GB1582341A – Printed circuit board
– Google Patents
GB1582341A – Printed circuit board
– Google Patents
Printed circuit board
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Publication number
GB1582341A
GB1582341A
GB17981/76A
GB1798176A
GB1582341A
GB 1582341 A
GB1582341 A
GB 1582341A
GB 17981/76 A
GB17981/76 A
GB 17981/76A
GB 1798176 A
GB1798176 A
GB 1798176A
GB 1582341 A
GB1582341 A
GB 1582341A
Authority
GB
United Kingdom
Prior art keywords
board
conductive
holes
face
printed circuit
Prior art date
1976-05-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB17981/76A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Development Corp UK
National Research Development Corp of India
Original Assignee
National Research Development Corp UK
National Research Development Corp of India
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1976-05-03
Filing date
1976-05-03
Publication date
1981-01-07
1976-05-03
Application filed by National Research Development Corp UK, National Research Development Corp of India
filed
Critical
National Research Development Corp UK
1976-05-03
Priority to GB17981/76A
priority
Critical
patent/GB1582341A/en
1977-04-29
Priority to US05/792,472
priority
patent/US4138784A/en
1981-01-07
Publication of GB1582341A
publication
Critical
patent/GB1582341A/en
Status
Expired
legal-status
Critical
Current
Links
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Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/0286—Programmable, customizable or modifiable circuits
H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/0286—Programmable, customizable or modifiable circuits
H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/17—Post-manufacturing processes
H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/49155—Manufacturing circuit on or in base
Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Description
PATENT SPECIFICATION
( 21) Application No 17981176 ( 22) Filed 3 \ It ( 23) Complete Specification filed 29 April 1977
( 44) Complete Specification published 7 Jan 1981
00 ( 51) INT CL 3 H 05 K 3/04 1/04 r- ( 52) Index at acceptance H 1 R 2 A 1 E 2 A 4 M 2 K ( 11) 1 582 341 4 ay 1976 ( 72) Inventor ALBERT WATSON NICHOLSON ( 54) PRINTED CIRCUIT BOARD ( 71) We, NATIONAL RESEARCH DEVELOPMENT CORPORATION, a British Corporation established by Statute, of Kingsway House, 66-74 Victoria Street, London, S W 1, do hereby declare the invention for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:
The present invention relates to a printed circuit board having means for connection between conductive areas on one face of the board and similar areas on the other face.
It is common practice in the design of printed circuits for related circuits or parts of a single circuit to be laid out on opposite faces of a board At each point where an interconnection is required a hole is drilled through the board and the wall of the hole is plated to provide a conducting path The plating is extended from the hole on each face to form a contact area or pad for use as a junction with the printed wiring at that point If an interconnection is required to cross a printed wiring track a wire link must be used, spaced from the board face to form a bridge, with the ends soldered into the appropriate plated holes A wire link is similarly used if an option exists for the connection of one point to one of two or more other points, particularly in a situation where the choice is not determined until the board is put into use Considerable flexibility of design is possible at the expense of convenience in use by such methods.
A first aspect of the present invention comprises a method for producing a printed circuit board to provide selective connection between conductive areas on one face of the board and conductive areas on the other face of the board, the board being pierced by a plurality of holes extending from one face to the other and each of the holes having initially a wall lining of conductive material effective to provide electrical connection between one such conductive area on one face of the board 50 and a corresponding conductive area on the other face, the method comprising the step of removing the conductive lining material from at least a selected one of the holes, to an extent effective to break 55 the electrical connection provided by such lining.
Another aspect of the invention comprises a method for producing a printed circuit board to provide selective connec 60 tion between conductive areas on one face of the board and conductive areas on the other face of the board, the board being pierced by a plurality of holes extending from one face to the other, the method 65 comprising the steps of providing for each of the holes a wall lining of conductive material effective to provide electrical connection between one such conductive area on one face of the board and a corres 70 ponding conductive area on the other face and removing the conductive lining from at least a selected one of the holes, to an extent to break the electrical connection provided by such lining 75 The conductive wall material of the or each hole may be removed by drilling the hole oversize.
The oversize drilling may extend only partially through the hole and may be 80 such as to produce a chamfer on the edge of the hole.
According to a further aspect of the invention a printed circuit board comprises a plurality of holes having conductive wall 85 linings, each of the holes extending through the board between a respective conductive area on one face and a corresponding conductive area on the other face, the conductive wall lining of at least one of the holes 90 1 582341 extending completely through the board so as to provide electrical connection between the associated conductive areas, and at least a selected one of the holes being at least partially enlarged to provide a break in electrical continuity therethrough.
It will be apparent that a printed circuit board in accordance with the invention provides a simple and economical solution to the problem of providing variants on a standard pattern of interconnection which is commonly met by the use of wire links.
A basic printed circuit board can be designed having as many possible patterns of interconnection which is commonly met by the use of wire links A basic printed circuit board can be designed having as many possible patterns of interconnection as may be required, and at the time when a specific selection is made of a particular form of circuit, those connections which are not in fact required are then readily removed.
