AU637583B2 – Article of manufacture
– Google Patents
AU637583B2 – Article of manufacture
– Google Patents
Article of manufacture
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Info
Publication number
AU637583B2
AU637583B2
AU42449/89A
AU4244989A
AU637583B2
AU 637583 B2
AU637583 B2
AU 637583B2
AU 42449/89 A
AU42449/89 A
AU 42449/89A
AU 4244989 A
AU4244989 A
AU 4244989A
AU 637583 B2
AU637583 B2
AU 637583B2
Authority
AU
Australia
Prior art keywords
article
layer
encapsulated
resin
carbon fibers
Prior art date
1988-10-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU42449/89A
Other versions
AU4244989A
(en
Inventor
M. Lana Sheer
John C. Solenberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Virginia Tech Foundation Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1988-10-03
Filing date
1989-10-03
Publication date
1993-06-03
1989-10-03
Application filed by EI Du Pont de Nemours and Co
filed
Critical
EI Du Pont de Nemours and Co
1990-04-05
Publication of AU4244989A
publication
Critical
patent/AU4244989A/en
1993-06-03
Application granted
granted
Critical
1993-06-03
Publication of AU637583B2
publication
Critical
patent/AU637583B2/en
1999-08-19
Assigned to VIRGINIA TECH FOUNDATION, INC.
reassignment
VIRGINIA TECH FOUNDATION, INC.
Alteration of Name(s) in Register under S187
Assignors: E.I. DU PONT DE NEMOURS AND COMPANY
2009-10-03
Anticipated expiration
legal-status
Critical
Status
Ceased
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
H01L23/3737—Organic materials with or without a thermoconductive filler
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
H01B3/421—Polyesters
H01B3/422—Linear saturated polyesters derived from dicarboxylic acids and dihydroxy compounds
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
H01F27/00—Details of transformers or inductances, in general
H01F27/02—Casings
H01F27/022—Encapsulation
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
H01F27/00—Details of transformers or inductances, in general
H01F27/28—Coils; Windings; Conductive connections
H01F27/32—Insulating of coils, windings, or parts thereof
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
H01L23/3135—Double encapsulation or coating and encapsulation
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
P/00/011 PATENTS ACT 1952-1973 PATENTS ACT 1952-1973 63758 Form COMPLETE SPECIFICATION
(ORIGINAL)
FOR OFFICE USE Class: Int. CI: Application Number: Lodged: Complete Specification-Lodged: Accepted: Published: Priority: Related Art: o 0* Art o* *o goes TO BE COMPLETED BY APPLICANT Name of Applicant: E.I. DU PONT DE NEMOURS AND COMPANY., a corporation organized and existing under the laws of the State Address of Applicant: of Delaware, of Wilmington, Delaware, 19898, United States of America.
Actual Inventor: Address for Service: M. Lana SHEER and John C. SOLENBERGER Care of: CALLINAN LAWRIE, Patent and Trade Mark Attorneys 278 High Street, Kew, 3101, Victoria.
Complete Specification for the invention entitled: ARTICLE OF MANUFACTURE The following statement is a full description of this invention, Including the best method of performing it known to me:-‘ *Note: The description is to be typed in double spacing, pica type face, in an area not exceeding 250 mm in depth and 160 mm in width, on tough white paper of good quality and it is to be inserted inside this form.
11710/76-L C I I tIflllCIIII I’J nhommC-nherr Background of the Invention This invention relates to encapsulated electrical and electronic devices and, more particularly, it relates to electrical and electronic devices encapsulated with both an insulating material and a thermally conductive material.
Specific techniques for encapsulating electrical and electronic devices are known as disclosed by Eickman et al. in U.S. Patent No. 4,632,798. They also disclose that it is common practice to include, within the encapsulating resin, particulate filler material such as silica or alumina which serves to increase the thermal conductivity.
