AU498066B2

AU498066B2 – Polishing copper
– Google Patents

AU498066B2 – Polishing copper
– Google Patents
Polishing copper

Info

Publication number
AU498066B2

AU498066B2
AU87473/75A
AU8747375A
AU498066B2
AU 498066 B2
AU498066 B2
AU 498066B2
AU 87473/75 A
AU87473/75 A
AU 87473/75A
AU 8747375 A
AU8747375 A
AU 8747375A
AU 498066 B2
AU498066 B2
AU 498066B2
Authority
AU
Australia
Prior art keywords
polishing copper
polishing
copper
Prior art date
1974-12-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
AU87473/75A
Other versions

AU8747375A
(en

Inventor
A. and FREDRIKSSON CO ERICSON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nordnerq AB

Original Assignee
Nordnero AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1974-12-13
Filing date
1975-12-11
Publication date
1979-02-08

1975-12-11
Application filed by Nordnero AB
filed
Critical
Nordnero AB

1977-06-16
Publication of AU8747375A
publication
Critical
patent/AU8747375A/en

1979-02-08
Application granted
granted
Critical

1979-02-08
Publication of AU498066B2
publication
Critical
patent/AU498066B2/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

C—CHEMISTRY; METALLURGY

C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL

C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25

C23F3/00—Brightening metals by chemical means

C23F3/04—Heavy metals

C23F3/06—Heavy metals with acidic solutions

AU87473/75A
1974-12-13
1975-12-11
Polishing copper

Expired

AU498066B2
(en)

Applications Claiming Priority (2)

Application Number
Priority Date
Filing Date
Title

SE7415649A

SE400581B
(en)

1974-12-13
1974-12-13

BATH FOR CHEMICAL POLISHING OF COPPER AND ITS ALLOYS

SESE7415649-

1974-12-13

Publications (2)

Publication Number
Publication Date

AU8747375A

AU8747375A
(en)

1977-06-16

AU498066B2
true

AU498066B2
(en)

1979-02-08

Family
ID=20322991
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

AU87473/75A
Expired

AU498066B2
(en)

1974-12-13
1975-12-11
Polishing copper

Country Status (7)

Country
Link

US
(1)

US4086176A
(en)

JP
(1)

JPS5821028B2
(en)

AU
(1)

AU498066B2
(en)

CA
(1)

CA1052674A
(en)

DE
(1)

DE2555810A1
(en)

GB
(1)

GB1503710A
(en)

SE
(1)

SE400581B
(en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US4141850A
(en)

*

1977-11-08
1979-02-27
Dart Industries Inc.
Dissolution of metals

US4158592A
(en)

*

1977-11-08
1979-06-19
Dart Industries Inc.
Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with ketone compounds

US4158593A
(en)

*

1977-11-08
1979-06-19
Dart Industries Inc.
Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with selenium compounds

US4217234A
(en)

*

1978-02-16
1980-08-12
Werner Krisp
Denture cleansing tablet and method of manufacturing the same

US4233113A
(en)

*

1979-06-25
1980-11-11
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant

US4236957A
(en)

*

1979-06-25
1980-12-02
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 SOY –H2 O.sub. -mercapto containing heterocyclic nitrogen etchant

US4233111A
(en)

*

1979-06-25
1980-11-11
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant

US4233112A
(en)

*

1979-06-25
1980-11-11
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -polysulfide etchant

US4452643A
(en)

*

1983-01-12
1984-06-05
Halliburton Company
Method of removing copper and copper oxide from a ferrous metal surface

US4491500A
(en)

*

1984-02-17
1985-01-01
Rem Chemicals, Inc.
Method for refinement of metal surfaces

JPS61173927U
(en)

*

1985-04-16
1986-10-29

JPS61173926U
(en)

*

1985-04-16
1986-10-29

US4724041A
(en)

*

1986-11-24
1988-02-09
Sherman Peter G
Liquid dispersion composition for, and method of, polishing ferrous components

US4724042A
(en)

*

1986-11-24
1988-02-09
Sherman Peter G
Dry granular composition for, and method of, polishing ferrous components

US4754803A
(en)

*

1987-02-02
1988-07-05
Phelps Dodge Industries, Inc.
Manufacturing copper rod by casting, hot rolling and chemically shaving and pickling

US4946520A
(en)

*

1987-02-02
1990-08-07
Phelps Dodge Industries, Inc.
Copper rod manufactured by casting, hot rolling and chemically shaving and pickling

JPS63161913U
(en)

*

1987-04-06
1988-10-21

US4859281A
(en)

*

1987-06-04
1989-08-22
Pennwalt Corporation
Etching of copper and copper bearing alloys

US4875972A
(en)

*

1988-07-27
1989-10-24
E. I. Du Pont De Nemours And Company
Hydrogen peroxide compositions containing a substituted oxybenzene compound

US4915781A
(en)

*

1988-07-27
1990-04-10
E. I. Du Pont De Nemours And Company
Stabilized hydrogen peroxide compositions

US4875973A
(en)

*

1988-07-27
1989-10-24
E. I. Du Pont De Nemours And Company
Hydrogen peroxide compositions containing a substituted aminobenzaldehyde

IT1251431B
(en)

*

1991-10-25
1995-05-09
Costante Fontana

COMPOUND WITH HIGH STABILIZING CHARACTERISTICS, PARTICULARLY FOR INORGANIC PEROXIDES USED IN INDUSTRIAL APPLICATIONS

US5575885A
(en)

*

1993-12-14
1996-11-19
Kabushiki Kaisha Toshiba
Copper-based metal polishing solution and method for manufacturing semiconductor device

US6046110A
(en)

