GB1020457A – A process for the production of semi-conductor plates
– Google Patents
GB1020457A – A process for the production of semi-conductor plates
– Google Patents
A process for the production of semi-conductor plates
Info
Publication number
GB1020457A
GB1020457A
GB42355/62A
GB4235562A
GB1020457A
GB 1020457 A
GB1020457 A
GB 1020457A
GB 42355/62 A
GB42355/62 A
GB 42355/62A
GB 4235562 A
GB4235562 A
GB 4235562A
GB 1020457 A
GB1020457 A
GB 1020457A
Authority
GB
United Kingdom
Prior art keywords
foil
plates
semi
sections
swelling
Prior art date
1961-11-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB42355/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1961-11-10
Filing date
1962-11-09
Publication date
1966-02-16
1962-11-09
Application filed by Siemens Schuckertwerke AG, Siemens AG
filed
Critical
Siemens Schuckertwerke AG
1966-02-16
Publication of GB1020457A
publication
Critical
patent/GB1020457A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
H01L21/67005—Apparatus not specifically provided for elsewhere
H01L21/67011—Apparatus for manufacture or treatment
H01L21/67092—Apparatus for mechanical treatment
B—PERFORMING OPERATIONS; TRANSPORTING
B28—WORKING CEMENT, CLAY, OR STONE
B28D—WORKING STONE OR STONE-LIKE MATERIALS
B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 – H01L21/26
H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 – H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
H01L21/3043—Making grooves, e.g. cutting
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
Y10T156/10—Methods of surface bonding and/or assembly therefor
Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T225/00—Severing by tearing or breaking
Y10T225/10—Methods
Y10T225/12—With preliminary weakening
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T225/00—Severing by tearing or breaking
Y10T225/30—Breaking or tearing apparatus
Y10T225/329—Plural breakers
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T225/00—Severing by tearing or breaking
Y10T225/30—Breaking or tearing apparatus
Y10T225/371—Movable breaking tool
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49789—Obtaining plural product pieces from unitary workpiece
Y10T29/4979—Breaking through weakened portion
Abstract
Plates of semi-conductor material, e.g. silicon or germanium, are divided into sections of a desired smaller surface area by sticking the plates to one face of a foil, scoring dividing traces on the exposed, rear surface of the plates and dividing them by bending or swelling of the foil. In one embodiment, silicon plates 3, Fig. 3 (not shown) are stuck to a P.V.C. foil 1 and then, after their exposed surfaces have been scored, as at 4, by a diamond tool, they are placed face-downwards, on a resilient P.T.F.E. slab 7 on a rigid metal plate. Division of the sections is effected by rolling a cylindrical member 8 over the back of the foil. The cylinder 8 may be replaced by a multi-faced prismatic roller 9, Fig. 4 (not shown), or a circular roller with spaced, radially-projecting ribs 11, Fig. 5 (not shown), the length between the edges on the prismatic member and between the ribs in the second member being equal to the distance between the score lines on the semi-conductor body. In an alternative procedure, the foil, with the adherent semi-conductor plates, is immersed in acetone to cause the foil to swell and thereby break the plates along the score lines. It is further proposed to use a composite foil comprising a plurality of layers having different swelling characteristics so that the foil bends on swelling. After the sections of semiconductor material have been separated they are removed from the foil backing by immersion in a solvent for the adhesive. The Specification also describes means for accurately positioning the foil carrying the plates for breaking. Reference has been directed by the Comptroller to Specification 925,016.