The market segments for electrical devices such as for windings of motors, transformers and solenoids and electronic devices such as microchips are increasingly moving to minaturization of such devices. This in turn leads to a rise in internal equipment operating temperature resulting in not only a need for higher temperature ratings on insulation materials used for these applications, but also a need for materials with improved thermal conductivity properties to rapidly remove the heat generated.
Summary of the Invention According to the present invention there is provided an improved article of manufacture comprising an electrical device having electrically active 0″20 components, said components being encapsulated with a first layer of an electrically insulating resin and a second layer of a thermally conductive material forming the outer surface of said article, said second layer comprising an electrically insulting resin of the same composition as the first electrically insulating resin reinforced with a three dimensional arrangement of carbon fibers, said carbon gI,’ i 1 a 1 fibers having a lamellar microstructure, a distribution of widths of from 2 to 12 micrometers and lengths above 10 mm, there being a single phase interface forme,’ between said first and second layer such that the layers appear as one at the interface. The thermal conductive material preferably comprises 10 to 70% by weight and preferably from about 15 to about 60% carbon fiber, the balance being made up of a resin or a combination of a resin and an alternative fiber or filler.
Suitable resinous materials which may be used as the resin include, but are not limited to, polyethylene terephthalate, Teflon® PFA by E.I. du Pont de Nemours and Company (Du Pont), amorphous copolyamides as described in U.S.
Patent No. 4,681,411, and Hytrel® 7246 by Du Pont as well as thermosetting resins.
The carbon fibers are preferably centrifugally spun from mesophase pitch as disclosed in copending commonly owned U.S. Patent No. 4,861,653 filed September 2, 1987 which is incorporated herein by reference.
Brief Description of the Drawing The drawing is a schematic cross-sectional view of a transformer according to the invention.
Detailed Description of the Illustrated Embodiment The embodiment chosen for purpose of illustration is an article of manufacture generally designated 10 that includes an electrical device consisting of a plurality of electrically active wire coils 12, 14 wrapped around a coil form 16 positioned on a metal core 18. The coils 12, 14 serve as the primary and secondary windings of a transformer with connections leading to external terminals (not shown). Surrounding the electrical device is an encapsulating layer 20 of an electrically insulating material which in turn is encapsulated with a thermal conductive layer 22 which serves as a case for the transformer.
The thermally conductive layer 22 exhibits a three dimensional arrangement of fibers within the resin matrix as estimated from shrinkage data in the x, y, and z coordinate axes directions from mold size to the final part. More particularly, essentially equal shrinkage of the final part in the x, y, and z directions indicates three dimensional isotropic fiber reinforcement while shrinkage of the final part that varies by several orders of magnitude between directions ‘suggests highly oriented reinforcing fibers.
Example In step I, a non-encapsulated transformer is introduced into a steel injection molding tool held in a standard injection molding machine. The cavity of the injection molding tool has (1) notches cut into them so as to allow the transformer leads to protrude from the cavity •holding the transformer and positioning pins to hold the transformer in place so that the injected polymer can flow completely around the transformer.
A commercial grade Du Pont Rynite® FR-530 25 polymer which is a 30 wt.% chopped glass fiber reinforced flame retarded polyethylene terephthlate polymer is heated to a melt temperature of 280 0
C
and injected into the closed steel mold containing the transformer. After two minutes, the transformer is removed from the original steel mold. In step II, a second steel mold with similar notches and positioning pins having approximately 1/2″ to 3/4″ larger overall inner dimensions than the first mold replaces the first mold in the injection molding machine. A 50 wt. pitch carbon mat fiber reinforced flame-retarded too* ‘0 0*000S 0 Se 6* S S
S.
