GB1043891A – A semi-conductor device
– Google Patents
GB1043891A – A semi-conductor device
– Google Patents
A semi-conductor device
Info
Publication number
GB1043891A
GB1043891A
GB16614/63A
GB1661463A
GB1043891A
GB 1043891 A
GB1043891 A
GB 1043891A
GB 16614/63 A
GB16614/63 A
GB 16614/63A
GB 1661463 A
GB1661463 A
GB 1661463A
GB 1043891 A
GB1043891 A
GB 1043891A
Authority
GB
United Kingdom
Prior art keywords
spring
semi
edge
april
cup
Prior art date
1961-08-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB16614/63A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1961-08-12
Filing date
1963-04-26
Publication date
1966-09-28
1963-04-26
Application filed by Siemens Schuckertwerke AG, Siemens AG
filed
Critical
Siemens Schuckertwerke AG
1966-09-28
Publication of GB1043891A
publication
Critical
patent/GB1043891A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01005—Boron [B]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01013—Aluminum [Al]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01014—Silicon [Si]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01019—Potassium [K]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/0102—Calcium [Ca]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01023—Vanadium [V]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01027—Cobalt [Co]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01029—Copper [Cu]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01033—Arsenic [As]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01047—Silver [Ag]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01057—Lanthanum [La]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01074—Tungsten [W]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01078—Platinum [Pt]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01082—Lead [Pb]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/0132—Binary Alloys
H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 – H01L2924/0715
H01L2924/097—Glass-ceramics, e.g. devitrified glass
H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S428/00—Stock material or miscellaneous articles
Y10S428/922—Static electricity metal bleed-off metallic stock
Y10S428/9265—Special properties
Y10S428/929—Electrical contact feature
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S428/00—Stock material or miscellaneous articles
Y10S428/922—Static electricity metal bleed-off metallic stock
Y10S428/9335—Product by special process
Y10S428/939—Molten or fused coating
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/00—Stock material or miscellaneous articles
Y10T428/12—All metal or with adjacent metals
Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Y10T428/12528—Semiconductor component
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/00—Stock material or miscellaneous articles
Y10T428/12—All metal or with adjacent metals
Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/00—Stock material or miscellaneous articles
Y10T428/12—All metal or with adjacent metals
Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Y10T428/12771—Transition metal-base component
Y10T428/12861—Group VIII or IB metal-base component
Y10T428/12896—Ag-base component
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/00—Stock material or miscellaneous articles
Y10T428/12—All metal or with adjacent metals
Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Y10T428/12771—Transition metal-base component
Y10T428/12861—Group VIII or IB metal-base component
Y10T428/12903—Cu-base component
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/00—Stock material or miscellaneous articles
Y10T428/12—All metal or with adjacent metals
Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Y10T428/12771—Transition metal-base component
Y10T428/12861—Group VIII or IB metal-base component
Y10T428/12903—Cu-base component
Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T428/00—Stock material or miscellaneous articles
Y10T428/12—All metal or with adjacent metals
Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Y10T428/12771—Transition metal-base component
Y10T428/12861—Group VIII or IB metal-base component
Y10T428/12944—Ni-base component
Abstract
1,043,891. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. April 26, 1963 [April 28, 1962], No. 16614/63. Heading H1K. A cup-shaped sealed housing 1 has a pedestal portion on which is mounted a nickel-plated semi-conductor element 7 between silver layers 8 and 8a. The layer 8a may be plated on a connecting member 9 which supports an electrode 11 with a portion 12. Contact pressure on the semi-conductor element is maintained by the action of a saddle spring 23 having a central aperture 24, the edges of which bear against an insulating member 21 which has a cup-shaped portion surrounding the semiconductor assembly and engaging the plate 12. The two outer edges of the spring bear against an electrically insulating bushing formed by a ring 16 bonded to glass bush 15. A projecting edge may be provided on the inside of the housing part 1 to provide a bearing surface for the outer edge of the spring instead of the metal ring 16. This edge may be formed with two recesses so that the spring periphery can pass through the defined space and rotate to lock the spring against axial movement. A band spring or a plurality of springs may be used.
