AU5214490A

AU5214490A – Optical-electrical multiple connection system
– Google Patents

AU5214490A – Optical-electrical multiple connection system
– Google Patents
Optical-electrical multiple connection system

Info

Publication number
AU5214490A

AU5214490A
AU52144/90A
AU5214490A
AU5214490A
AU 5214490 A
AU5214490 A
AU 5214490A
AU 52144/90 A
AU52144/90 A
AU 52144/90A
AU 5214490 A
AU5214490 A
AU 5214490A
AU 5214490 A
AU5214490 A
AU 5214490A
Authority
AU
Australia
Prior art keywords
optical
connecting elements
electrical
connections
chip
Prior art date
1989-04-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Application number
AU52144/90A
Other versions

AU625465B2
(en

Inventor
Matjaz Florjancic
Kurt Losch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Alcatel Lucent NV

Original Assignee
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1989-04-03
Filing date
1990-03-23
Publication date
1990-10-04

1990-03-23
Application filed by Alcatel NV
filed
Critical
Alcatel NV

1990-10-04
Publication of AU5214490A
publication
Critical
patent/AU5214490A/en

1992-07-09
Application granted
granted
Critical

1992-07-09
Publication of AU625465B2
publication
Critical
patent/AU625465B2/en

2010-03-23
Anticipated expiration
legal-status
Critical

Status
Ceased
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

G—PHYSICS

G02—OPTICS

G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings

G02B6/24—Coupling light guides

G02B6/42—Coupling light guides with opto-electronic elements

G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

G—PHYSICS

G02—OPTICS

G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings

G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type

G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

G—PHYSICS

G02—OPTICS

G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings

G02B6/24—Coupling light guides

G02B6/36—Mechanical coupling means

G02B6/38—Mechanical coupling means having fibre to fibre mating means

G02B6/3807—Dismountable connectors, i.e. comprising plugs

G02B6/381—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres

G02B6/3817—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres containing optical and electrical conductors

G—PHYSICS

G02—OPTICS

G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings

G02B6/24—Coupling light guides

G02B6/42—Coupling light guides with opto-electronic elements

G02B6/4201—Packages, e.g. shape, construction, internal or external details

G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, «first-level» interconnects; Manufacturing methods related thereto

H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

Abstract

In order to connect a chip (5) containing optical components to a substrate (4), optical and electrical connecting elements (1, 8) are produced on a flexible intermediate carrier (2) and, after the film bonding process (which is known for purely electrical connections) are connected both to connecting elements of the chip and to conductor tracks or optical waveguides (3) on the substrate. If the optical connecting elements (1) are spatially arranged between the electrical connecting elements (8), they are held and adjusted by means of the solder connections (produced on both sides) of the electrical connecting elements. In addition to electrical test adapter connections, optical test loops, which connect optical inputs and outputs to one another and are eliminated in the subsequent stamping- out process, can be provided on the flexible intermediate carrier (2).

AU52144/90A
1989-04-03
1990-03-23
Optical-electrical multiple connection system

Ceased

AU625465B2
(en)

Applications Claiming Priority (2)

Application Number
Priority Date
Filing Date
Title

DE3910710A

DE3910710A1
(en)

1989-04-03
1989-04-03

OPTICAL-ELECTRICAL MULTIPLE CONNECTION

DE3910710

1989-04-03

Publications (2)

Publication Number
Publication Date

AU5214490A
true

AU5214490A
(en)

1990-10-04

AU625465B2

AU625465B2
(en)

1992-07-09

Family
ID=6377715
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

AU52144/90A
Ceased

AU625465B2
(en)

1989-04-03
1990-03-23
Optical-electrical multiple connection system

Country Status (8)

Country
Link

US
(1)

US5054870A
(en)

EP
(1)

EP0391248B1
(en)

JP
(1)

JPH0719900B2
(en)

AT
(1)

ATE108027T1
(en)

AU
(1)

AU625465B2
(en)

CA
(1)

CA2013455C
(en)

DE
(2)

DE3910710A1
(en)

ES
(1)

ES2058648T3
(en)

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1989-10-10
1994-06-01
日本電気株式会社

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1991-07-25
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Laminated polymer optical waveguide interface and method of making same

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Guided-wave circuit module and wave-guiding optical component equipped with the module

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1991-10-18
1993-05-04
International Business Machines Corporation
Optical signal distribution system

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1991-12-12
1995-02-10
Andre Schiltz

METHOD OF MOUNTING AND OPTICAL COUPLING ON A SUBSTRATE AND SUBSTRATE PROVIDED WITH OPTICAL FIBER.

