GB1067816A – Improvements in or relating to lapping machines
– Google Patents
GB1067816A – Improvements in or relating to lapping machines
– Google Patents
Improvements in or relating to lapping machines
Info
Publication number
GB1067816A
GB1067816A
GB45882/65A
GB4588265A
GB1067816A
GB 1067816 A
GB1067816 A
GB 1067816A
GB 45882/65 A
GB45882/65 A
GB 45882/65A
GB 4588265 A
GB4588265 A
GB 4588265A
GB 1067816 A
GB1067816 A
GB 1067816A
Authority
GB
United Kingdom
Prior art keywords
members
lapping
ring
plate
secured
Prior art date
1964-12-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB45882/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedlap Corp
Original Assignee
Speedlap Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1964-12-09
Filing date
1965-10-29
Publication date
1967-05-03
1965-10-29
Application filed by Speedlap Corp
filed
Critical
Speedlap Corp
1967-05-03
Publication of GB1067816A
publication
Critical
patent/GB1067816A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
230000004048
modification
Effects
0.000
abstract
4
238000012986
modification
Methods
0.000
abstract
4
239000000463
material
Substances
0.000
abstract
2
229910052580
B4C
Inorganic materials
0.000
abstract
1
238000005299
abrasion
Methods
0.000
abstract
1
INAHAJYZKVIDIZ-UHFFFAOYSA-N
boron carbide
Chemical compound
B12B3B4C32B41
INAHAJYZKVIDIZ-UHFFFAOYSA-N
0.000
abstract
1
230000003750
conditioning effect
Effects
0.000
abstract
1
229920006333
epoxy cement
Polymers
0.000
abstract
1
239000000203
mixture
Substances
0.000
abstract
1
239000002245
particle
Substances
0.000
abstract
1
230000000717
retained effect
Effects
0.000
abstract
1
Classifications
B—PERFORMING OPERATIONS; TRANSPORTING
B24—GRINDING; POLISHING
B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
B24B37/00—Lapping machines or devices; Accessories
B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
Abstract
1,067,816. Lapping. SPEEDLAP CORPORATION. Oct. 29, 1965 [Dec. 9, 1964], No.45882/65. Heading B3D. A lapping machine comprises a lapping disc rotatable about a vertical axis, at least one truing and retaining ring member disposed on the lapping disc and arranged to retain workpieces thereon, a plate member disposed within the ring member and arranged to maintain pressure on the workpieces for holding them against the movement of the lapping disc when the machine is in operation and means carried by one of the members engageable with the other of the members for arresting downward movement of the plate member upon completion of a preselected amount of lapping. A lapping disc 14, Fig. 2, comprising segments 15 secured to a wheel 16 is rotated about a vertical axis; a freely flowing mixture of abrasive particles and an oil carrier is fed to the disc through discharge tubes. Workpieces 54 are retained within a lap conditioning ring 42 having in its bottom surface an annular recess in which pad members 52 are secured, e.g. by epoxy cement; the material of the pad members has a greater abrasion resistance than the material of the lapping disc, and is preferably boron carbide. A pressure plate 32 bears on the workpieces; it fits with slight clearance within the ring 42 and is connected to the lower end of the piston rod 28 of a pneumatic jack mounted on the machine frame. The plate 32 has secured thereto three posts 34 carrying adjustable screws 38, downward movement of the plate being arrested when the screws engage the top surface of the ring 42. In a modification, Fig. 4 (not shown), micrometers 60 are used instead of the screws 38. In a modification, Fig. 5 (not shown), an additional post 34
GB45882/65A
1964-12-09
1965-10-29
Improvements in or relating to lapping machines
Expired
GB1067816A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US416989A
US3375614A
(en)
1964-12-09
1964-12-09
Lapping machine truing ring and fixture
Publications (1)
Publication Number
Publication Date
GB1067816A
true
GB1067816A
(en)
1967-05-03
Family
ID=23652145
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB45882/65A
Expired
GB1067816A
(en)
1964-12-09
1965-10-29
Improvements in or relating to lapping machines
Country Status (3)
Country
Link
US
(1)
US3375614A
(en)
CH
(1)
CH443044A
(en)
GB
(1)
GB1067816A
(en)
Families Citing this family (9)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3683562A
(en)
*
1970-09-24
1972-08-15
Spitfire Tool & Machine Co Inc
Means for applying a liquid abrasive over the surface of a rotatable lapping table of a lapping machine
US5695392A
(en)
*
1995-08-09
1997-12-09
Speedfam Corporation
Polishing device with improved handling of fluid polishing media
US6062963A
(en)
*
1997-12-01
2000-05-16
United Microelectronics Corp.
Retainer ring design for polishing head of chemical-mechanical polishing machine
US6241582B1
(en)
1997-09-01
2001-06-05
United Microelectronics Corp.
Chemical mechanical polish machines and fabrication process using the same
US6089961A
(en)
*
1998-12-07
2000-07-18
Speedfam-Ipec Corporation
Wafer polishing carrier and ring extension therefor
CN102744672B
(en)
*
2012-07-04
2014-05-07
昆山市达功电子厂
Crown type magnetic core grinding device
CN104924194B
(en)
*
2015-06-08
2017-03-08
中北大学
A kind of device thinning for crystal chemistry mechanical lapping and its using method
CN107498456A
(en)
*
2017-10-03
2017-12-22
德清晶生光电科技有限公司
Erratic star wheel available for one side polishing
CN112108949B
(en)
*
2020-09-10
2022-05-20
肇庆中彩机电技术研发有限公司
Precision bearing width grinding device and grinding method thereof
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE1110544B
(en)
*
1957-11-29
1961-07-06
Siemens Ag
Single disc lapping machine for semiconductor wafers
US2971298A
(en)
*
1958-10-03
1961-02-14
Ibm
Workholder for a lapping machine
US2983086A
(en)
*
1959-04-30
1961-05-09
Pacific Semiconductors Inc
Flanged lapping jig
US3233370A
(en)
*
1963-07-19
1966-02-08
Falk
Production of parallel lapped surfaces
1964
1964-12-09
US
US416989A
patent/US3375614A/en
not_active
Expired – Lifetime
1965
1965-10-29
GB
GB45882/65A
patent/GB1067816A/en
not_active
Expired
1965-12-07
CH
CH1687465A
patent/CH443044A/en
unknown
Also Published As
Publication number
Publication date
US3375614A
(en)
1968-04-02
CH443044A
(en)
1967-08-31
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