AU4663289A – Etchant solution for photoresist-patterned metal layers
– Google Patents
AU4663289A – Etchant solution for photoresist-patterned metal layers
– Google Patents
Etchant solution for photoresist-patterned metal layers
Info
Publication number
AU4663289A
AU4663289A
AU46632/89A
AU4663289A
AU4663289A
AU 4663289 A
AU4663289 A
AU 4663289A
AU 46632/89 A
AU46632/89 A
AU 46632/89A
AU 4663289 A
AU4663289 A
AU 4663289A
AU 4663289 A
AU4663289 A
AU 4663289A
Authority
AU
Australia
Prior art keywords
photoresist
metal layers
patterned metal
etchant solution
etchant
Prior art date
1989-05-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU46632/89A
Inventor
Thomas S. Roche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1989-05-04
Filing date
1989-11-27
Publication date
1990-11-29
1989-11-27
Application filed by Olin Corp
filed
Critical
Olin Corp
1990-11-29
Publication of AU4663289A
publication
Critical
patent/AU4663289A/en
Status
Abandoned
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
C09K13/00—Etching, surface-brightening or pickling compositions
C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 – H01L21/26
H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 – H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
H01L21/321—After treatment
H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
C—CHEMISTRY; METALLURGY
C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
C09K13/00—Etching, surface-brightening or pickling compositions
C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
C23F1/00—Etching metallic material by chemical means
C23F1/10—Etching compositions
C23F1/14—Aqueous compositions
C23F1/16—Acidic compositions
C23F1/20—Acidic compositions for etching aluminium or alloys thereof
AU46632/89A
1989-05-04
1989-11-27
Etchant solution for photoresist-patterned metal layers
Abandoned
AU4663289A
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
US07/347,128
US4895617A
(en)
1989-05-04
1989-05-04
Etchant solution for photoresist-patterned metal layers
US347128
1989-05-04
Publications (1)
Publication Number
Publication Date
AU4663289A
true
AU4663289A
(en)
1990-11-29
Family
ID=23362450
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU46632/89A
Abandoned
AU4663289A
(en)
1989-05-04
1989-11-27
Etchant solution for photoresist-patterned metal layers
Country Status (7)
Country
Link
US
(1)
US4895617A
(en)
EP
(1)
EP0470957B1
(en)
JP
(1)
JP2919959B2
(en)
KR
(1)
KR920700939A
(en)
AU
(1)
AU4663289A
(en)
DE
(1)
DE68912351T2
(en)
WO
(1)
WO1990013443A1
(en)
Families Citing this family (23)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE4101564A1
(en)
*
1991-01-21
1992-07-23
Riedel De Haen Ag
ETCH SOLUTION FOR WET CHEMICAL PROCESSES OF SEMICONDUCTOR PRODUCTION
JP2734839B2
(en)
*
1991-10-09
1998-04-02
シャープ株式会社
Etching solution for aluminum, etching method and aluminum etching product
US6127279A
(en)
*
1994-09-26
2000-10-03
Semiconductor Energy Laboratory Co., Ltd.
Solution applying method
US6384001B2
(en)
1997-03-03
2002-05-07
Micron Technology, Inc.
Dilute cleaning composition
US6313048B1
(en)
1997-03-03
2001-11-06
Micron Technology, Inc.
Dilute cleaning composition and method for using same
US5922123A
(en)
*
1997-12-17
1999-07-13
Bayer Corporation
Method for conditioning organic pigments
US6486108B1
(en)
*
2000-05-31
2002-11-26
Micron Technology, Inc.
Cleaning composition useful in semiconductor integrated circuit fabrication
KR100420100B1
(en)
*
2001-07-12
2004-03-04
삼성전자주식회사
Aluminium etchant composition
TWI245071B
(en)
*
2002-04-24
2005-12-11
Mitsubishi Chem Corp
Etchant and method of etching
US7147798B2
(en)
*
2003-08-22
2006-12-12
Arch Specialty Chemicals, Inc.
Aqueous based metal etchant
JP4428995B2
(en)
*
2003-12-03
2010-03-10
関東化学株式会社
Etching solution composition for metal film
JP4283098B2
(en)
*
2003-12-04
2009-06-24
花王株式会社
Metal component processing solution
JP4459857B2
(en)
*
2004-12-09
2010-04-28
東京応化工業株式会社
Lithographic cleaning liquid and resist pattern forming method using the same
KR100688533B1
(en)
*
2005-02-15
2007-03-02
삼성전자주식회사
RC oscillator insensitive to process deviation,voltage and temperature
KR101160829B1
(en)
*
2005-02-15
2012-06-29
삼성전자주식회사
Etchant composition and method for thin film transistor array panel
KR101299131B1
(en)
*
2006-05-10
2013-08-22
주식회사 동진쎄미켐
Etching composition for tft lcd
JP4969147B2
(en)
*
2006-05-16
2012-07-04
日本製箔株式会社
Manufacturing method of flexible printed wiring board
JP5363713B2
(en)
*
2007-07-19
2013-12-11
三洋半導体製造株式会社
Etching solution composition
JP5685845B2
(en)
*
2010-07-20
2015-03-18
東ソー株式会社
Etching composition
WO2014171054A1
(en)
*
2013-04-19
2014-10-23
パナソニック株式会社
Etching liquid for aluminum-oxide films and thin-film-semiconductor-device manufacturing method using said etching liquid
KR102456079B1
(en)
*
2014-12-24
2022-11-21
삼성디스플레이 주식회사
Cleaning composition for removing oxide and method of cleaning using the same
WO2016111035A1
(en)
*
2015-01-07
2016-07-14
太陽インキ製造株式会社
Surface treatment agent for metal bases
KR102460330B1
(en)
*
2017-10-23
2022-10-27
멕크 가부시키가이샤
Method for producing a film-forming substrate, a film-forming substrate and a surface treatment agent
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
USRE25953E
(en)
*
1966-02-22
Process and composition for
brightening aluminum
US3715250A
(en)
*
1971-03-29
1973-02-06
Gen Instrument Corp
Aluminum etching solution
US4230522A
(en)
*
1978-12-26
1980-10-28
Rockwell International Corporation
PNAF Etchant for aluminum and silicon
JPS60169583A
(en)
*
1984-02-10
1985-09-03
Toyota Motor Corp
Alkali degreasing solution and alkali degreasing agent
1989
1989-05-04
US
US07/347,128
patent/US4895617A/en
not_active
Expired – Lifetime
1989-11-27
DE
DE90901235T
patent/DE68912351T2/en
not_active
Expired – Fee Related
1989-11-27
AU
AU46632/89A
patent/AU4663289A/en
not_active
Abandoned
1989-11-27
KR
KR1019910701313A
patent/KR920700939A/en
active
IP Right Grant
1989-11-27
WO
PCT/US1989/005264
patent/WO1990013443A1/en
active
IP Right Grant
1989-11-27
JP
JP2501288A
patent/JP2919959B2/en
not_active
Expired – Lifetime
1990
1990-11-20
EP
EP90901235A
patent/EP0470957B1/en
not_active
Expired – Lifetime
Also Published As
Publication number
Publication date
EP0470957A1
(en)
1992-02-19
JPH04506528A
(en)
1992-11-12
WO1990013443A1
(en)
1990-11-15
DE68912351D1
(en)
1994-02-24
JP2919959B2
(en)
1999-07-19
DE68912351T2
(en)
1994-05-05
US4895617A
(en)
1990-01-23
KR920700939A
(en)
1992-08-10
EP0470957A4
(en)
1992-06-03
EP0470957B1
(en)
1994-01-12
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