AU1105583A – A maskless process for applying a patterned coating
– Google Patents
AU1105583A – A maskless process for applying a patterned coating
– Google Patents
A maskless process for applying a patterned coating
Info
Publication number
AU1105583A
AU1105583A
AU11055/83A
AU1105583A
AU1105583A
AU 1105583 A
AU1105583 A
AU 1105583A
AU 11055/83 A
AU11055/83 A
AU 11055/83A
AU 1105583 A
AU1105583 A
AU 1105583A
AU 1105583 A
AU1105583 A
AU 1105583A
Authority
AU
Australia
Prior art keywords
circuit board
thickness
holes
layer
uncured
Prior art date
1981-12-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU11055/83A
Other versions
AU559848B2
(en
Inventor
Gerald Burt Fefferman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1981-12-11
Filing date
1982-12-08
Publication date
1983-06-30
1982-12-08
Application filed by Western Electric Co Inc
filed
Critical
Western Electric Co Inc
1983-06-30
Publication of AU1105583A
publication
Critical
patent/AU1105583A/en
1987-03-19
Application granted
granted
Critical
1987-03-19
Publication of AU559848B2
publication
Critical
patent/AU559848B2/en
2002-12-08
Anticipated expiration
legal-status
Critical
Status
Ceased
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/22—Secondary treatment of printed circuits
H05K3/28—Applying non-metallic protective coatings
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/0073—Masks not provided for in groups H05K3/02 – H05K3/46, e.g. for photomechanical production of patterned surfaces
H05K3/0079—Masks not provided for in groups H05K3/02 – H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/0073—Masks not provided for in groups H05K3/02 – H05K3/46, e.g. for photomechanical production of patterned surfaces
H05K3/0082—Masks not provided for in groups H05K3/02 – H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/05—Patterning and lithography; Masks; Details of resist
H05K2203/0502—Patterning and lithography
H05K2203/0508—Flood exposure
Description
A MASKLESS PROCESS FOR APPLYING A PATTERNED COATING
Technical Field This invention relates to a maskless process for defining and registering a coating on a printed circuit board. Background of the Invention
In the manufacture of one type of printed circuit board it is desired to provide a layer of material covering one surface of the board but having openings therethrough exposing holes through the boards and annular regions of the boards immediately surrounding the holes. While various techniques exist for accomplishing this, they generally require use of a separate mask for patterning the covering layer. A purpose of this invention is to eliminate the need for the masking process, thereby simplifying the manufacturing procedure. Summary of the Invention A surface of a circuit board is wholly coated with the desired covering layer. The layer is then treated to cause portions thereof immediately adjacent to holes through the board to flow into the holes, thereby thinning the layer at these portions. Utilizing the difference in thickness between these portions and the remainder of the covering layer, the thin portions are then removed to expose the areas of the board immediately surrounding the holes. Brief Description of the Drawings FIG. 1 is a partial sectional view of a circuit board including a covering layer at the start of the inventive process; and
FIG. 2 through 4 are views similar to that of FIG. 1 showing successive steps of the process.
OMPI
Detailed Description
A maskless process for applying a coating to a circuit board so as to produce uncoated regions in land areas surrounding holes in the circuit board is herein described. It is at such land areas that an electrical connection is to be effected. Typically, I have found that my process can be employed advantageously for hole sizes approximately 0.5 mm in diameter or greater. Smaller hole sizes than 0.5 mm typically make reduction of the thickness of the material on the land areas more difficult.
Nevertheless, use of expedients such as use of suction, allows use of smaller holes.
The initial step in the process is the application to surface 30 of circuit board 31 uncured material 32.
Material 32 is chosen so that upon treatment with a suitable source of energy, for example, ultraviolet light, infrared radiation, an electron beam or heat, it undergoes a modification, such as a chemical reaction, which renders it less susceptible to removal than from an unmodified region. For example, a material 32 is chosen which upon irradiation undergoes a chemical reaction such as polymerization through crosslinking and becomes relatively insoluble in a solvent that rapidly dissolves the unreacted material.
Material 32 is preferably an ultraviolet radiation curable liquid having a cure reaction which is susceptible to inhibition by the presence of oxygen, the degree of inhibition being such as to permit material 32 to remain as a flowable liquid upon exposure to an appropriate first energy source. However, electron beam or thermally curable liquids having the inhibition characteristic are also suitable for this purpose.
