great importance in this respect because the 55 metal can surfaces are generally become damp before, during and after the printing operation.
According to one aspect of the invention there is provided a process for plating a substrate of a basis metal or metal alloy by jet 60 printing of the substrate with at least one plating metal, the process comprising continuously imprinting uniform droplets of a jet printing ink composition containing at least one water-soluble salt as a source of at 65 least one plating metal which is more noble than the substrate, the jet printing ink composition exhibiting a viscosity at 680 F of 1.5 to 16 cps, having a p H of 0 5 to 9 5 and a specific resistivity of less than 10,000 ohm cm, 70 onto the basis metal substrate, and the droplets emitting from at least one ink jet electromagnetically energized to emit the droplets at a rate of 8 to 150 kilohertz.
According to a second aspect of the 75 invention there is provided a process for the plating of a substrate of a basis metal or metal alloy by jet printing of the substrate with at least one plating metal, the process comprising printing the substrate first with a jet printing 80 ink composition containing at least one watersoluble salt as a source of at least one plating metal which is more noble than the substrate, the substrate having an activated surface, subsequently jet printing the activated surface 85of the substrate with a jet printing ink composition containing:
( 1) plating metal ions in substantially the same concentration as in the first jet printing ink composition and in addition thereto, 90 ( 11) 1 572 332 1572332 ( 2) ions of an auxiliary plating metal not present in the first jet printing ink composition.
The substrate having an activated surface may be a basis metal or metal alloy not comprising tin but which has been tin plated to provide the activated surface Each of the first and second jet printing ink compositions may contain copper In one expedient form of process embodying this aspect of the invention the substrate comprises aluminium or an alloy thereof and the auxiliary plating metal comprises copper.
According to a third aspect of the invention there is provided a process for the plating of a substrate of aluminium or aluminium alloy by jet printing of the substrate with at least one plating metal, the process comprising printing the substrate with a first jet printing ink composition substantially free of active copper ions and containing at least one water-soluble salt as a source of at least one plating metal which is more noble than the substrate, the substrate having an activated surface, subsequently jet printing the activated surface with a second jet printing ink composition containing:
( 1) a water-soluble stannate in substantially the same concentration as in the first ink composition and in addition thereto, ( 2) ions of copper, to obtain a plate containing tin and copper.
The basis metal which may be treated by the practice of this invention may include those metals which may have a positive electrode potential (as set forth on page 1740 of the 44 edition of the Handbook of Chemistry and Physics) of less than about 2 37 volts and which may include tin plate, tin-free steel, magnesium, aluminium, beryllium, uranium, manganese, titanium, tellurium, zinc,chromium, iron, cadmium, indium, thallium, cobalt, copper, zinc or nickel or an alloy thereof, molybdenum, tin or tin alloy, lead, steel, silver etc This invention finds particular use in the plating onto tin plate, aluminium and magnesium, either in pure form or in alloy.
Other alloys on which a plate may be deposited may be tin-lead (pewter), zinc-tin, zinc-copper, copper-tin, zinc-nickel, etc.
It is a particular advantage of this invention that it may be used to plate onto basis metals such as aluminium, including aluminium alloys of a wide variety Typical of such aluminium alloys may be those containing various proportions of other metals including copper, chromium, zinc, nickel, magnesium, silicon, and manganese, A typical aluminium alloy may be that commercially identified as aluminium alloy No 1100 which may contain 99 + % aluminium.
A second typical aluminium alloy may be that commercially identified as aluminium alloy No 5052 having the following corn position:
No 5052 wt % aluminium 97 25 magnesium 2 5 chromium 0 25.
The following may be typical of other aluminium alloys:
No 356 wt % 70 aluminium 92 7 silicon 7 0 magnesium 0 3.
No.2024 wt % aluminium 92 05 75 magnesium 1 5 chromium 0 1 copper 4 5 iron 0 5 silicon 0 5 80 manganese 0 6 zinc 0 25.
No.360 wt % aluminium 90 00 silicon 9 5 85 magnesium 0 5.
In the preferred practice of the invention, the basis metal or alloy, typically tin plated steel, to be printed may preferably have been cleaned Typically, cleaning may have included 90 placing the basis metal or alloy, e g aluminium metal, in a vapour degreasing operation, typically using trichlorethylene The metal or alloy may preferably then be further cleaned in an alkaline cleaner, typically by immersion 95 in a 1 % 5 %, say 3 % aqueous solution of sodium hydroxide, sodium orthophosphate, sodium carbonate, etc or mixtures thereof.
The metal or alloy may be further cleaned by treatment with acid Typically this may be 100 effected by dipping into a solution preferably containing at least one acid, e g nitric acid or hydrofluoric acid Preferably the solution may contain 5 % 50 %o, say 20 % by weight of the acid The preferred solution may contain 20 % 105 by weight HNO 3 When the basis metal forms insoluble salts with the more common acids, the acids which do not form insoluble salts e g.
fluoboric acid may be used when the metal is lead The metal may be maintained in the 110 acid for 10 120 seconds, say 30 seconds.
Preferably after acid dipping, the metal may be rinsed in water to remove the acid which may remain on the surface Typically rinsing may be effected by dipping in a body of water for 5 115 seconds to 3 minutes, say 1 minute.
