AU3321289A – Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
– Google Patents
AU3321289A – Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
– Google Patents
Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
Info
Publication number
AU3321289A
AU3321289A
AU33212/89A
AU3321289A
AU3321289A
AU 3321289 A
AU3321289 A
AU 3321289A
AU 33212/89 A
AU33212/89 A
AU 33212/89A
AU 3321289 A
AU3321289 A
AU 3321289A
AU 3321289 A
AU3321289 A
AU 3321289A
Authority
AU
Australia
Prior art keywords
etchant solution
reconditioning
ammoniacal
etching copper
solution
Prior art date
1989-04-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU33212/89A
Other versions
AU608969B2
(en
Inventor
Ming-Hsing Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1989-04-21
Filing date
1989-04-19
Publication date
1990-11-08
1989-04-19
Application filed by Individual
filed
Critical
Individual
1990-11-08
Publication of AU3321289A
publication
Critical
patent/AU3321289A/en
1991-04-18
Application granted
granted
Critical
1991-04-18
Publication of AU608969B2
publication
Critical
patent/AU608969B2/en
2009-04-19
Anticipated expiration
legal-status
Critical
Status
Ceased
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
C23F1/00—Etching metallic material by chemical means
C23F1/10—Etching compositions
C23F1/14—Aqueous compositions
C23F1/32—Alkaline compositions
C23F1/34—Alkaline compositions for etching copper or alloys thereof
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
C23F1/00—Etching metallic material by chemical means
C23F1/46—Regeneration of etching compositions
AU33212/89A
1989-04-21
1989-04-19
Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
Ceased
AU608969B2
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US07/341,469
US4915776A
(en)
1989-04-21
1989-04-21
Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
Publications (2)
Publication Number
Publication Date
AU3321289A
true
AU3321289A
(en)
1990-11-08
AU608969B2
AU608969B2
(en)
1991-04-18
Family
ID=23337702
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU33212/89A
Ceased
AU608969B2
(en)
1989-04-21
1989-04-19
Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
Country Status (3)
Country
Link
US
(1)
US4915776A
(en)
EP
(1)
EP0393270A1
(en)
AU
(1)
AU608969B2
(en)
Families Citing this family (12)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US5248398A
(en)
*
1990-11-16
1993-09-28
Macdermid, Incorporated
Process for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bath
US5085730A
(en)
*
1990-11-16
1992-02-04
Macdermid, Incorporated
Process for regenerating ammoniacal chloride etchants
BR9100566A
(en)
*
1991-02-08
1992-09-29
Maria Helena Soukup
PROCESS OF MANUFACTURING, BY CORROSION, OF CIRCUITS PRINTED ON PLATES
US5227010A
(en)
*
1991-04-03
1993-07-13
International Business Machines Corporation
Regeneration of ferric chloride etchants
US5472618A
(en)
*
1994-02-07
1995-12-05
Great Western Chemical Company
Method for recovering metals from solutions
US5560838A
(en)
*
1994-12-05
1996-10-01
Training `N` Technology, Inc.
Process and apparatus for converting spent etchants
US5556553A
(en)
*
1995-05-23
1996-09-17
Applied Electroless Concepts, Inc.
Recycle process for regeneration of ammoniacal copper etchant
US6147395A
(en)
*
1996-10-02
2000-11-14
Micron Technology, Inc.
Method for fabricating a small area of contact between electrodes
KR100379903B1
(en)
*
2000-05-30
2003-04-14
주식회사 명진화학
Preparation of highly pure copper oxide from waste etchant
SE531697C2
(en)
*
2007-07-11
2009-07-07
Sigma Engineering Ab
Etching and recycling process
KR100882896B1
(en)
*
2008-10-31
2009-02-10
박성종
Method for preparing high purity copper oxide containing a trace amount of chlorine from waste copper tetramine chloride solution
US11037792B2
(en)
*
2018-10-25
2021-06-15
Taiwan Semiconductor Manufacturing Company Ltd.
Semiconductor structure etching solution and method for fabricating a semiconductor structure using the same etching solution
Family Cites Families (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3999564A
(en)
*
1976-01-09
1976-12-28
Pesek Engineering & Mfg. Co.
Continuous etching and etched material recovery system
DE2917597A1
(en)
*
1979-04-30
1980-11-13
Siemens Ag
METHOD FOR REGENERATING AMMONIACAL ETCH SOLUTIONS FOR ETCHING METALLIC COPPER
US4233106A
(en)
*
1979-07-09
1980-11-11
Chemcut Corporation
Method for ion control of solutions
DE3204815A1
(en)
*
1982-02-11
1983-08-25
Dieter 5650 Solingen Klein
Process for regenerating alkaline etchants for copper
DE3340343A1
(en)
*
1983-04-13
1984-10-18
Kernforschungsanlage Jülich GmbH, 5170 Jülich
METHOD AND PLANT FOR REGENERATING AN AMMONIA ACID SOLUTION
ATE34781T1
(en)
*
1983-04-13
1988-06-15
Kernforschungsanlage Juelich
PLANT FOR REGENERATION OF AN AMMONIA CAUSTIC SOLUTION.
1989
1989-04-19
AU
AU33212/89A
patent/AU608969B2/en
not_active
Ceased
1989-04-19
EP
EP89303906A
patent/EP0393270A1/en
not_active
Withdrawn
1989-04-21
US
US07/341,469
patent/US4915776A/en
not_active
Expired – Fee Related
Also Published As
Publication number
Publication date
EP0393270A1
(en)
1990-10-24
US4915776A
(en)
1990-04-10
AU608969B2
(en)
1991-04-18
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None