Surface 30 should be covered with material 32 to a first thickness which is on the order of twice the thickness of metallized layer 33 constituting land area 34 and sidewalls 35 of plated-through hole 36. Metallized
OMPI
layer 33 typically falls within a thickness range of approximately 25 to 125 -μm. Accordingly, surface 30 would be covered by uncured material 32 to a thickness ranging between 60 ym and 200 μm. Several different techniques may be employed to apply uncured material 32 to surface 30, e.g., screen printing with the screen not having any pattern therein, a curtain coating process, roller coating, spray coating, and the use of a threaded drawrdown bar. Depending on the thickness of material 32 applied to surface 30 and, in particular, whether plated through hole 36 receives so much material 32 as to become plugged, it may be necessary to implement an optional step. This step involves the removal of at least a portion of any uncured material 32 resident in hole 36 so as to provide a cavity to accept further uncured material 32 flowing from land area 34 upon implementation of a subsequent step. In practice this step is most easily implemented by the application of suction to the underside of circuit board 31.
After circuit board 31 has material 32 applied thereto the next step is to diminish the amount of material 32 on land areas 34. The reduction in thickness of material 32 is accomplished by allowing a portion of material 32 on land areas 34 to flow into plated-^-through holes 36, as shown in FIG. 2. The amount of material 32 flowing into holes 36 is preferably limited such that the thickness of material 32 on sidewalls 35 and any material 32 which might bridge holes 36 is no greater than the thickness of material 32 which will remain uncured by oxygen inhibition. This thickness of material 32 which will remain uncured typically ranges in thickness from approximately 12 to 50 μm.
Although the thickness of uncured material 32 on land areas 34 is diminished due to the presence of holes 36, if material 32 is excessively viscous, that is, has a viscosity greater than approximately
10,000 centipoise, or if holes 36 are unusually small, that is, having a diameter less than approximately 0.5 mm, it is possible that excessive time periods for thickness diminution will occur. To avoid this, the material 32 can be heated to reduce its viscosity.
Having diminished the thickness of material 32 on land areas 34 to a thickness no greater than the thickness of a layer which will remain uncured due to oxygen inhibition, the next step is to expose material 32 to a source of energy (not shown) to initiate the cure reaction. The type of energy source that is employed is dependent upon the type of material 32 that is used. For instance, if material 32 is an ultraviolet curable substance the energy source is either an ultraviolet radiation source or an electron beam source. If material 32 is a thermally curable substance, the energy source is a heat source.
Whichever type of material 32 and energy source that is employed, material 32 is exposed to such source for a time sufficient to cause an advancement in its cure reaction .in sublayer 37, as shown in FIG. 3, while surface layer 38 remains uncured due to oxygen inhibition. The amount of oxygen in ambient air is sufficient to cause such inhibition. l
Not only the environment but also the dose of the exposure from the first energy source and the intensity of the energy influence the degree of inhibition. The dose, that is, the total energy supplied per unit volume, -should be adequate to produce sufficient advancement in cure in sublayer 37. For example, for material undergoing free-? radical polymerization, such as acrylates, actinic doses in the range of 20 to 2000 millijoules per square centimeter are typically employed.
Excessive intensity generally .counteracts the inhibiting effect of the environment. For example, actinic intensities greater than 100 milliwatts per square centimeter generally produce free radicals in surface layer 38 at a rate faster than oxygen in air reacts with
-^sjmϊE
these radicals to inhibit the reaction. Thus, to increase the extent of inhibition either the intensity is reduced or the oxygen concentration in the environment is increased. Following exposure, uncured surface layer 38 is removed with a solvent. The choice of solvent is dependent upon the type of material 32 that is employed. For some acrylated epoxy based materials 32, solvents such as 1,1,lτ-trichloroethane and diethylene glycol monobutyl ether are used. The solvent is then removed, as by draining and drying.