0* 0
S
000 1
S
polyethylene terephthalate polymer made by compression molding alternate layers of flame retarded polyethylene terephthalate polymer film and carbon fiber bats made accordinq to the PRcAe+ o: 4, to, 63 disclosure in U.S.appl.cation Srial No. 092,217 which is subsequently chopped into 1/4″ pellets and fed to the injection molding machine where it is heated to 280 0 C and injected into the tool cavity containing the previously encapsulated transformer of step I. This doubly encapsulated transformer is removed from the mold after 1 minute and seconds. A two shot encapsulated transformer was tested for electrical insulation properties of the inner layer and thermal conductivity properties of 15 the outer layer, according to the Underwriters Laboratories standard UL 1585, sections 28, Rated Secondary Current Test, and 29, Rated Output Heating Test, and the temperature rise of 42 0 C was much less than the specified maximum temperature specified in the UL 1585 standard. The integrity of the electrical insulation was maintained.
S.
S
0 RA I, VT 0
Claims (4)
1. An improved article of manufacture comprising an electrical device having electrically active components, said components being encapsulated with a first layer of an electrically insulating resin and a second layer of a thermally conductive material forming the outer surface of said article, said second layer comprising an electrically insulting resin of the same composition as the first electrically insulating resin reinforced with a three dimensional arrangement of carbon fibers, said carbon fibers having a lamellar microstructure, a distribution of widths of from 2 to 12 micrometers and lengths above 10 mm, there being a single phase interface formed between said first and second layer such that the layers appear as one at the interface.
2. The article of claim 1 wherein said thermal conductive material is a resin reinforced with a three dimensional arrangement of mesophase pitch based carbon fibers. 5
3. The article as defined in claims 1 or 2 wherein said electrical S* device is encapsulated by means of a two-step injection molding process, said resin being thermoplastic.
4. An electrical device having encapsulated electrically active components, substantially as hereinbefore described with reference to the drawings Q and/or the Example. iia Ii DATED this 10th day of arch 1993. E.I. DU PONT DE NEMOURS D OMPANY By their Patent Attorneys: CALLINAN LAWRIE X^T OX
AU42449/89A
1988-10-03
1989-10-03
Article of manufacture
Ceased
AU637583B2
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
US25177288A
1988-10-03
1988-10-03
US251772
1988-10-03
Publications (2)
Publication Number
Publication Date
AU4244989A
AU4244989A
(en)
1990-04-05
AU637583B2
true
AU637583B2
(en)
1993-06-03
Family
ID=22953347
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU42449/89A
Ceased
AU637583B2
(en)
1988-10-03
1989-10-03
Article of manufacture
Country Status (10)
Country
Link
EP
(1)
EP0375851B1
(en)
JP
(1)
JPH02198114A
(en)
KR
(1)
KR0132052B1
(en)
AU
(1)
AU637583B2
(en)
BR
(1)
BR8905014A
(en)
CA
(1)
CA2000087A1
(en)
DE
(1)
DE68923945T2
(en)
ES
(1)
ES2077573T3
(en)
HK
(1)
HK101896A
(en)
IL
(1)
IL91868A
(en)
Families Citing this family (11)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US5026748A
(en)
*
1990-05-07
1991-06-25
E. I. Du Pont De Nemours And Company
Thermally conductive adhesive
JPH06270175A
(en)
*
1991-05-15
1994-09-27
E I Du Pont De Nemours & Co
Insert encapsulated with thermoplastic sheet material by multi-stage compression molding
IT1268492B1
(en)
*
1993-10-26
1997-03-04
Hydor Srl
METHOD FOR MAKING ELECTROMECHANICAL EQUIPMENT OPERATING IN IMMERSION AND EQUIPMENT OBTAINED BY THE METHOD
US6198373B1
(en)
*
1997-08-19
2001-03-06
Taiyo Yuden Co., Ltd.
Wire wound electronic component
WO1999026286A1
(en)
*
1997-11-13
1999-05-27
Bp Amoco Corporation
Heat pipe thermal management apparatus
JPH11186003A
(en)
*
1997-12-25
1999-07-09
Yazaki Corp
Heat sink structure of ptc device
DE10328373B4
(en)
*
2003-06-24
2015-10-08
Continental Automotive Gmbh
Piezoelectric component with tempering device and use of the component
WO2009138096A1
(en)
*
2008-05-13
2009-11-19
Abb Technology Ag
Dry-type transformer
JP5534551B2
(en)
*
2009-05-07
2014-07-02
住友電気工業株式会社
Reactor
EP2355116A1
(en)
2010-01-29
2011-08-10
ABB Research Ltd.
