GB1094960A

GB1094960A – Improvements in or relating to semiconductor devices
– Google Patents

GB1094960A – Improvements in or relating to semiconductor devices
– Google Patents
Improvements in or relating to semiconductor devices

Info

Publication number
GB1094960A

GB1094960A
GB54056/65A
GB5405665A
GB1094960A
GB 1094960 A
GB1094960 A
GB 1094960A
GB 54056/65 A
GB54056/65 A
GB 54056/65A
GB 5405665 A
GB5405665 A
GB 5405665A
GB 1094960 A
GB1094960 A
GB 1094960A
Authority
GB
United Kingdom
Prior art keywords
groove
semi
spring
compression
conductor
Prior art date
1964-12-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
GB54056/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CKD Praha DIZ AS

CKD Praha Oborovy Podnik

Original Assignee
CKD Praha DIZ AS
CKD Praha Oborovy Podnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1964-12-22
Filing date
1965-12-21
Publication date
1967-12-13

1965-12-21
Application filed by CKD Praha DIZ AS, CKD Praha Oborovy Podnik
filed
Critical
CKD Praha DIZ AS

1967-12-13
Publication of GB1094960A
publication
Critical
patent/GB1094960A/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/02—Containers; Seals

H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer

H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 – H01L21/326

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/02—Containers; Seals

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/02—Containers; Seals

H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Abstract

1,094,960. Semi-conductor devices. CKD PRAHA OBOROVY PODNIK. Dec. 21, 1965 [Dec. 22, 1964], No. 54056/65. Heading H1K. The devices described are semi-conductor diodes in which the semi-conductor element is held under spring pressure between electrode plates. In each, the spring is held in compression by a two-part structure bonded to the base 1 of the housing. In the diode of Fig. 2, one of these parts 71 is preformed with a groove 91 in a strengthened rim and is bonded to the base. The semi-conductor element and electrode assembly are placed in position, an insulating washer 5 placed on the upper electrode plate 3 (anode), and the spring washers 6 put on. The second compression part 81 is slipped over the first part and controlled pressure is applied to compress the spring to the desired degree. At this point a tool 107 (Fig. 3, not shown), is used to impress the walls of the second part 81 into the groove 91 on the first part. This maintains the spring pressure in the completed device at the predetermined value since the impressing tool operates at exactly the height of the centre of the symmetrically formed groove 91. A polytetrafluoro-ethylene ring 15 is placed in the groove now formed in the second part and the cover of the container then resistance-welded to the lip 12 on the first compression part 71. The ring 15 acts as a seal to prevent contaminants formed in this process from reaching the semiconductor. The diode of Fig. 1 (not shown), is similar but here the preformed groove is in an annular second compression part (8) fitting within the first part (7) which is fixed to the housing and the walls of which are impressed into the groove to maintain the predetermined spring pressure. It is suggested that, in general, methods other than beading one part into a groove in the other may be used to retain the two parts in their desired relative positions.

GB54056/65A
1964-12-22
1965-12-21
Improvements in or relating to semiconductor devices

Expired

GB1094960A
(en)

Applications Claiming Priority (1)

Application Number
Priority Date
Filing Date
Title

CS726364

1964-12-22

Publications (1)

Publication Number
Publication Date

GB1094960A
true

GB1094960A
(en)

1967-12-13

Family
ID=5421444
Family Applications (1)

Application Number
Title
Priority Date
Filing Date

GB54056/65A
Expired

GB1094960A
(en)

1964-12-22
1965-12-21
Improvements in or relating to semiconductor devices

Country Status (5)

Country
Link

US
(1)

US3435304A
(en)

CH
(1)

CH444316A
(en)

DE
(1)

DE1489791A1
(en)

FR
(1)

FR1461186A
(en)

GB
(1)

GB1094960A
(en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US3581160A
(en)

*

1968-12-23
1971-05-25
Gen Electric
Semiconductor rectifier assembly having high explosion rating

AT317300B
(en)

*

1969-06-12
1974-08-26
Ckd Praha

Holder for semiconductor elements

BE759345A
(en)