*

1995-06-08
2000-04-04
Kabushiki Kaisha Toshiba
Copper-based metal polishing solution and method for manufacturing a semiconductor device

US5795661A
(en)

*

1996-07-10
1998-08-18
Bethlehem Steel Corporation
Zinc coated steel sheet and strip having improved formability and surface quality and method thereof

US6309560B1
(en)

*

1996-12-09
2001-10-30
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper substrates

US5954997A
(en)

*

1996-12-09
1999-09-21
Cabot Corporation
Chemical mechanical polishing slurry useful for copper substrates

US6126853A
(en)

1996-12-09
2000-10-03
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper substrates

US6083419A
(en)

*

1997-07-28
2000-07-04
Cabot Corporation
Polishing composition including an inhibitor of tungsten etching

US6432828B2
(en)

1998-03-18
2002-08-13
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper substrates

US6217416B1
(en)

1998-06-26
2001-04-17
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper/tantalum substrates

US6063306A
(en)

*

1998-06-26
2000-05-16
Cabot Corporation
Chemical mechanical polishing slurry useful for copper/tantalum substrate

US6533832B2
(en)

1998-06-26
2003-03-18
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry and method for using same

US6046108A
(en)

1999-06-25
2000-04-04
Taiwan Semiconductor Manufacturing Company
Method for selective growth of Cu3 Ge or Cu5 Si for passivation of damascene copper structures and device manufactured thereby

US6599837B1
(en)

*

2000-02-29
2003-07-29
Agere Systems Guardian Corp.
Chemical mechanical polishing composition and method of polishing metal layers using same

JP2004526308A
(en)

*

2001-01-16
2004-08-26
キャボット マイクロエレクトロニクス コーポレイション

Polishing system and method containing ammonium oxalate

US6953389B2
(en)

*

2001-08-09
2005-10-11
Cheil Industries, Inc.
Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching

TW591089B
(en)

*

2001-08-09
2004-06-11
Cheil Ind Inc
Slurry composition for use in chemical mechanical polishing of metal wiring

CN102051620A
(en)

*

2010-11-24
2011-05-11
温州奥洋金属表面处理有限公司
Polishing solution for replacing copper pickling process to process surface of copper and copper alloy

US8936672B1
(en)

*

2012-06-22
2015-01-20
Accu-Labs, Inc.
Polishing and electroless nickel compositions, kits, and methods

CN108624237B
(en)

*

2017-03-21
2021-01-26
上海铝通化学科技有限公司
Chemical grinding and polishing solution and grinding and polishing method

Family Cites Families (14)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US2211400A
(en)

*

1938-08-10
1940-08-13
Chase Brass & Copper Co
Pickling solution for copper-base alloys

US2428804A
(en)

*

1945-09-07
1947-10-14
Esther M Terry
Copper cleaning composition

US2894905A
(en)

*

1958-05-02
1959-07-14
Pure Oil Co
Inhibiting precipitation of iron oxide from iron-containing waters

DE1121594B
(en)

*

1960-07-07
1962-01-11
Henkel & Cie Gmbh

Process for the production of liquid, storage-stable concentrates containing active oxygen

US3345217A
(en)

*

1964-06-01
1967-10-03
Fremont Ind Inc
Method of cleaning and phosphatizing copper circuits

US3367875A
(en)

*

1964-08-19
1968-02-06
Hunt Chem Corp Philip A
Composition for etching copper and copper-containing alloys

US3537926A
(en)

*

1967-06-19
1970-11-03
Lancy Lab
Chemical brightening of iron-containing surfaces of workpieces

BE759430A
(en)

1969-11-27
1971-05-25
Unilever Nv

DETERGENT COMPOSITIONS

US3709824A
(en)

*

1971-01-07
1973-01-09
Nippon Soda Co
Method and composition for chemical polishing of stainless steel surfaces

JPS5221460B1
(en)

*

1971-04-26
1977-06-10

JPS5120972B1
(en)

*

1971-05-13
1976-06-29

US3869401A
(en)

*

1972-12-04
1975-03-04
Du Pont
Stabilized acidic hydrogen peroxide solutions

JPS526853B2
(en)

*

1972-12-22
1977-02-25

JPS5332341B2
(en)

*

1973-03-27
1978-09-07

1974

1974-12-13
SE
SE7415649A
patent/SE400581B/en
unknown

1975

1975-12-05
CA
CA241,155A
patent/CA1052674A/en
not_active
Expired

1975-12-08
US
US05/638,698
patent/US4086176A/en
not_active
Expired – Lifetime

1975-12-08
GB
GB52144/75A
patent/GB1503710A/en
not_active
Expired

1975-12-11
DE
DE19752555810
patent/DE2555810A1/en
not_active
Ceased

1975-12-11
AU
AU87473/75A
patent/AU498066B2/en
not_active
Expired

1975-12-12
JP
JP50148327A
patent/JPS5821028B2/en
not_active
Expired

Also Published As

Publication number
Publication date

GB1503710A
(en)

1978-03-15

US4086176A
(en)

1978-04-25

JPS5821028B2
(en)

1983-04-26

CA1052674A
(en)

1979-04-17

JPS5186028A
(en)

1976-07-28

DE2555810A1
(en)

1976-06-16

SE400581B
(en)

1978-04-03

SE7415649L
(en)

1976-06-14

AU8747375A
(en)

1977-06-16

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Dipenylpropylamines

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Aryloxyphenylpropylamines

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2-nitroimidazoles

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Triazine-diones

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(en)

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Triazolobenzodiazepines

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(en)

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Indolobenzazepines

AU487545B2
(en)

1977-04-21

Handstamp

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