GB1078779A – Semiconductor devices
– Google Patents
GB1078779A – Semiconductor devices
– Google Patents
Semiconductor devices
Info
Publication number
GB1078779A
GB1078779A
GB359066A
GB359066A
GB1078779A
GB 1078779 A
GB1078779 A
GB 1078779A
GB 359066 A
GB359066 A
GB 359066A
GB 359066 A
GB359066 A
GB 359066A
GB 1078779 A
GB1078779 A
GB 1078779A
Authority
GB
United Kingdom
Prior art keywords
plates
silver
hard
carrier plates
pin
Prior art date
1962-05-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB359066A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1962-05-28
Filing date
1966-01-26
Publication date
1967-08-09
1966-01-26
Application filed by Siemens Schuckertwerke AG, Siemens AG
filed
Critical
Siemens Schuckertwerke AG
1967-08-09
Publication of GB1078779A
publication
Critical
patent/GB1078779A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01079—Gold [Au]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/13—Discrete devices, e.g. 3 terminal devices
H01L2924/1301—Thyristor
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/30—Technical effects
H01L2924/35—Mechanical effects
H01L2924/351—Thermal stress
Abstract
1,078,779. Semi-conductor devices. SIEMENS – SCHUCKERTWERKE A.G. Jan. 26, 1966 [Jan. 30, 1965; Dec. 18, 1965], No. 3590/66. Heading H1K. A disc-shaped semi-conductor arrangement is mounted in a housing comprising a tube of insulating material closed by metal end members each of which comprises a thick central portion and a thin peripheral portion of different metals, the coefficient of expansion of the peripheral portion being closer to that of the insulator than is the coefficient of expansion of the central portion. As shown, Fig. 1, a rectifier comprises a silicon disc 2 with alloyed aluminium and antimony-containing gold electrodes at its major faces bonded to molybdenum carrier plates 3, 4, plate 4 having a silver layer 6 or being bonded using a silver foil 6. The carrier plates 3, 4 are contacted by copper plates 12 to which annular peripheral portions 10 of an iron-cobalt-nickel alloy are hard-soldered. The inner faces of plates 12 are lapped and silver foils 5, 7 are inserted between them and the adjacent carrier plates 4, 3 which are centred by pins 13. Alternatively the molybdenum carrier plates may be silver-plated on their outer faces. The edges of the peripheral portions 10 are welded to flange members 9, also of an iron-cobalt-nickel alloy, hard soldered to a ceramic tube 8. An exhaust tube is provided in one portion 10. The housing may be adapted for use with an SCR by hard-soldering a ceramic bushing (17), Fig. 2 (not shown), in one peripheral portion (11), inserting an iron-cobalt-nickel pin (19) through bushing (17), hard-soldering the head of pin (19) to the end of bushing (17), and soft-soldering an insulated conductor 20 to the head of pin (19). The SCR is surrounded by a frame member provided with a spring contact which presses against the gate electrode of the SCR and is connected to the inner end of pin (19) by a silver wire. One or both of the carrier plates may be hardsoldered to plates 12 and the connection to the electrodes of the semi-conductor device may then be by pressure only or by a subsequent soft-soldering process using heat and pressure. A suitable soft solder is 80 : 20 gold-tin alloy and a suitable hard solder is 65 : 27 : 4 : 4 silver-copper-manganese-nickel alloy. The device may be clamped between liquidcooled copper bodies (31), Fig. 3 (not shown), by means of a steel frame (33, 34) and a clamping screw (36) which bears on an insulating disc (37). Rings (38) are provided on bodies (31) to centre the semi-conductor device (30) and a ring (39) is provided on base plate (33) to centre the lower cooling body. The clamping frame is unnecessary if plates (12) are soldered to carrier plates (3, 4).
