GB2003068A – Eutectic die attachment method for integrated circuits
– Google Patents
GB2003068A – Eutectic die attachment method for integrated circuits
– Google Patents
Eutectic die attachment method for integrated circuits
Info
Publication number
GB2003068A
GB2003068A
GB7830557A
GB7830557A
GB2003068A
GB 2003068 A
GB2003068 A
GB 2003068A
GB 7830557 A
GB7830557 A
GB 7830557A
GB 7830557 A
GB7830557 A
GB 7830557A
GB 2003068 A
GB2003068 A
GB 2003068A
Authority
GB
United Kingdom
Prior art keywords
integrated circuits
attachment method
die attachment
eutectic die
eutectic
Prior art date
1977-08-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7830557A
Other versions
GB2003068B
(en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1977-08-26
Filing date
1978-07-20
Publication date
1979-03-07
1978-07-20
Application filed by Hughes Aircraft Co
filed
Critical
Hughes Aircraft Co
1979-03-07
Publication of GB2003068A
publication
Critical
patent/GB2003068A/en
1982-04-28
Application granted
granted
Critical
1982-04-28
Publication of GB2003068B
publication
Critical
patent/GB2003068B/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 – H01L21/326, e.g. sealing of a cap to a base of a container
H01L21/52—Mounting semiconductor bodies in containers
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
H01L21/86—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, «first-level» interconnects; Manufacturing methods related thereto
H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, «first-level» interconnects; Manufacturing methods related thereto
H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
H01L2224/29001—Core members of the layer connector
H01L2224/29099—Material
H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/8319—Arrangement of the layer connectors prior to mounting
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/838—Bonding techniques
H01L2224/83801—Soldering or alloying
H01L2224/83805—Soldering or alloying involving forming a eutectic alloy at the bonding interface
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/838—Bonding techniques
H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
H01L2224/852—Applying energy for connecting
H01L2224/85201—Compression bonding
H01L2224/85205—Ultrasonic bonding
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01005—Boron [B]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01015—Phosphorus [P]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01023—Vanadium [V]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01033—Arsenic [As]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01079—Gold [Au]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/0132—Binary Alloys
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/0132—Binary Alloys
H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/06—Polymers
H01L2924/0665—Epoxy resin
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/06—Polymers
H01L2924/078—Adhesive characteristics other than chemical
H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/12—Passive devices, e.g. 2 terminal devices
H01L2924/1204—Optical Diode
H01L2924/12042—LASER
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/14—Integrated circuits
GB7830557A
1977-08-26
1978-07-20
Eutectic die attachment method for integrated circuits
Expired
GB2003068B
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US05/828,124
US4181249A
(en)
1977-08-26
1977-08-26
Eutectic die attachment method for integrated circuits
Publications (2)
Publication Number
Publication Date
GB2003068A
true
GB2003068A
(en)
1979-03-07
GB2003068B
GB2003068B
(en)
1982-04-28
Family
ID=25250978
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB7830557A
Expired
GB2003068B
(en)
1977-08-26
1978-07-20
Eutectic die attachment method for integrated circuits
Country Status (4)
Country
Link
US
(1)
US4181249A
(en)
JP
(1)
JPS5447480A
(en)
FR
(1)
FR2401523A1
(en)
GB
(1)
GB2003068B
(en)
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Title
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1981-10-06
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Low resistance backside preparation for semiconductor integrated circuit chips
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Method for mounting a sapphire chip on a metal base and article produced thereby
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1985-02-14
1988-06-21
Kabushiki Kaisha Toshiba
Method and apparatus for handling semiconductor wafers
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1986-09-08
1988-04-12
M/A-Com, Inc.
Method of making microwave integrated circuits
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1991-03-09
1995-05-04
Bosch Gmbh Robert
Process for mounting silicon wafers on metallic mounting surfaces
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Proportional micromechanical device
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Proportional micromechanical valve
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Microvalve with pressure equalization
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1999-01-28
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International Business Machines Corporation
Method for reinforcing a semiconductor device to prevent cracking
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Thermally actuated microvalve device
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Kelsey-Hayes Company
High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
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Microstaq, INC
Thermally actuated microvalve with multiple fluid ports
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盾安美斯泰克股份有限公司
Process for reconditioning semiconductor surface to facilitate bonding
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Microstaq, Inc.
Process and structure for high temperature selective fusion bonding
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US
US05/828,124
patent/US4181249A/en
not_active
Expired – Lifetime
1978
1978-07-20
GB
GB7830557A
patent/GB2003068B/en
not_active
Expired
1978-07-27
FR
FR7822245A
patent/FR2401523A1/en
active
Granted
1978-08-25
JP
JP10373478A
patent/JPS5447480A/en
active
Pending
Also Published As
Publication number
Publication date
US4181249A
(en)
1980-01-01
JPS5447480A
(en)
1979-04-14
FR2401523A1
(en)
1979-03-23
FR2401523B1
(en)
1983-11-25
GB2003068B
(en)
1982-04-28
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1979-04-05
Semiconductor ic
JPS5415651A
(en)
1979-02-05
Semiconductor ic
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1987-03-11
PCNP
Patent ceased through non-payment of renewal fee
