AU505174B2 – Semiconductor brazed head electrode
– Google Patents
AU505174B2 – Semiconductor brazed head electrode
– Google Patents
Semiconductor brazed head electrode
Info
Publication number
AU505174B2
AU505174B2
AU13775/76A
AU1377576A
AU505174B2
AU 505174 B2
AU505174 B2
AU 505174B2
AU 13775/76 A
AU13775/76 A
AU 13775/76A
AU 1377576 A
AU1377576 A
AU 1377576A
AU 505174 B2
AU505174 B2
AU 505174B2
Authority
AU
Australia
Prior art keywords
brazed
semiconductor
head electrode
electrode
head
Prior art date
1975-12-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU13775/76A
Other versions
AU1377576A
(en
Inventor
M. B. Voorhis W. B Goldberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Technology Inc
Original Assignee
Arris Technology Inc
General Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1975-12-19
Filing date
1976-05-10
Publication date
1979-11-08
1975-12-19
Priority claimed from US05/642,588
external-priority
patent/US4017266A/en
1976-05-10
Application filed by Arris Technology Inc, General Instrument Corp
filed
Critical
Arris Technology Inc
1977-11-17
Publication of AU1377576A
publication
Critical
patent/AU1377576A/en
1979-11-08
Application granted
granted
Critical
1979-11-08
Publication of AU505174B2
publication
Critical
patent/AU505174B2/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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H01L23/00—Details of semiconductor or other solid state devices
H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
H01L23/3157—Partial encapsulation or coating
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H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
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H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/8319—Arrangement of the layer connectors prior to mounting
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H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/838—Bonding techniques
H01L2224/83801—Soldering or alloying
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H01L2924/01—Chemical elements
H01L2924/01073—Tantalum [Ta]
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H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/01074—Tungsten [W]
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H01L2924/01075—Rhenium [Re]
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H01L2924/013—Alloys
H01L2924/0132—Binary Alloys
H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/014—Solder alloys
H—ELECTRICITY
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H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/102—Material of the semiconductor or solid state bodies
H01L2924/1025—Semiconducting materials
H01L2924/10251—Elemental semiconductors, i.e. Group IV
H01L2924/10253—Silicon [Si]
H—ELECTRICITY
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H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/13—Discrete devices, e.g. 3 terminal devices
H01L2924/1304—Transistor
H01L2924/1306—Field-effect transistor [FET]
H01L2924/13062—Junction field-effect transistor [JFET]
AU13775/76A
1975-12-19
1976-05-10
Semiconductor brazed head electrode
Expired
AU505174B2
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
USUS642,588
1975-12-19
US05/642,588
US4017266A
(en)
1974-04-24
1975-12-19
Process for making a brazed lead electrode, and product thereof
Publications (2)
Publication Number
Publication Date
AU1377576A
AU1377576A
(en)
1977-11-17
AU505174B2
true
AU505174B2
(en)
1979-11-08
Family
ID=24577211
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU13775/76A
Expired
AU505174B2
(en)
1975-12-19
1976-05-10
Semiconductor brazed head electrode
Country Status (6)
Country
Link
AU
(1)
AU505174B2
(en)
CA
(1)
CA1057421A
(en)
DE
(1)
DE2619869A1
(en)
FR
(1)
FR2335954A2
(en)
IT
(1)
IT1069952B
(en)
MX
(1)
MX3349E
(en)
1976
1976-05-05
DE
DE19762619869
patent/DE2619869A1/en
not_active
Ceased
1976-05-10
AU
AU13775/76A
patent/AU505174B2/en
not_active
Expired
1976-06-04
MX
MX100346U
patent/MX3349E/en
unknown
1976-08-06
FR
FR7624218A
patent/FR2335954A2/en
active
Pending
1976-11-02
CA
CA264,663A
patent/CA1057421A/en
not_active
Expired
1976-12-15
IT
IT52625/76A
patent/IT1069952B/en
active
Also Published As
Publication number
Publication date
FR2335954A2
(en)
1977-07-15
MX3349E
(en)
1980-10-06
AU1377576A
(en)
1977-11-17
CA1057421A
(en)
1979-06-26
DE2619869A1
(en)
1977-06-30
IT1069952B
(en)
1985-03-25
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