GB359066A
1962-05-28
1966-01-26
Semiconductor devices
Expired
GB1078779A
(en)
Applications Claiming Priority (3)
Application Number
Priority Date
Filing Date
Title
DES79642A
DE1248814B
(en)
1962-05-28
1962-05-28
Semiconductor component and associated cooling order
DES0095262
1965-01-30
DES0101036
1965-12-18
Publications (1)
Publication Number
Publication Date
GB1078779A
true
GB1078779A
(en)
1967-08-09
Family
ID=52395368
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB359066A
Expired
GB1078779A
(en)
1962-05-28
1966-01-26
Semiconductor devices
Country Status (8)
Country
Link
US
(1)
US3499095A
(en)
BE
(1)
BE675736A
(en)
CH
(1)
CH446534A
(en)
DE
(2)
DE1248814B
(en)
FR
(1)
FR1466106A
(en)
GB
(1)
GB1078779A
(en)
NL
(1)
NL140362B
(en)
SE
(1)
SE345038C
(en)
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3532941A
(en)
*
1967-05-23
1970-10-06
Int Rectifier Corp
Pressure-assembled semiconductor device having a plurality of semiconductor wafers
Families Citing this family (11)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3513361A
(en)
*
1968-05-09
1970-05-19
Westinghouse Electric Corp
Flat package electrical device
US3746947A
(en)
*
1969-03-15
1973-07-17
Mitsubishi Electric Corp
Semiconductor device
JPS5030428B1
(en)
*
1969-03-31
1975-10-01
DE2021158B2
(en)
*
1970-04-30
1972-07-13
Licentia Patent Verwaltungs GmbH, 6000 Frankfurt
SEMI-CONDUCTOR ARRANGEMENT WITH A DISC-SHAPED HOUSING AND A SEMI-CONDUCTOR ELEMENT CLOSED INTO THIS
DE2160001C2
(en)
*
1971-12-03
1974-01-10
Siemens Ag, 1000 Berlin U. 8000 Muenchen
Semiconductor arrangement, in particular thyristor assembly
US3831067A
(en)
*
1972-05-15
1974-08-20
Int Rectifier Corp
Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
US3992717A
(en)
*
1974-06-21
1976-11-16
Westinghouse Electric Corporation
Housing for a compression bonded encapsulation of a semiconductor device
US4008486A
(en)
*
1975-06-02
1977-02-15
International Rectifier Corporation
Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
DE2907780A1
(en)
*
1979-02-28
1980-09-11
Alsthom Atlantique
Support box for cooled power semiconductor – has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts
JPS5678130A
(en)
*
1979-11-30
1981-06-26
Hitachi Ltd
Semiconductor device and its manufacture
DE3143335A1
(en)
*
1981-10-31
1983-05-11
SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg
Semiconductor device
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2066856A
(en)
*
1936-02-28
1937-01-05
Rca Corp
Stem for electron discharge devices
NL288523A
(en)
*
1961-08-04
1900-01-01
GB1001269A
(en)
*
1960-09-30
1900-01-01
NL302170A
(en)
*
1963-06-15
1962
1962-05-28
DE
DES79642A
patent/DE1248814B/en
active
Pending
1965
1965-12-18
DE
DE19651514643
patent/DE1514643A1/en
active
Pending
1966
1966-01-26
GB
GB359066A
patent/GB1078779A/en
not_active
Expired
1966-01-26
NL
NL6600991A
patent/NL140362B/en
unknown
1966-01-26
CH
CH107166A
patent/CH446534A/en
unknown
1966-01-28
FR
FR47654A
patent/FR1466106A/en
not_active
Expired
1966-01-28
BE
BE675736D
patent/BE675736A/xx
unknown
1966-01-28
SE
SE111566A
patent/SE345038C/en
unknown
1968
1968-04-11
US
US72986268
patent/US3499095A/en
not_active
Expired – Lifetime
Cited By (2)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3532941A
(en)
*
1967-05-23
1970-10-06
Int Rectifier Corp
Pressure-assembled semiconductor device having a plurality of semiconductor wafers
US3532942A
(en)
*
1967-05-23
1970-10-06
Int Rectifier Corp
Pressure-assembled semiconductor device housing having three terminals
Also Published As
Publication number
Publication date
DE1514643A1
(en)
1972-01-20
FR1466106A
(en)
1967-01-13
SE345038C
(en)
1974-09-12
DE1514393A1
(en)
1970-09-24
NL140362B
(en)
1973-11-15
US3499095A
(en)
1970-03-03
DE1248814B
(en)
1968-03-14
SE345038B
(en)
1972-05-08
NL6600991A
(en)
1966-08-01
DE1514393B2
(en)
1972-11-09
CH446534A
(en)
1967-11-15
BE675736A
(en)
1966-07-28
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