If the sublayer 37 had not been completely cured during the exposure to the curing energy source, a further application of energy is the made to complete the curing process. In a first specific embodiment of my method, uncured material 32 was a solder mask material SM÷-15÷-BTL manufactured by Dynachem Corporation. This material 32 was screen printed through a 135 mesh polyester screen having perimeter definition only. Uncured material 32 was applied to a thickness of 60 μm. A heating step caused partial flow of the material into holes through the board resulting in the thickness of material 32 on land areas 34 being diminished to less than 25 μm. Circuit board 31 was then exposed to a 1,000 watt high pressure mercury vapor lamp focused over a 30 cm diameter circle. The exposure was for a period of five seconds. The c.ure-rinhibited surface layer 38 was removed by immersing circuit board 31 in a l,l,lf-trichloroethane solvent for 30 seconds. Circuit board 31 was dried by compressed air. Following the drying step, circuit board 31 was heated in a forced air oven for ten minutes at a temperature of 100°C. This heating step was employed to drive off any solvent which may have been absorbed. Circuit board 31 then was exposed to two focused linear 200 watt per inch medium pressure mercury vapor lamps. One pass was made under the lamps at a rate of ten feet per minute. In this embodiment of my process the resulting uncoated region surrounding hole 36 was an
annular ring concentric with hole 36, having an internal radius equal to the hole radius and an external radius 200 μm greater than the radius of hole 36.
In another embodiment, after screen printing of the coating material 32, any excess material in the holes 36 was blown out by an air stream applied from the uncoated side of the board.
In another embodiment of my method, uncured material 32 contained the following ingredients in the amounts shown below. Material 32 for this embodiment will be hereinafter referred to as Formulation A.
FORMULATION A Ingredient Amount by unit weight
Celrad ©3700 30 Hycar®VTBN 1300X22 20
SRi-349 : 30
QM-r-589 40
Irgacure 651 1
Magenta pigment cone. #9R75 3
Celrad 3700 obtained from Celanese Plastics and Specialties Company essentially consists of an acrylated epoxy prepared by reacting acrylic acid with a bis-^phenol A epoxy resin having an epoxy equivalent weight of 190τ-200. Hycar VTBN 1300X22, sold by the B.F. Goodrich Chemical Group, essentially consists of an acrylate terminated acrylonitrile butadiene liquid rubber having a molecular weight of approximately 3500, with an acrylonitrile content of approximately 17 percent and an acrylate content of approximately 1.85 per molecule. SR-349, obtained from Sartomer Company, essentially consists of an ethoxylated bis-^phenol A diacrylate. QM÷-589, available from the Rohm and Haas Company, essentially consists of isobornyl acrylate. Irgacure 651 is a photoinitiator from the Ciba-÷ Geigy Corporation having the chemical name 2, 2-?*dimethoxy phenyl acetophenone. Magenta pigment concentrate #9R75, obtained from Penn Color, Inc., contains a quinacridone
type pigment dispersed in trimethylolpropane triacrylate.
Formulation A is prepared as follows: In a common vessel is added the above ingredients in the amounts shown above and in the order listed. The vessel was heated to approximately 50τ-60 degrees centigrade by means of a water bath. The mixture was then stirred for 10÷-15 minutes at that temperature by means of a mechanical stirrer. The mixture was then cooled to room temperature and allowed to stand for eight hours before using to allow entrapped air bubbles to escape. Alternatively, the cooled mixture was placed in a vacuum chamber at 10-_-20 mm mercury pressure for five minutes to remove the entrapped air bubbles.
Formulation A was applied to circuit board 31 to a thickness of 80 -jn by a manually operated draw-^-down bar having 40 threads per inch. Any excess material 32 in holes 36 was drawn out by a vacuum from the noncoated side of circuit board 31. Thereafter circuit board 31 was heated to diminish the thickness of uncured material 32 on land areas 34 to less than 30 μm. Circuit board 31 was then exposed for 20 seconds to a 1,000 watt high pressure mercury vapor lamp focused over a 30 cm diameter surface. Cure-*-inhibited surface layer 38 was removed by immersion in diethylene glycol monobutyl ether for a period of three minutes. Circuit board 31 was dried by compressed air. Thereafter, circuit board 31 was heated in a forced air oven for a period of 30 minutes at 100°C. Finally, circuit board 31 was exposed to two focused linear 200 watt per inch medium pressure mercury vapor lamps with two passes being made at a speed of ten feet per minute. In this embodiment of my process, the uncoated region had an external radius 175 μm greater than the radius of hole 36.
In a further embodiment of my method, uncured material 32 consists of the following ingredients in the amounts shown below. Material 32 for this embodiment will be hereinafter referred to as Formulation B.
