AU8243982A - Creación de Inventos y Patentes con Inteligencia Artificial

AU8243982A – Ebullition cooling apparatus
– Google Patents

AU8243982A – Ebullition cooling apparatus
– Google Patents
Ebullition cooling apparatus

Info

Publication number
AU8243982A

AU8243982A
AU82439/82A
AU8243982A
AU8243982A
AU 8243982 A
AU8243982 A
AU 8243982A
AU 82439/82 A
AU82439/82 A
AU 82439/82A
AU 8243982 A
AU8243982 A
AU 8243982A
AU 8243982 A
AU8243982 A
AU 8243982A
Authority
AU
Australia
Prior art keywords
cooling apparatus
ebullition cooling
ebullition
cooling
Prior art date
1981-04-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Application number
AU82439/82A
Other versions

AU551611B2
(en

Inventor
Masao Fujii
Kazushige Nakao
Haruo Tetsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1981-04-07
Filing date
1982-04-07
Publication date
1982-10-14

1981-04-07
Priority claimed from JP56053466A
external-priority
patent/JPS57167663A/en

1981-12-22
Priority claimed from JP20864881A
external-priority
patent/JPS58108759A/en

1981-12-22
Priority claimed from JP20864981A
external-priority
patent/JPS58108760A/en

1982-04-07
Application filed by Mitsubishi Electric Corp
filed
Critical
Mitsubishi Electric Corp

1982-10-14
Publication of AU8243982A
publication
Critical
patent/AU8243982A/en

1986-05-08
Application granted
granted
Critical

1986-05-08
Publication of AU551611B2
publication
Critical
patent/AU551611B2/en

2002-04-07
Anticipated expiration
legal-status
Critical

Status
Ceased
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air

F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING

F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES

F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS

F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 – F25B21/00, e.g. using selective radiation effect

F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 – F25B21/00, e.g. using selective radiation effect boiling cooling systems

F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING

F28—HEAT EXCHANGE IN GENERAL

F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing

F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

H01L23/427—Cooling by change of state, e.g. use of heat pipes

F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING

F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES

F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS

F25B2500/00—Problems to be solved

F25B2500/01—Geometry problems, e.g. for reducing size

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/0001—Technical content checked by a classifier

H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

AU82439/82A
1981-04-07
1982-04-07
Ebullition cooling apparatus

Ceased

AU551611B2
(en)

Applications Claiming Priority (6)

Application Number
Priority Date
Filing Date
Title

JP56053466A

JPS57167663A
(en)

1981-04-07
1981-04-07
Boiling and cooling device

JP56-53466

1981-04-07

JP20864881A

JPS58108759A
(en)

1981-12-22
1981-12-22
Boiling and cooling device

JP56-208648

1981-12-22

JP56-208649

1981-12-22

JP20864981A

JPS58108760A
(en)

1981-12-22
1981-12-22
Boiling and cooling device

Publications (2)

Publication Number
Publication Date

AU8243982A
true

AU8243982A
(en)

1982-10-14

AU551611B2

AU551611B2
(en)

1986-05-08

Family
ID=27294958
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

AU82439/82A
Ceased

AU551611B2
(en)

1981-04-07
1982-04-07
Ebullition cooling apparatus

Country Status (6)

Country
Link

US
(2)

US4572286A
(en)

KR
(1)

KR860000253B1
(en)

AU
(1)

AU551611B2
(en)

DE
(1)

DE3213112A1
(en)

ES
(1)

ES511289A0
(en)

MX
(1)

MX157055A
(en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

KR900001393B1
(en)

1985-04-30
1990-03-09
Fujitsu Ltd
Evaporation cooling module for semiconductor device

US5390077A
(en)

1994-07-14
1995-02-14
At&T Global Information Solutions Company
Integrated circuit cooling device having internal baffle

US5529115A
(en)

1994-07-14
1996-06-25
At&T Global Information Solutions Company
Integrated circuit cooling device having internal cooling conduit

US5864466A
(en)

1994-07-19
1999-01-26
Remsburg; Ralph
Thermosyphon-powered jet-impingement cooling device

JP3487382B2
(en)

1994-12-28
2004-01-19
株式会社デンソー

Boiling cooling device

FR2738446B1
(en)

1995-08-30
1997-09-26
Gec Alsthom Transport Sa

METHOD AND DEVICE FOR FILTERING AN ELECTRIC INSULATING LIQUID MEDIUM AND CALORIPORATOR AND ELECTRONIC POWER UNIT INCLUDING SUCH A DEVICE

US6064572A
(en)

1996-11-27
2000-05-16
Remsburg; Ralph
Thermosyphon-powered jet-impingement cooling device

US6217527B1
(en)

1998-09-30
2001-04-17
Lumend, Inc.
Methods and apparatus for crossing vascular occlusions

US7004173B2
(en)

2000-12-05
2006-02-28
Lumend, Inc.
Catheter system for vascular re-entry from a sub-intimal space

JP4214881B2
(en)

