AU546818B2 – Method of forming a wire bond
– Google Patents
AU546818B2 – Method of forming a wire bond
– Google Patents
Method of forming a wire bond
Info
Publication number
AU546818B2
AU546818B2
AU76893/81A
AU7689381A
AU546818B2
AU 546818 B2
AU546818 B2
AU 546818B2
AU 76893/81 A
AU76893/81 A
AU 76893/81A
AU 7689381 A
AU7689381 A
AU 7689381A
AU 546818 B2
AU546818 B2
AU 546818B2
Authority
AU
Australia
Prior art keywords
forming
wire bond
bond
wire
Prior art date
1980-10-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU76893/81A
Other versions
AU7689381A
(en
Inventor
Johannes B.P. Janssen
Wilhelmus J.J. Lorenz
Hermanus A. Van De Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1980-10-29
Filing date
1981-10-28
Publication date
1985-09-19
1981-10-28
Application filed by Philips Gloeilampenfabrieken NV
filed
Critical
Philips Gloeilampenfabrieken NV
1982-05-06
Publication of AU7689381A
publication
Critical
patent/AU7689381A/en
1985-09-19
Application granted
granted
Critical
1985-09-19
Publication of AU546818B2
publication
Critical
patent/AU546818B2/en
2001-10-28
Anticipated expiration
legal-status
Critical
Status
Ceased
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
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H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/78—Apparatus for connecting with wire connectors
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H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
H01L2224/45001—Core members of the connector
H01L2224/4501—Shape
H01L2224/45012—Cross-sectional shape
H01L2224/45015—Cross-sectional shape being circular
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H01L2224/45001—Core members of the connector
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H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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H01L2224/481—Disposition
H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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H01L2224/78301—Capillary
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H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. “free-air-ball”
H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. “free-air-ball” using a corona discharge, e.g. electronic flame off [EFO]
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H01L2224/8512—Aligning
H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
H01L2224/8518—Translational movements
H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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H01L2224/852—Applying energy for connecting
H01L2224/85201—Compression bonding
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H01L2924/20754—Diameter ranges larger or equal to 40 microns less than 50 microns
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H01L2924/30105—Capacitance
AU76893/81A
1980-10-29
1981-10-28
Method of forming a wire bond
Ceased
AU546818B2
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
NL8005922
1980-10-29
NL8005922A
NL8005922A
(en)
1980-10-29
1980-10-29
METHOD FOR FORMING A WIRE JOINT
Publications (2)
Publication Number
Publication Date
AU7689381A
AU7689381A
(en)
1982-05-06
AU546818B2
true
AU546818B2
(en)
1985-09-19
Family
ID=19836074
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
AU76893/81A
Ceased
AU546818B2
(en)
1980-10-29
1981-10-28
Method of forming a wire bond
Country Status (18)
Country
Link
JP
(1)
JPS5916409B2
(en)
KR
(1)
KR890000585B1
(en)
AU
(1)
AU546818B2
(en)
BE
(1)
BE890887A
(en)
BR
(1)
BR8106902A
(en)
CA
(1)
CA1178664A
(en)
CH
(1)
CH654142A5
(en)
DD
(1)
DD205294A5
(en)
DE
(1)
DE3141842A1
(en)
ES
(1)
ES506580A0
(en)
FR
(1)
FR2493044B1
(en)
GB
(1)
GB2086297B
(en)
HK
(1)
HK40885A
(en)
IT
(1)
IT1139570B
(en)
MY
(1)
MY8500623A
(en)
NL
(1)
NL8005922A
(en)
PL
(1)
PL133893B1
(en)
SG
(1)
SG21984G
(en)
Families Citing this family (12)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US4476365A
(en)
*
1982-10-08
1984-10-09
Fairchild Camera & Instrument Corp.
Cover gas control of bonding ball formation
US4549059A
(en)
*
1982-11-24
1985-10-22
Nec Corporation
Wire bonder with controlled atmosphere
US4476366A
(en)
*
1983-02-01
1984-10-09
Fairchild Camera & Instrument Corp.
Controlled bonding wire ball formation
US4594493A
(en)
*
1983-07-25
1986-06-10
Fairchild Camera & Instrument Corp.
Method and apparatus for forming ball bonds
FR2555813B1
(en)
*
1983-09-28
1986-06-20
Hitachi Ltd
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE
US4705204A
(en)
*
1985-03-01
1987-11-10
Mitsubishi Denki Kabushiki Kaisha
Method of ball forming for wire bonding
US5031821A
(en)
*
1988-08-19
1991-07-16
Hitachi, Ltd.
Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A
(en)
*
1995-07-14
1997-05-13
Motorola, Inc.
Electrical flame-off wand
DE19618320A1
(en)
*
1996-04-30
1997-11-13
F&K Delvotec Bondtechnik Gmbh
Device for “ball” bonding
JP2003163235A
(en)
*
2001-11-29
2003-06-06
Shinkawa Ltd
Apparatus for wire bonding
TWI229022B
(en)
*
2002-06-20
2005-03-11
Esec Trading Sa
Device with electrodes for the formation of a ball at the end of a wire
JP6093954B2
(en)
*
2012-10-05
2017-03-15
株式会社新川
Antioxidant gas blowing unit
Family Cites Families (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
CH568656A5
(en)
*
1974-03-20
1975-10-31
Transistor Ag
Welding of contact blobs to semiconductor lead wires – uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A
(en)
*
1974-05-21
1975-11-25
Philips Nv
PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE.
GB1536872A
(en)
*
1975-05-15
1978-12-20
Welding Inst
Electrical inter-connection method and apparatus
GB1468974A
(en)
*
1975-05-23
1977-03-30
Ferranti Ltd
Manufacture of semiconductor devices
GB1600021A
(en)
*
1977-07-26
1981-10-14
Welding Inst
Electrical inter-connection method and apparatus
1980
1980-10-29
NL
NL8005922A
patent/NL8005922A/en
not_active
Application Discontinuation
1981
1981-10-22
CA
CA000388476A
patent/CA1178664A/en
not_active
Expired
1981-10-22
DE
DE3141842A
patent/DE3141842A1/en
active
Granted
1981-10-26
GB
GB8132183A
patent/GB2086297B/en
not_active
Expired
1981-10-26
BR
BR8106902A
patent/BR8106902A/en
unknown
1981-10-26
PL
PL1981233586A
patent/PL133893B1/en
unknown
1981-10-26
CH
CH6815/81A
patent/CH654142A5/en
not_active
IP Right Cessation
1981-10-26
FR
FR8120025A
patent/FR2493044B1/en
not_active
Expired
1981-10-26
JP
JP56170252A
patent/JPS5916409B2/en
not_active
Expired
1981-10-27
ES
ES506580A
patent/ES506580A0/en
active
Granted
1981-10-27
IT
IT24731/81A
patent/IT1139570B/en
active
1981-10-27
DD
DD81234387A
patent/DD205294A5/en
unknown
1981-10-27
BE
BE0/206365A
patent/BE890887A/en
not_active
IP Right Cessation
1981-10-28
AU
AU76893/81A
patent/AU546818B2/en
not_active
Ceased
1981-10-28
KR
KR1019810004107A
patent/KR890000585B1/en
active
1984
1984-03-12
SG
SG219/84A
patent/SG21984G/en
unknown
1985
1985-05-23
HK
HK408/85A
patent/HK40885A/en
unknown
1985-12-30
MY
MY623/85A
patent/MY8500623A/en
unknown
Also Published As
Publication number
Publication date
FR2493044B1
(en)
1986-03-28
FR2493044A1
(en)
1982-04-30
JPS5916409B2
(en)
1984-04-16
GB2086297B
(en)
1983-12-21
NL8005922A
(en)
1982-05-17
DD205294A5
(en)
1983-12-21
ES8301390A1
(en)
1982-11-16
MY8500623A
(en)
1985-12-31
DE3141842C2
(en)
1990-09-20
PL133893B1
(en)
1985-07-31
IT8124731D0
(en)
1981-10-27
JPS57102036A
(en)
1982-06-24
IT1139570B
(en)
1986-09-24
CH654142A5
(en)
1986-01-31
DE3141842A1
(en)
1982-10-21
CA1178664A
(en)
1984-11-27
KR890000585B1
(en)
1989-03-21
KR830008394A
(en)
1983-11-18
HK40885A
(en)
1985-05-31
GB2086297A
(en)
1982-05-12
ES506580A0
(en)
1982-11-16
SG21984G
(en)
1985-01-04
AU7689381A
(en)
1982-05-06
BE890887A
(en)
1982-04-27
BR8106902A
(en)
1982-07-13
PL233586A1
(en)
1982-05-10
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