*

1969-11-28
1971-05-24
Westinghouse Electric Corp

SEMICONDUCTOR DEVICE SENSITIVE TO ELECTROMAGNETIC RADIATION

US3683492A
(en)

*

1970-02-06
1972-08-15
Westinghouse Electric Corp
Apparatus and process for making a pressure electrical contact assembly for an electrical device

CS216611B1
(en)

*

1980-10-15
1982-11-26
Vladimir Jirutka
Bush of the unilaterally cooled semiconductor component

JPS57196535A
(en)

*

1981-05-28
1982-12-02
Toshiba Corp
Semiconductor device for electric power

JPS6149448U
(en)

*

1984-09-03
1986-04-03

Family Cites Families (6)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

DE1439062A1
(en)

*

1961-01-28
1969-10-23
Siemens Ag

Semiconductor cell with an encapsulated semiconductor arrangement with four layers of alternately opposing conductivity type and method for their production

BE623873A
(en)

*

1961-10-24
1900-01-01

BE624012A
(en)

*

1961-10-27

BE638960A
(en)

*

1962-10-23

US3294895A
(en)

*

1964-07-23
1966-12-27
Westinghouse Electric Corp
Semiconductor device with flexible lead connection

BE672186A
(en)

*

1964-11-12

1965

1965-12-15
DE
DE19651489791
patent/DE1489791A1/en
active
Pending

1965-12-20
US
US515123A
patent/US3435304A/en
not_active
Expired – Lifetime

1965-12-21
GB
GB54056/65A
patent/GB1094960A/en
not_active
Expired

1965-12-21
CH
CH1763465A
patent/CH444316A/en
unknown

1965-12-22
FR
FR43387A
patent/FR1461186A/en
not_active
Expired

Also Published As

Publication number
Publication date

US3435304A
(en)

1969-03-25

DE1489791A1
(en)

1969-06-12

FR1461186A
(en)

1966-12-02

CH444316A
(en)

1967-09-30

Similar Documents

Publication
Publication Date
Title

GB1043891A
(en)

1966-09-28

A semi-conductor device

GB1094960A
(en)

1967-12-13

Improvements in or relating to semiconductor devices

GB1335415A
(en)

1973-10-31

Disc-shaped semiconductor device and method for manufacturing same

GB824255A
(en)

1959-11-25

Improvements in or relating to transistors

SE338370B
(en)

1971-09-06

GB1009926A
(en)

1965-11-17

Sealed semiconductor device

US3396316A
(en)

1968-08-06

Compression bonded semiconductor device with hermetically sealed subassembly

GB1070490A
(en)

1967-06-01

Semiconductor device

GB875823A
(en)

1961-08-23

Improvements in or relating to hermetic seals

GB992472A
(en)

1965-05-19

Semiconductor devices

GB1133358A
(en)

1968-11-13

Pressure contact semi-conductor devices

GB1294623A
(en)

1972-11-01

Improvements in or relating to semiconductor components

GB1177031A
(en)

1970-01-07

Pressure Assembled Semiconductor Device using Massive Flexibly Mounted Terminals

GB1251837A
(en)

1971-11-03

GB1297526A
(en)

1972-11-22

GB1370754A
(en)

1974-10-16

Electrical capacitors

GB928894A
(en)

1963-06-19

Improvements in or relating to methods of manufacturing semi-conductor devices

US3182117A
(en)

1965-05-04

Semiconductor device in coldwelded envelope

GB816639A
(en)

1959-07-15

Method of and means for sealed housing of electrical apparatus

US2900438A
(en)

1959-08-18

Spring loaded terminal seal for sealed refrigeration compressors

GB1157041A
(en)

1969-07-02

Improvements in Semiconductor Device Assemblies

GB831295A
(en)

1960-03-30

Improvements in or relating to semiconductor devices

GB1068199A
(en)

1967-05-10

High voltage semiconductor device

GB910249A
(en)

1962-11-14

Method of manufacturing hermetically sealed exposure devices

GB878590A
(en)

1961-10-04

Diodes

Download PDF in English