In this invention, the basis metal or alloy is printed by jet printing with an ink composition containing a soluble salt of a plating metal which is more noble than said basis metal or alloy 120 Those metals of the electromotive series which fall below the basis metal or alloy to be plated, may be considered for purpose of this invention as more noble metals Typically, for example, illustrative basis metals and plating metals may 125 be as set forth in Table I.
TABLE I
Basis Metal Tin Magnesium Plating Metal Copper Tin 1 572332 TABLE 1 (continued) Magnesium Copper Magnesium Zinc Magnesium Cadmium Aluminium Tin Aluminium Copper Aluminium Zinc Aluminium Nickel Zinc Copper Zinc Tin Zinc Nickel Zinc Silver Lead Tin Lead Copper Lead Silver Typically the plating metal may be present in the ink composition in the form of e g.
stannates such as sodium stannate; cyanides such as copper cyanide, cadmium cyanide, zinc cyanide, and silver cyanide; sulphates such as nickel sulphate; nitrates such as silver nitrate The ink composition may be an alkaline bath e g copper cyanide bath, or an acid bath e g stannous chloride.
A typical bronze ink composition may contain copper sulphate Cu CN, potassium hydroxide KOH, and preferably one or more additives including e g Rochelle salts, gluconates, versenates.
It is preferred to describe bronze ink compositions in the terms of their content of (a) potassium cuprocyanide 2 KCN CWCN, (b) free potassium cyanide KCN, (c) potassium stannate K 2 Sn(OH)6, and (d) potassium hydroxide KOH A typical bronze alkaline ink composition may contain the following:
Component Amount Preferred g/Iitre g/litre K 2 Sn(OH)6 25 175 90 2 KCN Cu CH 25-100 56 Free KCN 10 30 20 KOH 0 5 3 Additive: Rochelle salt 15 25.
A typical tin-zinc ink composition may.
contain zinc cyanide Zn(CN)2 potassium cyanide KCN, potassium stannate K 2 Sn(OH)6, and potassium hydroxide KOH Typically such a bath may have the following composition:
Component Amount Preferred g/litre g/litre K 2 Sn(OH)6 25 175 90 Z(CN)2 5 50 10 KCN 17 5 30 22 5 KOH 40 60 52 5.
The Electrolyte Component In order that the droplets of ink composition ejected from the nozzles may receive and hold an appropriate electrical charge, the ink composition must have a specific resistivity of less than 10,000 ohm cm generally within a range from 100 ohm cm to 10,000 ohm cm, the preferred operative range being from 150 and 3,000 ohm cm It has been found that some of the ink compositions used in this invention will naturally have a specific resistivity within the operable range without the necessary of adding an electrolytic component specifically for the purpose of adjusting the resistivity of the ink composition In general, however, it has been found that optimum results are obtained if 70 there is added to the ink composition an optional component which comprises a salt or mixture of salts which is soluble in the ink composition and which has no deleterious effects on the printing apparatus or on the 75 printed substrate Particularly satisfactory for this use is paratoluene sulphonic acid although alkali metal chlorides, nitrates, sulphates and similarly soluble salts may also be used Dimethylaniine hydrochloride, which 80 has a high solubility in the solvent media hereinbefore described, is of particular utility because of this property.
The electrolyte component may be added in an amount which will be effective in lower 85 ing the specific resistivity of a given ink composition to the desired level The effective amount of electrolyte will vary from zero to 2 or 3 % or higher, depending on the original resistivity of the ink composition and on the 90 resistivity desired Amounts of the preferred electrolytes in excess of about 1 5 % are generally considered unnecessary and are therefore economically undesirable Higher slat concentrations result in ink composition 95 of progressively lower resistivity Although ink compositions of very low specific resistivity are quite operable in the process of jet printing, resistivity values of less than about 100 ohm cm present no particular advantage over those 100 inks having a resistivity from 100 to 300 ohm cm., the latter range of values being considered optimum The alkali metal salts previously mentioned may also be used in concentrations up to about 2 0 %, higher concentrations being 105 both unnecessary and difficult to maintain because of the limited solubility of these materials in the solvent media used in the ink compositions employed in this invention.
Because of their greater solubility in the alcohol-110 water solvent system, the preferred salts are dimethylamine hydrochloride and lithium chloride, used either alone or in combination, in a total salt concentration of about 1 5 % by weight of the ink composition 115 Practice of this invention may be observed from the following examples, wherein parts therein are by weight.
EXAMPLE 1
Tin plate was printed with a jet printing ink 120 composition composed of 2 5 parts of copper sulphate, 100 0 parts of water and 2 5 parts of paratoluene sulphonic acid The resulting plate exhibited good adhesion and other properties.
EXAMPLE 2 125
Tin plate was printed with a jet printing ink composition composed of 5 0 parts of copper sulphate, 55 0 parts of water and 10 0 parts of para toluene sulphonic acid The resulting plate exhibited good adhesion and other properties 130 1 572332 EXAMPLE 3
Tin plate was printed with a jet printing ink composition composed of 5 0 parts of silver nitrate, 40 parts of water, 1 0 part of nitric acid and 54 0 parts of methanol The resulting plate exhibited good adhesion and other properties.
With regard to Examples 1, 2 and 3, the jet printing procedure comprised continuously imprinting uniform droplets of the respective jet printing ink composition onto the plate, the droplets emitting from at least one ink jet electromagnetically energized to emit the droplets at a rate of 8 to 150 kilohertz, each of the three jet printing ink compositions exhibiting a viscosity at 68 F of 1 5 to 16 cps, having a p H of 0 5 to 9 5 and a specific resistivity of less than 10,000 ohm cm.