An embodiment of the invention will be described with reference to the accompanying drawings in which: Figure la represents diagrammatically a cross-section of a printed circuit board for use in carrying out the invention; Figure lb represents diagrammatically the board of Figure la after carrying out the invention; Figure lc represents diagrammatically a printed circuit board using a conventional wire bridge; and Figure 2 illustrates the use of a printed circuit board in accordance with the invention in the control of input-output connections to a computer.
Referring to Figure la the upper surface of a printed circuit board 1 is viewed to show the initial state in which two similar holes 2, 3 are drilled through the board 1 and are internally plated or fitted with bushes to provide respective conductive wall linings 4 and 5 The lining 4 makes contact with a printed conductor 6 on the upper surface of the board 1 at a pad 7 and the lining 5 makes contact with a similar printed conductor 8 at a pad 9.
On the lower surface of the board 1 a printed conductor 10 lies transversely to the conductors 6 and 8 and in contact with both of the linings 4 and 5 at an elongated pad 11 The conductor 10 is therefore connected to both of the conductors 6 and 8.
The board 1 may be supplied for use in any application in which one of the interconnections 6-8-10, 6-10 and 8-10 is required To obtain only the interconnection 6-10 the interconnection 8-10 is broken by drilling the hole 3 oversize for part or the whole of its length through the board 1.
Figure lb shows a section through the board 1 in the plane which contains the holes 2 and 3 to illustrate the selection of the interconnection 6-10 In order to minimise the depth of drilling, while ensuring a substantial gap in the conductive path, the hole 3 is chamfered to give a 70 conical insulating surface 12 between the lining 5 and the pad 9 A chamfer is particularly suitable when a current path is to be broken during development or on installation, since it is easily producing 75 using a drill hand-held in a pin vice for example The interconnection 8-10 may of course be broken by drilling the hole 3 oversize from the end opposite to that for which the chamfer 12 is shown It will be 80 noted particularly that the greatest diameter of the chamfered surface 12 lies within the width of the pad 9 so that the conductor 8 remains continuous from one end of the pad 9 to the other The width 85 of the pads 7, 9 and 11 is also sufficient to enable the plating of a hole drilled by mistake to be reconnected by means of a conductive eyelet or clip which can be pressed into the hole to make contact with 90 the pad on each side of the board or with one pad and a remaining portion of wall plating.
The simplicity of the operation illustrated in Figure lb may be compared with the 95 use of a wire bridge shown in section at Figure lc to accomplish the same result in the conventional manner The board 1 again carries the conductor 6 and 8 (not shown) which make contact at pads 7 and 100 9 with plated holes 2 and 3 respectively.
The conductor 10 must initially be isolated from holes 2 and 3 and requires as a connecting point at pad 11 an additional hole 13 with a conductive lining 14 To 105 make the interconnection 6-10 a wire bridge 15 is soldered into the holes 2 and 13 and similarly would be soldered between the holes 3 and 13 for an interconnection 8-10 Usually the’ bridge 15 is fitted with 110 an insulating sleeve 16 to prevent accidental contact with the printed circuit.
Since the number of points in the circuit at which selection is required may be quite large the provision of an additional hole at 115 each point and the labour of soldering bridge connections may represent significant extra cost.
Referring to Figure 2 a printed circuit board in accordance with the invention is 120 shown as applied to the control of the input-output connections for a computer.
The underside of a board 19 carries a printed conductor 20 which makes contact with each hole of a column 21 of plated 125 through holes and a conductor 22 which makes contact with each hole of a similar column 23 A printed conductor 24 a lies on the upper surface of the board 19 transversely to the conductors 20, 22 and 130 1 582341 makes contact with a hole 25 a of the column 21 and a hole 26 a of the column 23 and similarly further transverse conductors 24 such as the conductor 24 b make contact with further similar holes such as the holes 25 b and 26 b Each of the conductors 24 is connected into an inputoutput interface logic unit 27, the conductor 20 is held at earth potential and the conductor 22 at a TTL bias potential of + 5 V connected via a resistor 28 Inputoutput controller address selection requires each address gate within the unit 27 to be referred to the potential of either the conductor 20 or the conductor 22 and this is done for each gate via one of the conductors 24 (say 24 a to k) the appropriate one of the corresponding holes 25, 26 being drilled out Similarly the correct phase for input data from peripheral devices is selected by connecting the common reference input of all input gates to one of the conductors 24 (say 24 m) and again drilling out the appropriate one of holes 25 m, 26 m.
The use of links to perform the address function is much less economical and convenient since an individual resistor, with two plated-through holes to accommodate it, must then be provided for each address bit When using links for phase selection an inverter is necessary for each bit which differs in phase from the majority of bits.
Two two-way selection functions have been described above as examples of the use of the invention arising in a particular application In the same application a one-way selection also arises in determining the vector-address in the associated computer to be used by the input-output controller.
This merely requires one connection for each digit from the unit 27 to a further series of plated holes 29 (say 29 a to g) on the board 19 If these connections such as the connection 30 at the hole 29 a are made on the upper surface of the board 19, connections such as the connection 31 at the same hole are made to the computer from the underside of the board 19.
