GB1113916A – Improvements in or relating to semiconductor devices
– Google Patents
GB1113916A – Improvements in or relating to semiconductor devices
– Google Patents
Improvements in or relating to semiconductor devices
Info
Publication number
GB1113916A
GB1113916A
GB3687966A
GB3687966A
GB1113916A
GB 1113916 A
GB1113916 A
GB 1113916A
GB 3687966 A
GB3687966 A
GB 3687966A
GB 3687966 A
GB3687966 A
GB 3687966A
GB 1113916 A
GB1113916 A
GB 1113916A
Authority
GB
United Kingdom
Prior art keywords
heat sink
conductor
layers
terminal
layer
Prior art date
1966-01-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3687966A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1966-01-05
Filing date
1966-08-17
Publication date
1968-05-15
1966-08-17
Application filed by Dow Corning Corp
filed
Critical
Dow Corning Corp
1968-05-15
Publication of GB1113916A
publication
Critical
patent/GB1113916A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 – H01L21/326
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 – H01L21/326, e.g. sealing of a cap to a base of a container
H01L21/52—Mounting semiconductor bodies in containers
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01014—Silicon [Si]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01015—Phosphorus [P]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01019—Potassium [K]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01029—Copper [Cu]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01074—Tungsten [W]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01082—Lead [Pb]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/12—Passive devices, e.g. 2 terminal devices
H01L2924/1203—Rectifying Diode
H01L2924/12036—PN diode
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/181—Encapsulation
Abstract
1,113,916. Semi-conductor device. DOW CORNING CORPORATION. 17 Aug., 1966 [5 Jan., 1966], No. 36879/66. Heading H1K. A silicon semi-conductor element 17 has layers 19 and 20 of SiC formed on it by thermally decomposing (CH 3 ) 2 SiCl 2 in H 2 at 1100- 1400‹ C. to give a layer 3 Áthick. Layers 21 and 22 of Cu, 1000 A thick are then formed by vacuum deposition. The coated element 17 is then soldered to a heat sink 11 of Cu and a Cu terminal 15. The heat sink is cup-shaped and has a threaded connecting stud (12). The terminal 15 is connected via a braided conductor (16) to a metallic stud (14) and a threaded connector (13). The heat sink may be filled with encapsulating resin (18, Fig. 1, not shown). The layer of silicon carbide is said to aid heat dissipation and prevent stresses due to unequal thermal contraction and expansion.
GB3687966A
1966-01-05
1966-08-17
Improvements in or relating to semiconductor devices
Expired
GB1113916A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US51891366A
1966-01-05
1966-01-05
Publications (1)
Publication Number
Publication Date
GB1113916A
true
GB1113916A
(en)
1968-05-15
Family
ID=24066009
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB3687966A
Expired
GB1113916A
(en)
1966-01-05
1966-08-17
Improvements in or relating to semiconductor devices
Country Status (5)
Country
Link
BE
(1)
BE692174A
(en)
FR
(1)
FR1507486A
(en)
GB
(1)
GB1113916A
(en)
NL
(1)
NL6700110A
(en)
SE
(1)
SE323454B
(en)
1966
1966-08-17
GB
GB3687966A
patent/GB1113916A/en
not_active
Expired
1966-12-23
SE
SE1770666A
patent/SE323454B/xx
unknown
1967
1967-01-04
NL
NL6700110A
patent/NL6700110A/xx
unknown
1967-01-04
FR
FR89981A
patent/FR1507486A/en
not_active
Expired
1967-01-04
BE
BE692174D
patent/BE692174A/xx
unknown
Also Published As
Publication number
Publication date
FR1507486A
(en)
1967-12-29
SE323454B
(en)
1970-05-04
NL6700110A
(en)
1967-07-06
BE692174A
(en)
1967-07-04
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