Claims (1)

WHAT WE CLAIM IS:-
1 A process for plating a substrate of a basis metal or metal alloy by jet printing of the substrate with at least one plating metal, the process comprising continuously imprinting uniform droplets of a jet printing ink composition containing at least one water-soluble salt as a source of at least one plating metal which is more noble than the substrate, the jet printing ink composition exhibiting a viscosity at 680 F of 1 5 to 16 cps, having a p H of 0 5 to 9.5 and a specific resistivity of less than 10,000 ohm cm, onto the basis metal substrate, and the droplets emitting from at least one ink jet electromagnetically enirgized to emit the droplets at a rate of 8 to 150 kilohertz.
2 A process according to Claim 1, wherein the basis metal comprises tin or a tin alloy.
3 A process according to Claim 1, wherein the basis metal comprises copper, zinc or nickel or an alloy of copper, zinc or nickel.
4 A process according to Claim 1, wherein the basis metal comprises steel.
A process according to Claim 4, wherein the at least one plating metal comprises tin, copper, zinc, cadmium or silver.
6 A process according to Claim 1, wherein the at least one plating metal comprises copper, zinc, nickel or silver.
7 A process according to Claim 1 substantially as herein described and exemplified.
8 A substrate of a basis metal or metal alloy which has been plated by the process claimed in any preceding claim.
9 A process for the plating of a substrate of a basis metal or metal alloy by jet printing of the substrate with at least one plating metal, the process comprising printing the substrate first with a jet printing ink composition containing at least one water-soluble salt as a source of at least one plating metal which is more noble than the substrate, the substrate 60 having an activated surface, subsequently jet printing the activated surface of the substrate with a jet printing ink composition containing:
( 1) plating metal ions in substantially the same concentration as in the first jet printing -65 ink composition and in addition thereto, ( 2) ions of an auxiliary plating metal not present in the first jet printing ink composition.
A process according to Claim 9, wherein the substrate having an activated surface is a 70 basis metal or metal alloy not comprising tin but which has been tin plated to provide the activated surface.
11 A process according to Claim 10, wherein each of the first and second jet printing, 75 ink compositions contains copper.
12 A process according to Claim 9, wherein the substrate comprises aluminium or an alloy thereof and the auxiliary plating metal comprises copper 80 13 A process for the plating of a substrate of aluminium or aluminium alloy by jet printing of the substrate with at least one plating metal, the process comprising printing the substrate with a first jet printing ink composition 85substantially free of active copper ions and con-| taining at least one water-soluble salt as a source of at least one plating metal which is more noble than the substrate, the substrate having an activated surface, subsequently jet 90 printing the activated surface with a second jet printing ink composition containing:
( 1) a water-soluble stannate in substantially the same concentration as in the first ink composition and in addition thereto, 95 ( 2) ions of copper, to obtain a plate containing tin and copper.
14 A process according to Claim 9 or Claim 13, substantially as herein described.
A substrate of a basis metal or metal 100 alloy which has been plated by the process claimed in any one of Claims 9 to 14.
MEWBURN ELLIS & CO.
Chartered Patent Agents, 70-72 Chancery Lane, London WC 2 A l AD.
Agents for the applicants Printed for Her Majesty’s Stationery Office by MULTIPLEX techniques ltd, St Mary Cray, Kent 1980 Published at the Patent Office, 25 Southampton Buildings, London WC 2 1 AY, from which copies may be obtained.