An electric device and a method for manufacturing the device
WO2020003484A1
(en)
*
2018-06-29
2020-01-02
新電元工業株式会社
Magnetic component
Citations (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3030597A
(en)
*
1958-02-28
1962-04-17
Westinghouse Electric Corp
Insulated electrical apparatus
US4632798A
(en)
*
1983-07-27
1986-12-30
Celanese Corporation
Encapsulation of electronic components with anisotropic thermoplastic polymers
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Assignee
Title
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(en)
*
1968-03-13
1969-11-14
Licentia Gmbh
CH576206A5
(en)
*
1974-08-06
1976-05-31
Braun Franz
JPS51111862A
(en)
*
1975-03-27
1976-10-02
Denki Onkyo Co Ltd
Synthetic resin mold
JPS51134869A
(en)
*
1975-05-19
1976-11-22
Hitachi Ltd
Mould coil
US4138525A
(en)
*
1976-02-11
1979-02-06
Union Carbide Corporation
Highly-handleable pitch-based fibers
JPS5450865A
(en)
*
1977-09-30
1979-04-21
Hitachi Ltd
Coil for electrical apparatus
LU85462A1
(en)
*
1984-07-11
1986-02-12
Univ Louvain
NOVEL POLYMER COMPOSITIONS, METHODS FOR THEIR PRODUCTION AND THEIR APPLICATIONS
JPS6169813U
(en)
*
1984-10-12
1986-05-13
JPS61296068A
(en)
*
1985-06-20
1986-12-26
シ−メンス、アクチエンゲゼルシヤフト
Plastic compound
US4888247A
(en)
*
1986-08-27
1989-12-19
General Electric Company
Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
1989
1989-10-03
DE
DE68923945T
patent/DE68923945T2/en
not_active
Expired – Fee Related
1989-10-03
ES
ES89118314T
patent/ES2077573T3/en
not_active
Expired – Lifetime
1989-10-03
BR
BR898905014A
patent/BR8905014A/en
not_active
IP Right Cessation
1989-10-03
AU
AU42449/89A
patent/AU637583B2/en
not_active
Ceased
1989-10-03
EP
EP89118314A
patent/EP0375851B1/en
not_active
Expired – Lifetime
1989-10-03
JP
JP1258641A
patent/JPH02198114A/en
active
Pending
1989-10-03
IL
IL9186889A
patent/IL91868A/en
not_active
IP Right Cessation
1989-10-03
CA
CA002000087A
patent/CA2000087A1/en
not_active
Abandoned
1989-10-04
KR
KR1019890014265A
patent/KR0132052B1/en
not_active
IP Right Cessation
1996
1996-06-13
HK
HK101896A
patent/HK101896A/en
not_active
IP Right Cessation
Patent Citations (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3030597A
(en)
*
1958-02-28
1962-04-17
Westinghouse Electric Corp
Insulated electrical apparatus
US4632798A
(en)
*
1983-07-27
1986-12-30
Celanese Corporation
Encapsulation of electronic components with anisotropic thermoplastic polymers
Also Published As
Publication number
Publication date
DE68923945T2
(en)
1996-04-25
ES2077573T3
(en)
1995-12-01
BR8905014A
(en)
1990-05-08
IL91868A0
(en)
1990-06-10
EP0375851A2
(en)
1990-07-04
AU4244989A
(en)
1990-04-05
DE68923945D1
(en)
1995-09-28
JPH02198114A
(en)
1990-08-06
CA2000087A1
(en)
1990-04-03
KR900006995A
(en)
1990-05-09
EP0375851A3
(en)
1990-11-28
HK101896A
(en)
1996-06-21
EP0375851B1
(en)
1995-08-23
KR0132052B1
(en)
1998-04-24
IL91868A
(en)
1994-06-24
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