GB42355/62A
1961-11-10
1962-11-09
A process for the production of semi-conductor plates
Expired
GB1020457A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
DES0076635
1961-11-10
Publications (1)
Publication Number
Publication Date
GB1020457A
true
GB1020457A
(en)
1966-02-16
Family
ID=7506269
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB42355/62A
Expired
GB1020457A
(en)
1961-11-10
1962-11-09
A process for the production of semi-conductor plates
Country Status (5)
Country
Link
US
(1)
US3206088A
(en)
CH
(1)
CH408219A
(en)
DE
(1)
DE1427749A1
(en)
GB
(1)
GB1020457A
(en)
NL
(1)
NL284964A
(en)
Families Citing this family (18)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE1602001C3
(en)
*
1965-04-30
1975-07-03
Nippon Electric Co. Ltd., Tokio
Method of manufacturing semiconductor elements
US3396452A
(en)
*
1965-06-02
1968-08-13
Nippon Electric Co
Method and apparatus for breaking a semiconductor wafer into elementary pieces
US3384278A
(en)
*
1965-10-21
1968-05-21
Muskegon Piston Ring Co Inc
Method and apparatus for separating the segments of scored piston rings
US3448510A
(en)
*
1966-05-20
1969-06-10
Western Electric Co
Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
NL6709523A
(en)
*
1967-07-08
1969-01-10
US3601296A
(en)
*
1968-12-30
1971-08-24
Texas Instruments Inc
Device for breaking scribed slices of semiconductor material
US3578227A
(en)
*
1969-10-01
1971-05-11
Transitron Electronic Corp
Method of breaking dice
US3870196A
(en)
*
1973-09-28
1975-03-11
Laurier Associates Inc
High yield method of breaking wafer into dice
US3918150A
(en)
*
1974-02-08
1975-11-11
Gen Electric
System for separating a semiconductor wafer into discrete pellets
US4247031A
(en)
*
1979-04-10
1981-01-27
Rca Corporation
Method for cracking and separating pellets formed on a wafer
JPS6282008A
(en)
*
1985-10-04
1987-04-15
三菱電機株式会社
Breaking device for semiconductor wafer
IT1218088B
(en)
*
1988-06-16
1990-04-12
Aisa Spa
EQUIPMENT FOR AUTOMATIC SEPARATION ALONG THE FLEXURAL FRACTURE LINES PREPARED IN BASIC CERAMIC TILES OF HYBRID ELECTRONIC CIRCUITS
US5029418A
(en)
*
1990-03-05
1991-07-09
Eastman Kodak Company
Sawing method for substrate cutting operations
US5393706A
(en)
*
1993-01-07
1995-02-28
Texas Instruments Incorporated
Integrated partial sawing process
US5735442A
(en)
*
1993-05-15
1998-04-07
Emrich; Dirk
Device, clamping tool and process for breaking away cuttings when cutting out blanks from cardboard
US6312800B1
(en)
*
1997-02-10
2001-11-06
Lintec Corporation
Pressure sensitive adhesive sheet for producing a chip
US20060024922A1
(en)
*
2004-07-27
2006-02-02
Da-Tung Wen
Method for cutting wafer
TW201306104A
(en)
*
2011-07-27
2013-02-01
Lextar Electronics Croportion
A chip sawing apparatus and method of manufacturing the same
Family Cites Families (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2970730A
(en)
*
1957-01-08
1961-02-07
Motorola Inc
Dicing semiconductor wafers
US3040489A
(en)
*
1959-03-13
1962-06-26
Motorola Inc
Semiconductor dicing
US3099375A
(en)
*
1960-10-07
1963-07-30
Package Machinery Co
Gum breaking device
0
NL
NL284964D
patent/NL284964A/xx
unknown
1961
1961-11-10
DE
DE19611427749
patent/DE1427749A1/en
active
Pending
1962
1962-11-05
CH
CH1291762A
patent/CH408219A/en
unknown
1962-11-09
GB
GB42355/62A
patent/GB1020457A/en
not_active
Expired
1962-11-13
US
US236872A
patent/US3206088A/en
not_active
Expired – Lifetime
Also Published As
Publication number
Publication date
DE1427749A1
(en)
1968-12-12
CH408219A
(en)
1966-02-28
NL284964A
(en)
1900-01-01
US3206088A
(en)
1965-09-14
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