GB21696/78A
1977-06-07
1978-05-23
Plating of substrates by jet printing

Expired

GB1572332A
(en)

Applications Claiming Priority (1)

Application Number
Priority Date
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Title

US05/804,469

US4242369A
(en)

1977-06-07
1977-06-07
Plating of substrates by jet printing

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GB1572332A
true

GB1572332A
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1980-07-30

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Priority Date
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GB21696/78A
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GB1572332A
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1977-06-07
1978-05-23
Plating of substrates by jet printing

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US4242369A
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JPS544247A
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AU3670978A
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BE867833A
(en)

DE
(1)

DE2823826A1
(en)

FR
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FR2393683A1
(en)

GB
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GB1572332A
(en)

IT
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IT1103433B
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NL7806206A
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Selective substrate metallization

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Molex Incorporated
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Method of fabricating an electrical component

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US05/804,469
patent/US4242369A/en
not_active
Expired – Lifetime

1978

1978-05-23
GB
GB21696/78A
patent/GB1572332A/en
not_active
Expired

1978-05-31
AU
AU36709/78A
patent/AU3670978A/en
active
Pending

1978-05-31
DE
DE19782823826
patent/DE2823826A1/en
not_active
Withdrawn

1978-06-02
FR
FR787816584A
patent/FR2393683A1/en
not_active
Withdrawn

1978-06-05
BE
BE188335A
patent/BE867833A/en
unknown

1978-06-05
IT
IT09488/78A
patent/IT1103433B/en
active

1978-06-07
NL
NL7806206A
patent/NL7806206A/en
not_active
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patent/JPS544247A/en
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1998-01-14
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Ibm
autocatalytic chemical deposition of Zinc/tin alloy

US6045604A
(en)

1998-01-14
2000-04-04
International Business Machines Corporation
Autocatalytic chemical deposition of zinc tin alloy

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IT7809488D0
(en)

1978-06-05

DE2823826A1
(en)

1979-02-15

US4242369A
(en)

1980-12-30

BE867833A
(en)

1978-12-05

JPS544247A
(en)

1979-01-12

NL7806206A
(en)

1978-12-11

AU3670978A
(en)

1979-12-06

IT1103433B
(en)

1985-10-14

FR2393683A1
(en)

1979-01-05

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