AU513792B2 – Method of providing spacers ona substrate
– Google Patents
AU513792B2 – Method of providing spacers ona substrate
– Google Patents
Method of providing spacers ona substrate
Info
Publication number
AU513792B2
AU513792B2
AU35568/78A
AU3556878A
AU513792B2
AU 513792 B2
AU513792 B2
AU 513792B2
AU 35568/78 A
AU35568/78 A
AU 35568/78A
AU 3556878 A
AU3556878 A
AU 3556878A
AU 513792 B2
AU513792 B2
AU 513792B2
Authority
AU
Australia
Prior art keywords
providing spacers
ona
substrate
ona substrate
spacers
Prior art date
1977-05-02
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU35568/78A
Other versions
AU3556878A
(en
Inventor
W. C Hildring
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1977-05-02
Filing date
1978-04-28
Publication date
1981-01-08
1978-04-28
Application filed by Philips Gloeilampenfabrieken NV
filed
Critical
Philips Gloeilampenfabrieken NV
1979-11-01
Publication of AU3556878A
publication
Critical
patent/AU3556878A/en
1981-01-08
Application granted
granted
Critical
1981-01-08
Publication of AU513792B2
publication
Critical
patent/AU513792B2/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 – H01L21/326
H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H01L2224/8112—Aligning
H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H01L2224/818—Bonding techniques
H01L2224/81801—Soldering or alloying
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01005—Boron [B]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01013—Aluminum [Al]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01019—Potassium [K]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01033—Arsenic [As]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01046—Palladium [Pd]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01047—Silver [Ag]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01067—Holmium [Ho]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01076—Osmium [Os]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/014—Solder alloys
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/14—Integrated circuits
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
H01L2924/1901—Structure
H01L2924/1904—Component type
H01L2924/19041—Component type being a capacitor
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
H01L2924/1901—Structure
H01L2924/1904—Component type
H01L2924/19043—Component type being a resistor
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/09—Use of materials for the conductive, e.g. metallic pattern
H05K1/092—Dispersed materials, e.g. conductive pastes or inks
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 – H05K2201/09809
H05K2201/09909—Special local insulating pattern, e.g. as dam around component
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
H05K2201/10007—Types of components
H05K2201/10166—Transistor
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/20—Details of printed circuits not provided for in H05K2201/01 – H05K2201/10
H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
AU35568/78A
1977-05-02
1978-04-28
Method of providing spacers ona substrate
Expired
AU513792B2
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
NL7704770A
NL7704770A
(en)
1977-05-02
1977-05-02
PROCEDURE FOR APPLYING SPACERS TO AN INSULATING SUBSTRATE.
NLNL7704770
1977-05-02
Publications (2)
Publication Number
Publication Date
AU3556878A
AU3556878A
(en)
1979-11-01
AU513792B2
true
AU513792B2
(en)
1981-01-08
Family
ID=19828467
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU35568/78A
Expired
AU513792B2
(en)
1977-05-02
1978-04-28
Method of providing spacers ona substrate
Country Status (9)
Country
Link
US
(1)
US4184043A
(en)
JP
(1)
JPS53135462A
(en)
AU
(1)
AU513792B2
(en)
CA
(1)
CA1112371A
(en)
DE
(1)
DE2817286C2
(en)
FR
(1)
FR2390005B1
(en)
GB
(1)
GB1583288A
(en)
IT
(1)
IT1094980B
(en)
NL
(1)
NL7704770A
(en)
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
AU649559B2
(en)
*
1991-09-10
1994-05-26
Fujitsu Limited
Process for flip chip connecting semiconductor chip
Families Citing this family (30)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2452786A1
(en)
*
1979-03-30
1980-10-24
Silicium Semiconducteur Ssc
Power semiconductor heat sink soldering system – with thin layer preventing adherence of solder applied to semiconductor perimeter
US4391845A
(en)
*
1981-11-19
1983-07-05
Oak Industries Inc.
Method of making a membrane switch
US4545610A
(en)
*
1983-11-25
1985-10-08
International Business Machines Corporation
Method for forming elongated solder connections between a semiconductor device and a supporting substrate
US4641222A
(en)
*
1984-05-29
1987-02-03
Motorola, Inc.