2003-01-21
2009-01-28
三菱電機株式会社

Bubble pump type heat transport equipment

US6820684B1
(en)

2003-06-26
2004-11-23
International Business Machines Corporation
Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader

JP2005195226A
(en)

2004-01-06
2005-07-21
Mitsubishi Electric Corp
Pumpless water cooling system

US20080236795A1
(en)

2007-03-26
2008-10-02
Seung Mun You
Low-profile heat-spreading liquid chamber using boiling

JP4305406B2
(en)

2005-03-18
2009-07-29
三菱電機株式会社

Cooling structure

GB2439026B
(en)

2005-04-05
2009-10-28
Vetco Gray Scandinavia As
An arrangement for heat transport or cooling

US20070023169A1
(en)

2005-07-29
2007-02-01
Innovative Fluidics, Inc.
Synthetic jet ejector for augmentation of pumped liquid loop cooling and enhancement of pool and flow boiling

US8011421B2
(en)

2006-12-12
2011-09-06
Honeywell International Inc.
System and method that dissipate heat from an electronic device

US7497136B2
(en)

2006-12-13
2009-03-03
Espec Corp.
Environmental test apparatus

JP4657226B2
(en)

2007-02-01
2011-03-23
トヨタ自動車株式会社

Heat storage device

US20080283221A1
(en)

2007-05-15
2008-11-20
Christian Blicher Terp
Direct Air Contact Liquid Cooling System Heat Exchanger Assembly

JP4579269B2
(en)

2007-05-25
2010-11-10
トヨタ自動車株式会社

Cooling system

US8797739B2
(en)

2011-06-23
2014-08-05
Delphi Technologies, Inc.
Self circulating heat exchanger

US9328964B2
(en)

2013-02-01
2016-05-03
Dell Products, L.P.
Partitioned, rotating condenser units to enable servicing of submerged it equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system

US20140318741A1
(en)

2013-04-29
2014-10-30
Nicholas Jeffers
Cooling With Liquid Coolant And Bubble Heat Removal

JP6461361B2
(en)

2015-09-14
2019-01-30
三菱電機株式会社

Cooler, power conversion device, and cooling system

NL2015841B1
(en)

2015-11-23
2017-06-07
Aecorsis B V
A device comprising heat producing components with liquid submersion cooling.

JP2018088433A
(en)

2016-11-28
2018-06-07
富士通株式会社
Cooling system and cooling method for electronic equipment

DE102018211666A1
(en)

2018-07-12
2020-01-16
Mahle International Gmbh

cooling arrangement

CN110068238B
(en)

2019-03-26
2020-10-13
华北电力大学
Pool boiling rotary jet heat exchanger

CN111831084B
(en)

2019-04-23
2022-07-01
富联精密电子(天津)有限公司
Cooling system

EP4282235A1
(en)

2021-01-21
2023-11-29
Stem Technologies/Ixora Holding B.V.
Immersive cooling unit for cooling electronic components and method of using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US2886746A
(en)

1956-01-05
1959-05-12
Gen Electric
Evaporative cooling system for electrical devices

GB914265A
(en)

1960-02-06
1963-01-02
James Henry Billington
Improvements in or relating to heat exchangers

US3435283A
(en)

1966-04-28
1969-03-25
Thomson Houston Comp Francaise
Thermosyphonic heat exchange device for stabilizing the frequency of cavity resonators

FR1603617A
(en)

1968-08-29
1971-05-10

US3579162A
(en)

1969-11-28
1971-05-18
Gen Electric
Winding duct construction for power transformer

US3626080A
(en)

1969-12-10
1971-12-07
Allis Chalmers Mfg Co
Means for circulating liquid coolants

DE2704781A1
(en)

1977-02-02
1978-08-03
Licentia Gmbh

COOLING OF SEMICONDUCTOR RECTIFIER ELEMENTS

1982

1982-04-03
KR
KR8201479A
patent/KR860000253B1/en
active

1982-04-06
MX
MX192188A
patent/MX157055A/en
unknown

1982-04-07
ES
ES511289A
patent/ES511289A0/en
active
Granted

1982-04-07
AU
AU82439/82A
patent/AU551611B2/en
not_active
Ceased

1982-04-07
DE
DE19823213112
patent/DE3213112A1/en
not_active
Ceased

1982-04-07
US
US06/366,124
patent/US4572286A/en
not_active
Expired – Fee Related

1985

1985-12-06
US
US06/805,538
patent/US4653579A/en
not_active
Expired – Fee Related

Also Published As

Publication number
Publication date

KR860000253B1
(en)

1986-03-21

KR830010366A
(en)

1983-12-30

DE3213112A1
(en)

1982-11-25

AU551611B2
(en)

1986-05-08

US4572286A
(en)

1986-02-25

ES8304364A1
(en)

1983-02-16

US4653579A
(en)

1987-03-31

ES511289A0
(en)

1983-02-16

MX157055A
(en)

1988-10-24

Información de contacto