Each vector bit becomes a ‘1 ‘ if the hole is left intact or a ‘0 ‘ if the hole is drilled out.
The circuit board of the invention is particularly advantageous in its application to experimental systems but may also be used where a number of different variations on a common pattern is to be produced in quantity This may be done for example by tape controlled drilling of a board of a standard design according to an appropriate program.
Claims (9)
WHAT WE CLAIM IS:-
1 A method for producing a printed circuit board to provide selective connection between conductive areas on one face of the board and conductive areas on the 65 other face of the board, the board being pierced by a plurality of holes extending from one face to the other and each of the holes having initially a wall lining of conductive material effective to provide elec 70 trical connection between one such conductive area on one face of the board and a corresponding conductive area on the other face, the method comprising the step of removing the conductive lining material 75 from at least a selected one of the holes, to an extent effective to break the electrical connection provided by such lining.
2 A method for producing a printed circuit board to provide selective connec 80 tion between conductive areas on one face of the board and conductive areas on the other face of the board, the board being pierced by a plurality of holes extending from one face to the other, the method 85 comprising the steps of providing for each of the holes a wall lining of conductive material effective to provide electrical connection between one such conductive area on one face of the board and a corre 90 sponding conductive area on the other face and removing the conductive lining from at least a selected one of the holes, to an extent effective to break the electrical connection provided by such lining 95
3 A method according to Claim 1 or Claim 2 in which the step of removing the conductive lining material comprises the operation of at least partially enlarging the selected one of the holes 100
4 A method according to Claim 3 in which the operation comprises chamfering one end of the hole to expose the insulating material of the board.
A method according to Claim 3 in 105 which the operation comprises boring the hole to an increased diameter over at least part of its length.
6 A printed circuit board comprising a plurality of holes having conductive wall 110 linings, each of the holes extending through the board between a respective conductive area on one face and a corresponding conductive area on the other face, the conductive wall lining of at least one of the 115 holes extending completely through the board so as to provide electrical connection between the associated conductive areas, and at least a selected one of the holes being at least partially enlarged to provide 120 1 582 341 a break in electrical continuity therethrough.
7 A printed circuit board according to Claim 5 in which the selected one of the holes is bored oversize.
8 A printed circuit board according to Claim 5 in which the selected one of the holes is chamfered at one end to expose the insulating material of the board.
9 A printed circuit board substantially 10 as hereinbefore described with reference to and as shown in Figure lb of the accompanying drawings.
N N DAVIS, Chartered Patent Agent.
Agent for the Applicants.
Printed for Her Majesty’s Stationery Office by The Tweeddale Press Ltd, Berwick-upon-Tweed, 1980.
Published at the Patent Office, 25 Southampton Buildings, London, WC 2 A IAY, from which copies may be obtained.
GB17981/76A
1976-05-03
1976-05-03
Printed circuit board
Expired
GB1582341A
(en)
Priority Applications (2)
Application Number
Priority Date
Filing Date
Title
GB17981/76A
GB1582341A
(en)
1976-05-03
1976-05-03
Printed circuit board
US05/792,472
US4138784A
(en)
1976-05-03
1977-04-29
Method of making printed circuit board
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB17981/76A
GB1582341A
(en)
1976-05-03
1976-05-03
Printed circuit board
Publications (1)
Publication Number
Publication Date
GB1582341A
true
GB1582341A
(en)
1981-01-07
Family
ID=10104581
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB17981/76A
Expired
GB1582341A
(en)
1976-05-03
1976-05-03
Printed circuit board
Country Status (2)
Country
Link
US
(1)
US4138784A
(en)
GB
(1)
GB1582341A
(en)
Families Citing this family (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2555011B1
(en)
*
1983-11-15
1986-01-24
Thomson Csf
PRINTED IMPRINT CARD
US5256711A
(en)
1991-10-04
1993-10-26
Director-General Of Agency Of Industrial Science
Starch-containing biodegradable plastic and method of producing same
US6360435B1
(en)
*
1999-08-25
2002-03-26
Qualcomm Incorporated
Bidirectional interface tool for PWB development
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3163588A
(en)
*
1955-02-14
1964-12-29
Technograph Printed Electronic
Method of interconnecting pathway patterns of printed circuit products
US3102213A
(en)
*
1960-05-13
1963-08-27
Hazeltine Research Inc
Multiplanar printed circuits and methods for their manufacture
US3571923A
(en)
*
1968-12-30
1971-03-23
North American Rockwell
Method of making redundant circuit board interconnections
US4017968A
(en)
*
1975-09-18
1977-04-19
Jerobee Industries, Inc.
Method of making plated through hole printed circuit board
1976
1976-05-03
GB
GB17981/76A
patent/GB1582341A/en
not_active
Expired
1977
1977-04-29
US
US05/792,472
patent/US4138784A/en
not_active
Expired – Lifetime
Also Published As
Publication number
Publication date
US4138784A
(en)
1979-02-13
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Legal Events
Date
Code
Title
Description
1981-03-25
PS
Patent sealed [section 19, patents act 1949]
1986-12-31
PCNP
Patent ceased through non-payment of renewal fee
