AU498066B2 – Polishing copper
– Google Patents
AU498066B2 – Polishing copper
– Google Patents
Polishing copper
Info
Publication number
AU498066B2
AU498066B2
AU87473/75A
AU8747375A
AU498066B2
AU 498066 B2
AU498066 B2
AU 498066B2
AU 87473/75 A
AU87473/75 A
AU 87473/75A
AU 8747375 A
AU8747375 A
AU 8747375A
AU 498066 B2
AU498066 B2
AU 498066B2
Authority
AU
Australia
Prior art keywords
polishing copper
polishing
copper
Prior art date
1974-12-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU87473/75A
Other versions
AU8747375A
(en
Inventor
A. and FREDRIKSSON CO ERICSON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordnerq AB
Original Assignee
Nordnero AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1974-12-13
Filing date
1975-12-11
Publication date
1979-02-08
1975-12-11
Application filed by Nordnero AB
filed
Critical
Nordnero AB
1977-06-16
Publication of AU8747375A
publication
Critical
patent/AU8747375A/en
1979-02-08
Application granted
granted
Critical
1979-02-08
Publication of AU498066B2
publication
Critical
patent/AU498066B2/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
C23F3/00—Brightening metals by chemical means
C23F3/04—Heavy metals
C23F3/06—Heavy metals with acidic solutions
AU87473/75A
1974-12-13
1975-12-11
Polishing copper
Expired
AU498066B2
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
SE7415649A
SE400581B
(en)
1974-12-13
1974-12-13
BATH FOR CHEMICAL POLISHING OF COPPER AND ITS ALLOYS
SESE7415649-
1974-12-13
Publications (2)
Publication Number
Publication Date
AU8747375A
AU8747375A
(en)
1977-06-16
AU498066B2
true
AU498066B2
(en)
1979-02-08
Family
ID=20322991
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU87473/75A
Expired
AU498066B2
(en)
1974-12-13
1975-12-11
Polishing copper
Country Status (7)
Country
Link
US
(1)
US4086176A
(en)
JP
(1)
JPS5821028B2
(en)
AU
(1)
AU498066B2
(en)
CA
(1)
CA1052674A
(en)
DE
(1)
DE2555810A1
(en)
GB
(1)
GB1503710A
(en)
SE
(1)
SE400581B
(en)
Families Citing this family (41)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4141850A
(en)
*
1977-11-08
1979-02-27
Dart Industries Inc.
Dissolution of metals
US4158592A
(en)
*
1977-11-08
1979-06-19
Dart Industries Inc.
Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with ketone compounds
US4158593A
(en)
*
1977-11-08
1979-06-19
Dart Industries Inc.
Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with selenium compounds
US4217234A
(en)
*
1978-02-16
1980-08-12
Werner Krisp
Denture cleansing tablet and method of manufacturing the same
US4233113A
(en)
*
1979-06-25
1980-11-11
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant
US4236957A
(en)
*
1979-06-25
1980-12-02
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 SOY –H2 O.sub. -mercapto containing heterocyclic nitrogen etchant
US4233111A
(en)
*
1979-06-25
1980-11-11
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant
US4233112A
(en)
*
1979-06-25
1980-11-11
Dart Industries Inc.
Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -polysulfide etchant
US4452643A
(en)
*
1983-01-12
1984-06-05
Halliburton Company
Method of removing copper and copper oxide from a ferrous metal surface
US4491500A
(en)
*
1984-02-17
1985-01-01
Rem Chemicals, Inc.
Method for refinement of metal surfaces
JPS61173927U
(en)
*
1985-04-16
1986-10-29
JPS61173926U
(en)
*
1985-04-16
1986-10-29
US4724041A
(en)
*
1986-11-24
1988-02-09
Sherman Peter G
Liquid dispersion composition for, and method of, polishing ferrous components
US4724042A
(en)
*
1986-11-24
1988-02-09
Sherman Peter G
Dry granular composition for, and method of, polishing ferrous components
US4754803A
(en)
*
1987-02-02
1988-07-05
Phelps Dodge Industries, Inc.
Manufacturing copper rod by casting, hot rolling and chemically shaving and pickling
US4946520A
(en)
*
1987-02-02
1990-08-07
Phelps Dodge Industries, Inc.