OMPI_
FORMULATION B
Ingredient Amount by unit weight
Celrad® 3702 – 50
Hycar ® VTBN 1300X23 30 QM+–589 50
2 2-diet oxyacetophenone 4
Magenta pigment cone. #9R75 3
Modaflow R 1
Celrad 3702, from Celanese Plastics and Specialties Company, essentially consists of an acrylate derived from reacting bis^phenol A epoxide with acrylic acid and an unknown diacid. Hycar VTBN 1300X23 from B. F. Goodrich Chemical Group, is structurally similar to Hycar VTBN 1300X22 but having approximately 2.35 acrylate groups per molecule. The photoinitiator is 2,2-fcdiethoxyacetophenone from Polysciences, Inc. Modaflow is a flow modifier obtained from the Monsanto Industrial Chemicals Company.
Formulation B was prepared in the same manner as Formulation A. Formulation B was applied to circuit board 31 to a thickness of 150 μm by a manually operated draw-r-down bar having 18 threads per inch. Any excess material 32 in holes 36 was drawn out by a vacuum from the noncoated side of circuit board 31. Thereafter, circuit board 31 was heated to diminish the thickness of uncured material 32 on land areas 34 to less than 35 μm. Circuit board 31 was then exposed for 40 seconds to a 1,000 watt high pressure mercury vapor lamp focused over a 30 cm diameter surface. Cure-inhibited surface layer 38 was removed by spraying diethylene glycol monobutyl ether on circuit board 31 for a period of three minutes. Circuit board 31 was heated in a forced air oven for a period of 30 minutes at 100°C. Finally, circuit board 31 was exposed to two focused linear 200 watt per inch medium pressure mercury vapor lamps with two passes being made at a speed of ten feet per minute. In this embodiment of my process, the uncoated region
surrounding hole 36 had an external radius 150 ym greater than the radius of hole 36.
In another embodiment of my process, Formulation B was applied to circuit board 31 to a thickness of 80 μm by a KMC Corporation Model KM^CC*-H-^lfr22 curtain coater operating at a belt speed of 300 feet per minute. In this embodiment, it was unnecessary to remove excess material from holes 36 since no excess material entered the holes. In addition, it was not necessary to heat circuit board 31 to reduce the viscosity of material 32 since material 32 surrounding holes 36 is sufficiently diminished by virtue of the curtain coating application. The material thickness surrounding holes 36 was less than 35 μm. Circuit board 31 then was exposed for 20 seconds to a 1,000 watt high pressure mercury vapor lamp focused over a 30 cm diameter surface. Cure-?inhibited surface layer 38 was removed by immersion in diethylene glycol monobutyl ether for a period of three minutes. Circuit board 31 was dried by compressed air and thereafter was heated in a forced air oven for a period of 30 minutes at 100°C. Finally, circuit board 31 was exposed to two focused linear 200 watt per inch medium pressure mercury vapor lamps with two passes being made at a speed of ten feet per minute. In this embodiment of my process, the uncoated region surrounding hole 36 had an external radius 175 μm greater than the radius of hole 36.
Claims (2)
1. A process for applying a coating to a circuit board (31) so as to produce uncoated regions on land areas (34) surrounding holes (36) in said board, characterized by the steps of: applying to a surface (30) of said board an uncured material layer (32) having a cure reaction which is inhibited by the presence of oxygen, reducing the thickness of those portions of said layer on said land areas by causing some of the layer material at those portions to flow into said holes, exposing said layer, in the presence of oxygen, to an energy source for advancing the cure reaction only of sublayers (37) of the material which are isolated from the oxygen by overlayers (38) of the material, such overlayers, including substantially the entire thickness of the reduced thickness portions of said layer, remaining substantially uncured, and selectively removing said uncured portions of the material.
2. The process of claim 1 including the step of heating said material to reduce its viscosity for promoting its flow into said holes.