DE4142340A1
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1991-12-20
1993-06-24
Siemens Ag
Opto-electronic IC for optical modulator, switch or amplifier – has optical waveguide coupled to light input-output surface at ends and one or more intermediate points

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1991-12-31
1993-03-30
Texas Instruments Incorporated
Optoelectronic integrated circuit for transmitting optical and electrical signals and method of forming same

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1992-01-21
1993-12-07
The University Of Texas System
Wafer-scale optical bus

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1992-07-13
1994-01-25
Motorola, Inc.
Contact areas on an optical waveguide and method of making

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1992-08-31
1993-09-28
Motorola, Inc.
Optoelectroinc mount including flexible substrate and method for making same

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1992-12-29
1994-12-20
Honeywell Inc.
Flexible channel optical waveguide having self-aligned ports for interconnecting optical devices

JP2531453Y2
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1997-04-02
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Shelf for grafting seedling survival promotion

DE19520676A1
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1995-06-07
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Deutsche Telekom Ag

Hybrid circuit and method of making the same

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1995-09-29
1997-08-19
Motorola, Inc.
Polyimide optical waveguide having electrical conductivity

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1996-12-31
1999-05-11
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Flexible optical circuit appliques

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*

1998-05-14
1999-11-15
Nokia Networks Oy

Procedure for transmitting signals and motherboard structure

GB2340998B
(en)

1998-08-26
2003-07-16
Lsi Logic Corp
Optical/electrical inputs for an integrated circuit die

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1998-10-09
2005-01-18
Fujitsu Limited
Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making

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(en)

1998-10-09
2004-02-10
Fujitsu Limited
Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making

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(en)

1998-10-09
2004-03-16
Fujitsu Limited
Optical reflective structures and method for making

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(en)

1998-10-09
2004-08-31
Fujitsu Limited
Single and multilayer waveguides and fabrication process

US6611635B1
(en)

1998-10-09
2003-08-26
Fujitsu Limited
Opto-electronic substrates with electrical and optical interconnections and methods for making

US6343171B1
(en)

*

1998-10-09
2002-01-29
Fujitsu Limited
Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making

US6684007B2
(en)

1998-10-09
2004-01-27
Fujitsu Limited
Optical coupling structures and the fabrication processes

US6434308B1
(en)

1999-09-03
2002-08-13
Teraconnect, Inc
Optoelectronic connector system

AU2246701A
(en)

*

1999-09-03
2001-04-10
Teraconnect, Inc.
Optoelectronic connector system

US6288821B1
(en)

1999-10-01
2001-09-11
Lucent Technologies, Inc.
Hybrid electro-optic device with combined mirror arrays

JP2001274528A
(en)

2000-01-21
2001-10-05
Fujitsu Ltd
Inter-substrate transfer method for thin film device

US6916121B2
(en)

2001-08-03
2005-07-12
National Semiconductor Corporation
Optical sub-assembly for optoelectronic modules

US6588943B1
(en)

*

2000-08-07
2003-07-08
Teradyne, Inc.
Electro-optic connector module

GB2368141A
(en)

*

2000-10-19
2002-04-24
Bookham Technology Plc
Integrated optical package

JP3899842B2
(en)

*

2001-05-01
2007-03-28
富士ゼロックス株式会社

Optical wiring circuit laminate and optoelectric wiring device

KR20040035673A
(en)

*

2001-07-06
2004-04-29
비아시스템즈 그룹, 인코포레이티드
System and method for intergrating optical layers in a pcb for inter-board communications

US7023705B2
(en)

2001-08-03
2006-04-04
National Semiconductor Corporation
Ceramic optical sub-assembly for optoelectronic modules

US7269027B2
(en)

*

2001-08-03
2007-09-11
National Semiconductor Corporation
Ceramic optical sub-assembly for optoelectronic modules

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2001-09-12
2003-07-29
Intel Corporation
Optical/electrical interconnects and package for high speed signaling

