AU3075289A – Resistive metal layers and method for making same
– Google Patents
AU3075289A – Resistive metal layers and method for making same
– Google Patents
Resistive metal layers and method for making same
Info
Publication number
AU3075289A
AU3075289A
AU30752/89A
AU3075289A
AU3075289A
AU 3075289 A
AU3075289 A
AU 3075289A
AU 30752/89 A
AU30752/89 A
AU 30752/89A
AU 3075289 A
AU3075289 A
AU 3075289A
AU 3075289 A
AU3075289 A
AU 3075289A
Authority
AU
Australia
Prior art keywords
metal layers
making same
resistive metal
resistive
making
Prior art date
1988-02-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU30752/89A
Other versions
AU622637B2
(en
Inventor
Sidney J. Clouser
Chinho Lee
Mary Katherine Prokop
Christopher J. Whewell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Gould Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1988-02-26
Filing date
1989-02-24
Publication date
1989-08-31
1989-02-24
Application filed by Gould Electronics Inc
filed
Critical
Gould Electronics Inc
1989-08-31
Publication of AU3075289A
publication
Critical
patent/AU3075289A/en
1992-04-16
Application granted
granted
Critical
1992-04-16
Publication of AU622637B2
publication
Critical
patent/AU622637B2/en
1994-03-31
Assigned to GOULD ELECTRONICS INC
reassignment
GOULD ELECTRONICS INC
Alteration of Name(s) in Register under S187
Assignors: GOULD INC.
2009-02-24
Anticipated expiration
legal-status
Critical
Status
Ceased
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01C—RESISTORS
H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01C—RESISTORS
H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
H01C17/14—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition
H01C17/16—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition using electric current
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01C—RESISTORS
H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C7/006—Thin film resistors
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/03—Conductive materials
H05K2201/032—Materials
H05K2201/0323—Carbon
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/03—Conductive materials
H05K2201/0332—Structure of the conductor
H05K2201/0335—Layered conductors or foils
H05K2201/0355—Metal foils
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/03—Metal processing
H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/03—Metal processing
H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0703—Plating
H05K2203/0723—Electroplating, e.g. finish plating
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
AU30752/89A
1988-02-26
1989-02-24
Resistive metal layers and method for making same
Ceased
AU622637B2
(en)
Applications Claiming Priority (6)
Application Number
Priority Date
Filing Date
Title
US16079488A
1988-02-26
1988-02-26
US16079588A
1988-02-26
1988-02-26
US160795
1988-02-26
US160794
1988-02-26
US30749389A
1989-02-09
1989-02-09
US307493
1989-02-09
Publications (2)
Publication Number
Publication Date
AU3075289A
true
AU3075289A
(en)
1989-08-31
AU622637B2
AU622637B2
(en)
1992-04-16
Family
ID=27388511
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU30752/89A
Ceased
AU622637B2
(en)
1988-02-26
1989-02-24
Resistive metal layers and method for making same
Country Status (9)
Country
Link
EP
(2)
EP1011111A1
(en)
JP
(1)
JP3022969B2
(en)
KR
(1)
KR920007430B1
(en)
CN
(1)
CN1051198C
(en)
AU
(1)
AU622637B2
(en)
BR
(1)
BR8900871A
(en)
IL
(1)
IL89407A0
(en)
IN
(1)
IN171824B
(en)
MY
(1)
MY104939A
(en)
Families Citing this family (8)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US5243320A
(en)
*
1988-02-26
1993-09-07
Gould Inc.
Resistive metal layers and method for making same
US6281090B1
(en)
*
1996-10-16
2001-08-28
Macdermid, Incorporated
Method for the manufacture of printed circuit boards with plated resistors
US6194990B1
(en)
*
1999-03-16
2001-02-27
Motorola, Inc.
Printed circuit board with a multilayer integral thin-film metal resistor and method therefor
US6622374B1
(en)
*
2000-09-22
2003-09-23
Gould Electronics Inc.
Resistor component with multiple layers of resistive material
EP1261241A1
(en)
*
2001-05-17
2002-11-27
Shipley Co. L.L.C.
Resistor and printed wiring board embedding those resistor
JP4761792B2
(en)
*
2005-03-02
2011-08-31
ローム株式会社
Low resistance chip resistor and manufacturing method thereof
CN100397960C
(en)
*
2005-04-08
2008-06-25
神基科技股份有限公司
Printed circuit board structure and method for manufacturing same
JP4487875B2
(en)
2005-07-20
2010-06-23
セイコーエプソン株式会社
Method for manufacturing electronic substrate, method for manufacturing electro-optical device, and method for manufacturing electronic device
Family Cites Families (8)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE2165622C3
(en)
*
1971-12-30
1979-01-04
Siemens Ag, 1000 Berlin Und 8000 Muenchen
Thin film circuit
US3886578A
(en)
*
1973-02-26
1975-05-27
Multi State Devices Ltd
Low ohmic resistance platinum contacts for vanadium oxide thin film devices
JPS5469768A
(en)
*
1977-11-14
1979-06-05
Nitto Electric Ind Co
Printing circuit substrate with resistance
US4190474A
(en)
*
1977-12-22
1980-02-26
Gould Inc.