Copper rod manufactured by casting, hot rolling and chemically shaving and pickling
JPS63161913U
(en)
*
1987-04-06
1988-10-21
US4859281A
(en)
*
1987-06-04
1989-08-22
Pennwalt Corporation
Etching of copper and copper bearing alloys
US4875972A
(en)
*
1988-07-27
1989-10-24
E. I. Du Pont De Nemours And Company
Hydrogen peroxide compositions containing a substituted oxybenzene compound
US4915781A
(en)
*
1988-07-27
1990-04-10
E. I. Du Pont De Nemours And Company
Stabilized hydrogen peroxide compositions
US4875973A
(en)
*
1988-07-27
1989-10-24
E. I. Du Pont De Nemours And Company
Hydrogen peroxide compositions containing a substituted aminobenzaldehyde
IT1251431B
(en)
*
1991-10-25
1995-05-09
Costante Fontana
COMPOUND WITH HIGH STABILIZING CHARACTERISTICS, PARTICULARLY FOR INORGANIC PEROXIDES USED IN INDUSTRIAL APPLICATIONS
US5575885A
(en)
*
1993-12-14
1996-11-19
Kabushiki Kaisha Toshiba
Copper-based metal polishing solution and method for manufacturing semiconductor device
US6046110A
(en)
*
1995-06-08
2000-04-04
Kabushiki Kaisha Toshiba
Copper-based metal polishing solution and method for manufacturing a semiconductor device
US5795661A
(en)
*
1996-07-10
1998-08-18
Bethlehem Steel Corporation
Zinc coated steel sheet and strip having improved formability and surface quality and method thereof
US6309560B1
(en)
*
1996-12-09
2001-10-30
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper substrates
US5954997A
(en)
*
1996-12-09
1999-09-21
Cabot Corporation
Chemical mechanical polishing slurry useful for copper substrates
US6126853A
(en)
1996-12-09
2000-10-03
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper substrates
US6083419A
(en)
*
1997-07-28
2000-07-04
Cabot Corporation
Polishing composition including an inhibitor of tungsten etching
US6432828B2
(en)
1998-03-18
2002-08-13
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper substrates
US6217416B1
(en)
1998-06-26
2001-04-17
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry useful for copper/tantalum substrates
US6063306A
(en)
*
1998-06-26
2000-05-16
Cabot Corporation
Chemical mechanical polishing slurry useful for copper/tantalum substrate
US6533832B2
(en)
1998-06-26
2003-03-18
Cabot Microelectronics Corporation
Chemical mechanical polishing slurry and method for using same
US6046108A
(en)
1999-06-25
2000-04-04
Taiwan Semiconductor Manufacturing Company
Method for selective growth of Cu3 Ge or Cu5 Si for passivation of damascene copper structures and device manufactured thereby
US6599837B1
(en)
*
2000-02-29
2003-07-29
Agere Systems Guardian Corp.
Chemical mechanical polishing composition and method of polishing metal layers using same
JP2004526308A
(en)
*
2001-01-16
2004-08-26
キャボット マイクロエレクトロニクス コーポレイション
Polishing system and method containing ammonium oxalate
US6953389B2
(en)
*
2001-08-09
2005-10-11
Cheil Industries, Inc.
Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
TW591089B
(en)
*
2001-08-09
2004-06-11
Cheil Ind Inc
Slurry composition for use in chemical mechanical polishing of metal wiring
CN102051620A
(en)
*
2010-11-24
2011-05-11
温州奥洋金属表面处理有限公司
Polishing solution for replacing copper pickling process to process surface of copper and copper alloy
US8936672B1
(en)
*
2012-06-22
2015-01-20
Accu-Labs, Inc.
Polishing and electroless nickel compositions, kits, and methods
CN108624237B
(en)
*
2017-03-21
2021-01-26
上海铝通化学科技有限公司
Chemical grinding and polishing solution and grinding and polishing method
Family Cites Families (14)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2211400A
(en)
*
1938-08-10
1940-08-13
Chase Brass & Copper Co
Pickling solution for copper-base alloys
US2428804A
(en)
*
1945-09-07
1947-10-14
Esther M Terry
Copper cleaning composition
US2894905A
(en)
*
1958-05-02
1959-07-14
Pure Oil Co
Inhibiting precipitation of iron oxide from iron-containing waters
DE1121594B
(en)
*
1960-07-07
1962-01-11
Henkel & Cie Gmbh
Process for the production of liquid, storage-stable concentrates containing active oxygen
US3345217A
(en)
*
1964-06-01
1967-10-03
Fremont Ind Inc
Method of cleaning and phosphatizing copper circuits
US3367875A
(en)
*
1964-08-19
1968-02-06
Hunt Chem Corp Philip A
Composition for etching copper and copper-containing alloys
US3537926A
(en)
*
1967-06-19
1970-11-03
Lancy Lab
Chemical brightening of iron-containing surfaces of workpieces
BE759430A
(en)
1969-11-27
1971-05-25
Unilever Nv
DETERGENT COMPOSITIONS
US3709824A
(en)
*
1971-01-07
1973-01-09
Nippon Soda Co
Method and composition for chemical polishing of stainless steel surfaces
JPS5221460B1
(en)
*
1971-04-26
1977-06-10
JPS5120972B1
(en)
*
1971-05-13
1976-06-29
US3869401A
(en)
*
1972-12-04
1975-03-04
Du Pont
Stabilized acidic hydrogen peroxide solutions
JPS526853B2
(en)
*
1972-12-22
1977-02-25
JPS5332341B2
(en)
*
1973-03-27
1978-09-07
1974
1974-12-13
SE
SE7415649A
patent/SE400581B/en
unknown
1975
1975-12-05
CA
CA241,155A
patent/CA1052674A/en
not_active
Expired
1975-12-08
US
US05/638,698
patent/US4086176A/en
not_active
Expired – Lifetime
1975-12-08
GB
GB52144/75A
patent/GB1503710A/en
not_active
Expired
1975-12-11
DE
DE19752555810
patent/DE2555810A1/en
not_active
Ceased
1975-12-11
AU
AU87473/75A
patent/AU498066B2/en
not_active
Expired
1975-12-12
JP
JP50148327A
patent/JPS5821028B2/en
not_active
Expired
Also Published As
Publication number
Publication date
GB1503710A
(en)
1978-03-15
US4086176A
(en)
1978-04-25
JPS5821028B2
(en)
1983-04-26
CA1052674A
(en)
1979-04-17
JPS5186028A
(en)
1976-07-28
DE2555810A1
(en)
1976-06-16
SE400581B
(en)
1978-04-03
SE7415649L
(en)
1976-06-14
AU8747375A
(en)
1977-06-16
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Dipenylpropylamines
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2-nitroimidazoles
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Triazine-diones
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Triazolobenzodiazepines
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(en)
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(en)
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Handstamp
None