GB16614/63A
1961-08-12
1963-04-26
A semi-conductor device
Expired
GB1043891A
(en)
Applications Claiming Priority (3)
Application Number
Priority Date
Filing Date
Title
DES0075279
1961-08-12
DES0079236
1962-04-28
DES0079235
1962-04-28
Publications (1)
Publication Number
Publication Date
GB1043891A
true
GB1043891A
(en)
1966-09-28
Family
ID=27212735
Family Applications (3)
Application Number
Title
Priority Date
Filing Date
GB31045/61D
Expired
GB969587A
(en)
1961-08-12
1961-08-13
A semi-conductor device
GB16614/63A
Expired
GB1043891A
(en)
1961-08-12
1963-04-26
A semi-conductor device
GB16615/63A
Expired
GB1043892A
(en)
1961-08-12
1963-04-26
A semi-conductor device
Family Applications Before (1)
Application Number
Title
Priority Date
Filing Date
GB31045/61D
Expired
GB969587A
(en)
1961-08-12
1961-08-13
A semi-conductor device
Family Applications After (1)
Application Number
Title
Priority Date
Filing Date
GB16615/63A
Expired
GB1043892A
(en)
1961-08-12
1963-04-26
A semi-conductor device
Country Status (6)
Country
Link
US
(2)
US3221219A
(en)
CH
(3)
CH395348A
(en)
DE
(3)
DE1170558C2
(en)
GB
(3)
GB969587A
(en)
NL
(5)
NL141328B
(en)
SE
(1)
SE327239B
(en)
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Semiconductor device housing with spring contact means and improved thermal characteristics
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Pressure-sensitive semiconductor device comprising three zones of alternating conductivity type and a stamp on one zone
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Encapsulation means for a semiconductor device
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NL
NL291270D
patent/NL291270A/xx
unknown
NL
NL135878D
patent/NL135878C/xx
active
1961
1961-08-12
DE
DE19611170558
patent/DE1170558C2/en
not_active
Expired
1961-08-13
GB
GB31045/61D
patent/GB969587A/en
not_active
Expired
1962
1962-04-28
DE
DE19621439139
patent/DE1439139B2/en
not_active
Withdrawn
1962-04-28
DE
DE19621248813
patent/DE1248813C2/en
not_active
Expired
1962-06-19
CH
CH734762A
patent/CH395348A/en
unknown
1962-08-10
US
US216707A
patent/US3221219A/en
not_active
Expired – Lifetime
1963
1963-02-07
CH
CH153963A
patent/CH430881A/en
unknown
1963-04-08
NL
NL63291270A
patent/NL141328B/en
unknown
1963-04-25
SE
SE04567/63A
patent/SE327239B/xx
unknown
1963-04-26
US
US276061A
patent/US3299328A/en
not_active
Expired – Lifetime
1963-04-26
GB
GB16614/63A
patent/GB1043891A/en
not_active
Expired
1963-04-26
GB
GB16615/63A
patent/GB1043892A/en
not_active
Expired
1963-04-29
CH
CH535363A
patent/CH426016A/en
unknown
Also Published As
Publication number
Publication date
DE1248813B
(en)
1967-08-31
NL135878C
(en)
DE1439139A1
(en)
1968-12-12
NL291270A
(en)
NL141328B
(en)
1974-02-15
CH430881A
(en)
1967-02-28
US3299328A
(en)
1967-01-17
CH395348A
(en)
1965-07-15
DE1248813C2
(en)
1976-01-08
NL280742A
(en)
SE327239B
(en)
1970-08-17
GB969587A
(en)
1964-09-09
US3221219A
(en)
1965-11-30
CH426016A
(en)
1966-12-15
DE1170558C2
(en)
1973-10-18
GB1043892A
(en)
1966-09-28
DE1439139B2
(en)
1972-02-10
NL289148A
(en)
DE1170558B
(en)
1973-10-18
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