Mounting system for stress relief in surface mounted components
JPS6255996A
(en)
*
1985-09-05
1987-03-11
日本電気株式会社
Wiring board
DE3534502A1
(en)
*
1985-09-27
1987-04-09
Licentia Gmbh
METHOD FOR PRODUCING ADHESIVE CONTACT
US4777564A
(en)
*
1986-10-16
1988-10-11
Motorola, Inc.
Leadform for use with surface mounted components
JPH02117196A
(en)
*
1988-10-26
1990-05-01
Canon Inc
Printed circuit board
US5045142A
(en)
*
1989-11-22
1991-09-03
Xerox Corporation
Stand-off structure for flipped chip butting
US5001829A
(en)
*
1990-01-02
1991-03-26
General Electric Company
Method for connecting a leadless chip carrier to a substrate
JPH0563029A
(en)
*
1991-09-02
1993-03-12
Fujitsu Ltd
Semiconductor device
US5255431A
(en)
*
1992-06-26
1993-10-26
General Electric Company
Method of using frozen epoxy for placing pin-mounted components in a circuit module
DE4228012C2
(en)
*
1992-08-24
1996-08-22
Siemens Ag
Method for spacing two components
US5573172A
(en)
*
1993-11-08
1996-11-12
Sawtek, Inc.
Surface mount stress relief hidden lead package device and method
DE9411391U1
(en)
*
1994-07-14
1995-11-16
Giersiepen Gira Gmbh
Electrical installation device
DE19518027C2
(en)
*
1995-05-17
1997-05-15
Lust Hybrid Technik Gmbh
Process for the precise spacing encasing of components provided with functional layers and components produced thereafter
JPH097660A
(en)
*
1995-06-22
1997-01-10
Yazaki Corp
Signal transmitting device
DE19533251A1
(en)
*
1995-06-27
1997-01-02
Braun Ag
Method for the thermally conductive fastening of an electronic power component on a printed circuit board with a heat sink or heat sink
ATE203355T1
(en)
*
1995-06-27
2001-08-15
Braun Gmbh
HEAT CONDUCTION MOUNTING OF AN ELECTRONIC POWER COMPONENT ON A CIRCUIT BOARD WITH COOLING PLATE
DE19750073A1
(en)
*
1997-11-12
1999-05-20
Bosch Gmbh Robert
Circuit board
US6086705A
(en)
*
1998-09-14
2000-07-11
Industrial Technology Research Institute
Bonding of micro elements
DE10030697C2
(en)
*
2000-06-23
2002-06-27
Infineon Technologies Ag
Method for mounting a semiconductor chip on a substrate
US7518223B2
(en)
*
2001-08-24
2009-04-14
Micron Technology, Inc.
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
US7109583B2
(en)
*
2004-05-06
2006-09-19
Endwave Corporation
Mounting with auxiliary bumps
DE102004037610B3
(en)
2004-08-03
2006-03-16
Infineon Technologies Ag
Integrated circuit connection method e.g. for substrate and circuit assembly, involves planning flexible intermediate layer on integrated circuit and or substrate with flexible layer structured in raised and lower ranges
DE102004039853A1
(en)
*
2004-08-17
2006-03-09
Siemens Ag
Electrical unit e.g. passive magnetic position sensor, for use in motor vehicle tank, has component that is held at distance from substrate by intermediate unit, and soldered or welded to intermediate unit using laser welding method
US8957511B2
(en)
*
2005-08-22
2015-02-17
Madhukar B. Vora
Apparatus and methods for high-density chip connectivity
US7745301B2
(en)
*
2005-08-22
2010-06-29
Terapede, Llc
Methods and apparatus for high-density chip connectivity
DE102005050830A1
(en)
*
2005-10-24
2007-04-26
Tridonicatco Gmbh & Co. Kg
Distance arrangement method e.g. for components on assembly area of circuit board, involves applying three-dimensional printing in environment of component hole on assembly surface of PCB
