AU3168171A – Method of making additive printed circuit boards and product thereof
– Google Patents
AU3168171A – Method of making additive printed circuit boards and product thereof
– Google Patents
Method of making additive printed circuit boards and product thereof
Info
Publication number
AU3168171A
AU3168171A
AU31681/71A
AU3168171A
AU3168171A
AU 3168171 A
AU3168171 A
AU 3168171A
AU 31681/71 A
AU31681/71 A
AU 31681/71A
AU 3168171 A
AU3168171 A
AU 3168171A
AU 3168171 A
AU3168171 A
AU 3168171A
Authority
AU
Australia
Prior art keywords
product
printed circuit
circuit boards
making additive
additive printed
Prior art date
1971-07-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU31681/71A
Other versions
AU451925B2
(en
Inventor
MERSEREAU HAROLD L. RHODENITZER JOHN J. GRUNWALD and WILLIAM P. INNES MARK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1971-07-27
Filing date
1971-07-27
Publication date
1973-02-01
1971-07-27
Application filed by MacDermid Inc
filed
Critical
MacDermid Inc
1971-07-27
Priority to AU31681/71A
priority
Critical
patent/AU451925B2/en
1973-02-01
Publication of AU3168171A
publication
Critical
patent/AU3168171A/en
1974-08-22
Application granted
granted
Critical
1974-08-22
Publication of AU451925B2
publication
Critical
patent/AU451925B2/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
C23C18/18—Pretreatment of the material to be coated
C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C18/28—Sensitising or activating
C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
C23C18/18—Pretreatment of the material to be coated
C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 – C23C18/30
C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 – C23C18/30 by chemical pretreatment
C23C18/2073—Multistep pretreatment
C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
C23C18/18—Pretreatment of the material to be coated
C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C18/22—Roughening, e.g. by etching
C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
C23C18/18—Pretreatment of the material to be coated
C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C18/22—Roughening, e.g. by etching
C23C18/26—Roughening, e.g. by etching using organic liquids
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
C23C18/18—Pretreatment of the material to be coated
C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C18/28—Sensitising or activating
C23C18/285—Sensitising or activating with tin based compound or composition
AU31681/71A
1971-07-27
1971-07-27
Method of making additive printed circuit boards and product thereof
Expired
AU451925B2
(en)
Priority Applications (1)
Application Number
Priority Date
Filing Date
Title
AU31681/71A
AU451925B2
(en)
1971-07-27
1971-07-27
Method of making additive printed circuit boards and product thereof
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
AU31681/71A
AU451925B2
(en)
1971-07-27
1971-07-27
Method of making additive printed circuit boards and product thereof
Publications (2)
Publication Number
Publication Date
AU3168171A
true
AU3168171A
(en)
1973-02-01
AU451925B2
AU451925B2
(en)
1974-08-22
Family
ID=3719346
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU31681/71A
Expired
AU451925B2
(en)
1971-07-27
1971-07-27
Method of making additive printed circuit boards and product thereof
Country Status (1)
Country
Link
AU
(1)
AU451925B2
(en)
1971
1971-07-27
AU
AU31681/71A
patent/AU451925B2/en
not_active
Expired
Also Published As
Publication number
Publication date
AU451925B2
(en)
1974-08-22
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