Method of making a printed circuit board having mutually etchable copper and nickel layers
DE3321900C2
(en)
*
1982-06-16
1986-01-16
Nitto Electric Industrial Co., Ltd., Ibaraki, Osaka
Substrate for a circuit with a resistive layer and method for its manufacture
JPS6016117B2
(en)
*
1982-06-16
1985-04-23
日東電工株式会社
Circuit board with resistor and its manufacturing method
US4808967A
(en)
*
1985-05-29
1989-02-28
Ohmega Electronics
Circuit board material
US4682143A
(en)
*
1985-10-30
1987-07-21
Advanced Micro Devices, Inc.
Thin film chromium-silicon-carbon resistor
1989
1989-02-23
EP
EP99124541A
patent/EP1011111A1/en
not_active
Withdrawn
1989-02-23
EP
EP19890103215
patent/EP0330210A3/en
not_active
Withdrawn
1989-02-24
MY
MYPI89000225A
patent/MY104939A/en
unknown
1989-02-24
IL
IL89407A
patent/IL89407A0/en
unknown
1989-02-24
AU
AU30752/89A
patent/AU622637B2/en
not_active
Ceased
1989-02-24
CN
CN89102522A
patent/CN1051198C/en
not_active
Expired – Fee Related
1989-02-24
IN
IN157/CAL/89A
patent/IN171824B/en
unknown
1989-02-24
BR
BR898900871A
patent/BR8900871A/en
unknown
1989-02-27
JP
JP1046346A
patent/JP3022969B2/en
not_active
Expired – Fee Related
1989-02-27
KR
KR1019890002330A
patent/KR920007430B1/en
not_active
IP Right Cessation
Also Published As
Publication number
Publication date
BR8900871A
(en)
1989-10-17
IN171824B
(en)
1993-01-23
KR920007430B1
(en)
1992-08-31
CN1051198C
(en)
2000-04-05
EP0330210A3
(en)
1990-11-07
JP3022969B2
(en)
2000-03-21
AU622637B2
(en)
1992-04-16
MY104939A
(en)
1994-07-30
KR890013225A
(en)
1989-09-22
CN1040298A
(en)
1990-03-07
EP0330210A2
(en)
1989-08-30
EP1011111A1
(en)
2000-06-21
JPH01309301A
(en)
1989-12-13
IL89407A0
(en)
1989-09-10
Similar Documents
Publication
Publication Date
Title
AU568216B2
(en)
1987-12-17
Multilayer coating and method
AU3037389A
(en)
1989-08-25
Heating element and method for making such a heating element
AU3135689A
(en)
1989-10-19
Antimicrobial powders and method for making same
AU1510792A
(en)
1992-09-17
Wax-encapsulated particles and method for making same
AU3785789A
(en)
1990-04-05
Filter element and manufacture method thereof
AU3281389A
(en)
1989-08-25
Varied-light transmittance article and method for repairing same
AU3134893A
(en)
1993-06-15
Micro-libraries and methods for making and manipulating them
ZA853957B
(en)
1986-02-26
Multilayer coating and method
AU2770289A
(en)
1989-07-20
Material working-tools and method for lubricating
AU3480289A
(en)
1989-11-16
Wrapping method and apparatus
GB2217531B
(en)
1992-09-30
Fuse and manufacturing method therefor
AU4108889A
(en)
1990-03-08
Construction apparatus and construction method
AU4196285A
(en)
1985-11-07
Wrapping method and apparatus
AU2251388A
(en)
1989-11-29
Quadflex bucket apparatus and method
AU3381289A
(en)
1989-11-02
Sizing composition and sizing method
AU2270888A
(en)
1989-04-06
Variable transverse webber and method
AU3772489A
(en)
1990-05-28
Erosion-control matting and method for making same
EP0407893A3
(en)
1991-10-23
Resistor film and method for forming the same
AU3075289A
(en)
1989-08-31
Resistive metal layers and method for making same
AU3139389A
(en)
1989-09-28
Data-processing apparatus and method
GB2220420B
(en)
1991-05-29
Sintered alloy and method for manufacturing the same
AU2938889A
(en)
1989-11-24
Method and apparatus for magnetron sputtering
AU4577489A
(en)
1990-09-13
Encased product and method for encasing the same
AU3864589A
(en)
1990-02-05
Length measuring method and means
AU4026493A
(en)
1993-11-18
Gauging system with improved setup and operating method
None