CN108781515B
(en)
*
2016-02-18
2021-03-12
三菱电机株式会社
Electronic device and method for manufacturing the same
Family Cites Families (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3098287A
(en)
*
1958-07-22
1963-07-23
Hazeltine Research Inc
Method of assembling components on printed wiring boards
US3832769A
(en)
*
1971-05-26
1974-09-03
Minnesota Mining & Mfg
Circuitry and method
US3811186A
(en)
*
1972-12-11
1974-05-21
Ibm
Method of aligning and attaching circuit devices on a substrate
1977
1977-05-02
NL
NL7704770A
patent/NL7704770A/en
not_active
Application Discontinuation
1978
1978-04-20
DE
DE2817286A
patent/DE2817286C2/en
not_active
Expired
1978-04-21
US
US05/898,653
patent/US4184043A/en
not_active
Expired – Lifetime
1978-04-27
CA
CA302,120A
patent/CA1112371A/en
not_active
Expired
1978-04-28
AU
AU35568/78A
patent/AU513792B2/en
not_active
Expired
1978-04-28
FR
FR7812638A
patent/FR2390005B1/fr
not_active
Expired
1978-04-28
IT
IT7822878A
patent/IT1094980B/en
active
1978-04-28
JP
JP5019778A
patent/JPS53135462A/en
active
Pending
1978-04-28
GB
GB16954/78A
patent/GB1583288A/en
not_active
Expired
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
AU649559B2
(en)
*
1991-09-10
1994-05-26
Fujitsu Limited
Process for flip chip connecting semiconductor chip
Also Published As
Publication number
Publication date
DE2817286C2
(en)
1984-03-22
FR2390005B1
(en)
1983-12-09
NL7704770A
(en)
1978-11-06
IT7822878D0
(en)
1978-04-28
FR2390005A1
(en)
1978-12-01
US4184043A
(en)
1980-01-15
IT1094980B
(en)
1985-08-10
GB1583288A
(en)
1981-01-21
JPS53135462A
(en)
1978-11-27
CA1112371A
(en)
1981-11-10
DE2817286A1
(en)
1978-11-09
AU3556878A
(en)
1979-11-01
Similar Documents
Publication
Publication Date
Title
AU513792B2
(en)
1981-01-08
Method of providing spacers ona substrate
AU4394579A
(en)
1979-08-16
Easily split substrates
CA1033470A
(en)
1978-06-20
Method of suppressing parasitic structural elements
AU528581B2
(en)
1983-05-05
Coating method
AU4621779A
(en)
1979-10-18
Method of mining
AU520682B2
(en)
1982-02-18
Lipogensis inhibitors
CA991374A
(en)
1976-06-22
Method of mounting of panels
JPS553696A
(en)
1980-01-11
Method of postttreating thin layer
AU522967B2
(en)
1982-07-08
Method of pulverizing
JPS5618487A
(en)
1981-02-21
Method of regulating split substrate
SU617249A1
(en)
1978-07-30
Method of levelling-out coatings
AU514712B2
(en)
1981-02-19
Method of inhibiting flea-bite allergy
SU638726A1
(en)
1978-12-25
Method of excavating pillars
SU661041A1
(en)
1979-05-05
Method of treating invars
SU639856A1
(en)
1978-12-30
Method of obtaining 1-oxy-anthraquinone
SU622815A1
(en)
1978-09-05
Method of obtaining triethylammoniumdodecahydrododecaborate
AU4258378A
(en)
1979-06-21
N-hydrazides of 2-benzo-thiazolinones
SU665099A1
(en)
1979-05-30
Method of reducing the temperature at stoping face
SU649722A1
(en)
1979-02-28
Method of obtaining 1-halogengermathranes
SU654761A1
(en)
1979-03-30
Method of installing equipment
SU630261A1
(en)
1978-10-30
Method of obtaining phosphorus-containing polyallene
SU677799A1
(en)
1979-08-05
Work-deforming method
SU677827A1
(en)
1979-08-05
Hole-working method
SU674188A2
(en)
1979-07-15
Generator-synchronizing method
SU576584A1
(en)
1977-10-15
Method of simulating nag-infection
None