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2001-09-24
2005-12-06
National Semiconductor Corporation
Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package

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2003-07-15
2006-01-10
National Semiconductor Corporation
Multi-purpose optical light pipe

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2003-07-15
2007-01-02
National Semiconductor Corporation
Opto-electronic module form factor having adjustable optical plane height

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2003-10-16
2006-10-31
3M Innovative Properties Company
Multi-layer optical circuit and method for making

JP2006091241A
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*

2004-09-22
2006-04-06
Hitachi Cable Ltd
Optoelectronic composite wiring component and electronic equipment using the same

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2004-12-07
2007-04-03
Reflex Photonics, Inc.
Optically enabled hybrid semiconductor package

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2005-04-04
2006-10-12
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Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure

US20070237527A1
(en)

*

2006-03-31
2007-10-11
Sanjay Dabral
Optical debug mechanism

US8014638B2
(en)

*

2006-04-03
2011-09-06
The University Of Tokyo
Signal transmission device

KR100796982B1
(en)

*

2006-11-21
2008-01-22
삼성전기주식회사
Printed circuit board and method of manufacturing thereof

KR100871252B1
(en)

*

2007-01-19
2008-11-28
삼성전자주식회사
Photoelectronic wired flexible printed circuit board using optical fiber

JP5171524B2
(en)

*

2007-10-04
2013-03-27
株式会社日立ハイテクノロジーズ

Device surface defect inspection apparatus and method

US8755655B2
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2009-09-22
2014-06-17
Oracle America, Inc.
Edge-coupled optical proximity communication

DE102009047872B4
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*

2009-09-30
2015-03-12
GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG

Semiconductor device with a buried waveguide for the intra-component optical communication

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2012-04-04
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Texas Instruments Incorporated
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Kotura, Inc.
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Multi-port optical probe for photonic ic characterization and packaging

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Mellanox Technologies, Ltd.
Optical modules integrated into an IC package of a network switch having electrical connections extend on different planes

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Cisco Technology, Inc.
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Corning Research & Development Corporation
Co-packaged optics assemblies

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(en)

*

1982-08-23
1988-08-11
Burroughs Corp
Alpha-particle protection in integrated circuit packages

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Optic-coupled integrated circuits

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Lamar Gipson
Electrical circuit and optical data buss

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(en)

*

1988-03-31
1991-11-06
Siemens Aktiengesellschaft
Arrangement to optically couple one or a plurality of optical senders to one or a plurality of optical receivers of one or a plurality of integrated circuits

1989

1989-04-03
DE
DE3910710A
patent/DE3910710A1/en
not_active
Withdrawn

1990

1990-03-23
AU
AU52144/90A
patent/AU625465B2/en
not_active
Ceased

1990-03-29
AT
AT90105977T
patent/ATE108027T1/en
not_active
IP Right Cessation

1990-03-29
ES
ES90105977T
patent/ES2058648T3/en
not_active
Expired – Lifetime

1990-03-29
EP
EP90105977A
patent/EP0391248B1/en
not_active
Expired – Lifetime

1990-03-29
DE
DE59006275T
patent/DE59006275D1/en
not_active
Expired – Fee Related

1990-03-30
CA
CA002013455A
patent/CA2013455C/en
not_active
Expired – Fee Related

1990-04-03
US
US07/504,550
patent/US5054870A/en
not_active
Expired – Lifetime

1990-04-03
JP
JP2087603A
patent/JPH0719900B2/en
not_active
Expired – Fee Related

Also Published As

Publication number
Publication date

ES2058648T3
(en)

1994-11-01

DE59006275D1
(en)

1994-08-04

JPH0340446A
(en)

1991-02-21

CA2013455C
(en)

1993-10-05

US5054870A
(en)

1991-10-08

EP0391248B1
(en)

1994-06-29

EP0391248A3
(en)

1991-12-11

AU625465B2
(en)

1992-07-09

CA2013455A1
(en)

1990-10-03

ATE108027T1
(en)

1994-07-15

DE3910710A1
(en)

1990-10-04

EP0391248A2
(en)

1990-10-10

JPH0719900B2
(en)

1995-03-06

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Legal Events

Date
Code
Title
Description

2002-10-31
MK14
Patent ceased section 143(a) (annual fees not paid) or expired

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