AU11055/83A
1981-12-11
1982-12-08
A maskless process for applying a patterned coating
Ceased
AU559848B2
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
US32986781A
1981-12-11
1981-12-11
US329867
1981-12-11
Publications (2)
Publication Number
Publication Date
AU1105583A
true
AU1105583A
(en)
1983-06-30
AU559848B2
AU559848B2
(en)
1987-03-19
Family
ID=23287351
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU11055/83A
Ceased
AU559848B2
(en)
1981-12-11
1982-12-08
A maskless process for applying a patterned coating
Country Status (9)
Country
Link
EP
(2)
EP0096710B1
(en)
JP
(1)
JPS58502125A
(en)
KR
(1)
KR840003185A
(en)
AU
(1)
AU559848B2
(en)
CA
(1)
CA1198082A
(en)
DE
(1)
DE3270328D1
(en)
GB
(1)
GB2111405B
(en)
HK
(1)
HK7786A
(en)
WO
(1)
WO1983002074A1
(en)
Families Citing this family (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4752553A
(en)
*
1982-04-01
1988-06-21
M&T Chemicals Inc.
High resolution solder mask photopolymers for screen coating over circuit traces
EP0258497A1
(en)
*
1986-09-01
1988-03-09
Donald Fort Sullivan
High resolution liquid photopolymer coating patterns over irregular printed wiring board surface conductors
JPS62177187A
(en)
*
1986-01-30
1987-08-04
Sumitomo Suriim Kk
Metallic image forming method
US6663442B1
(en)
2000-01-27
2003-12-16
Tyco Electronics Corporation
High speed interconnect using printed circuit board with plated bores
CN106707700B
(en)
*
2017-03-24
2018-04-06
上海誉刻智能装备有限公司
A kind of welding resistance exposure method
Family Cites Families (9)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2965952A
(en)
*
1955-07-18
1960-12-27
Fredric M Gillett
Method for manufacturing etched circuitry
US3573975A
(en)
*
1968-07-10
1971-04-06
Ibm
Photochemical fabrication process
US3850675A
(en)
*
1970-11-30
1974-11-26
Weyerhaeuser Co
Use of ultraviolet light to cure uncured surface layer resulting from air inhibition in preceding high energy ionizing radiation curing process
US4022932A
(en)
*
1975-06-09
1977-05-10
International Business Machines Corporation
Resist reflow method for making submicron patterned resist masks
US4017968A
(en)
*
1975-09-18
1977-04-19
Jerobee Industries, Inc.
Method of making plated through hole printed circuit board
US4136225A
(en)
*
1977-07-08
1979-01-23
Bell Telephone Laboratories, Incorporated
Cover coatings for printed circuits
GB2003660A
(en)
*
1977-08-19
1979-03-14
Plessey Co Ltd
Deposition of material on a substrate
DE2861486D1
(en)
*
1977-11-21
1982-02-18
Ciba Geigy Ag
Process for the application of soldering masks to printed circuits with through holes for contacting
US4234626A
(en)
*
1978-02-01
1980-11-18
E. I. Du Pont De Nemours And Company
Producing printed circuits by conjoining metal powder images
1982
1982-11-16
CA
CA000415672A
patent/CA1198082A/en
not_active
Expired
1982-12-08
EP
EP83900302A
patent/EP0096710B1/en
not_active
Expired
1982-12-08
EP
EP82306558A
patent/EP0081977A3/en
active
Pending
1982-12-08
WO
PCT/US1982/001713
patent/WO1983002074A1/en
active
IP Right Grant
1982-12-08
JP
JP83500395A
patent/JPS58502125A/en
active
Pending
1982-12-08
AU
AU11055/83A
patent/AU559848B2/en
not_active
Ceased
1982-12-08
DE
DE8383900302T
patent/DE3270328D1/en
not_active
Expired
1982-12-08
GB
GB08234956A
patent/GB2111405B/en
not_active
Expired
1982-12-09
KR
KR1019820005522A
patent/KR840003185A/en
unknown
1986
1986-01-30
HK
HK77/86A
patent/HK7786A/en
unknown
Also Published As
Publication number
Publication date
AU559848B2
(en)
1987-03-19
EP0081977A3
(en)
1984-06-27
EP0081977A2
(en)
1983-06-22
KR840003185A
(en)
1984-08-13
HK7786A
(en)
1986-02-07
DE3270328D1
(en)
1986-05-07
CA1198082A
(en)
1985-12-17
WO1983002074A1
(en)
1983-06-23
GB2111405B
(en)
1985-05-30
JPS58502125A
(en)
1983-12-08
GB2111405A
(en)
1983-07-06
EP0096710B1
(en)
1986-04-02
EP0096710A1
(en)
1983-12-28
EP0096710A4
(en)
1984-03-26
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