GB1117535A – Soldering electrical components to substrates
– Google Patents
GB1117535A – Soldering electrical components to substrates
– Google Patents
Soldering electrical components to substrates
Info
Publication number
GB1117535A
GB1117535A
GB3653466A
GB3653466A
GB1117535A
GB 1117535 A
GB1117535 A
GB 1117535A
GB 3653466 A
GB3653466 A
GB 3653466A
GB 3653466 A
GB3653466 A
GB 3653466A
GB 1117535 A
GB1117535 A
GB 1117535A
Authority
GB
United Kingdom
Prior art keywords
tool
substrate
pillar
support
soldering
Prior art date
1966-08-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3653466A
Inventor
Brian Herbert Shaw
Richard Patrick Caine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1966-08-16
Filing date
1966-08-16
Publication date
1968-06-19
1966-08-16
Application filed by Standard Telephone and Cables PLC
filed
Critical
Standard Telephone and Cables PLC
1966-08-16
Priority to GB3653466A
priority
Critical
patent/GB1117535A/en
1968-06-19
Publication of GB1117535A
publication
Critical
patent/GB1117535A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
H01L21/67005—Apparatus not specifically provided for elsewhere
H01L21/67011—Apparatus for manufacture or treatment
H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/75—Apparatus for connecting with bump connectors or layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
H01L2224/759—Means for monitoring the connection process
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H01L2224/818—Bonding techniques
H01L2224/81801—Soldering or alloying
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01005—Boron [B]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01019—Potassium [K]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01074—Tungsten [W]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/014—Solder alloys
Abstract
1,117,535. Soldering. STANDARD TELEPHONES & CABLES Ltd. 16 Aug., 1966, No. 36534/66. Heading B3R. Apparatus for soldering a component having solder coated electrodes to metallized bands on a substrate comprises a support 10 for the substrate, an electrically heatable tool to hold the electrodes in contact with the substrate and to apply heat by conduction to the electrodes to melt the solder thereon, means 25 to apply a force to the tool to urge it into contact with the component, temperature sensing means in thermally conductive contact with the tool and an electrical power supply controlled by the sensing means. A platform 6 supports a holder 2, having a flux bottle 4 and dishes 1 for semiconductors dies having solder coated electrodes, on a pillar 5 and supports arm rests 7, 8 by ball and-socket joints 8. A substrate support 10 consists of two relatively rotatable parts separated by a P.T.F.E. washer and is mounted movably on another pillar and a further pillar 15 on the platform carries a soldering tool assembly 16 and a microscope assembly 17. The tool assembly comprises an arm 20 clamped to the pillar 15 which carries a tool by means of leaf springs 21. The tool comprises large area current supply members bridged by a heating member of small area which is ground flat to contact the back face of the semi-conductor die and to which is bonded a thermocouple to control the current supply. A coil spring 25 operated by a lever 26 urges the tool towards the support 10. In operation with the die to be bonded in position on a substrate the tool is lowered to apply a load to the die and the power supply is energized to pass a heavy current through the heating member. The temperature is maintained by the thermocouple control and then power is cut off and the bond cools. The substrate may be pre-heated by a separate heater in the support 10.
GB3653466A
1966-08-16
1966-08-16
Soldering electrical components to substrates
Expired
GB1117535A
(en)
Priority Applications (1)
Application Number
Priority Date
Filing Date
Title
GB3653466A
GB1117535A
(en)
1966-08-16
1966-08-16
Soldering electrical components to substrates
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB3653466A
GB1117535A
(en)
1966-08-16
1966-08-16
Soldering electrical components to substrates
Publications (1)
Publication Number
Publication Date
GB1117535A
true
GB1117535A
(en)
1968-06-19
Family
ID=10389034
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB3653466A
Expired
GB1117535A
(en)
1966-08-16
1966-08-16
Soldering electrical components to substrates
Country Status (1)
Country
Link
GB
(1)
GB1117535A
(en)
1966
1966-08-16
GB
GB3653466A
patent/GB1117535A/en
not_active
Expired
Similar Documents
Publication
Publication Date
Title
US3617682A
(en)
1971-11-02
Semiconductor chip bonder
US3165818A
(en)
1965-01-19
Method for mounting and bonding semiconductor wafers
US3064341A
(en)
1962-11-20
Semiconductor devices
US3228104A
(en)
1966-01-11
Method of attaching an electric connection to a semiconductor device
IE32179B1
(en)
1973-05-02
Improvements in or relating to methods of bonding workpieces to substrates
GB775366A
(en)
1957-05-22
Semiconductor signal translating devices and methods of making them
US5302801A
(en)
1994-04-12
Laser bonding apparatus
GB970428A
(en)
1964-09-23
Improvements in or relating to methods of manufacturing semi-conductor devices
US3447236A
(en)
1969-06-03
Method of bonding an electrical part to an electrical contact
GB1291983A
(en)
1972-10-04
Method of and apparatus for joining articles
GB1262148A
(en)
1972-02-02
Soldering apparatus
GB1338159A
(en)
1973-11-21
Method and means for forming electrical joints
GB1117535A
(en)
1968-06-19
Soldering electrical components to substrates
US3226804A
(en)
1966-01-04
Method of soldering peltier devices
US3891822A
(en)
1975-06-24
Pulse heated thermocompression bonding apparatus
US4883214A
(en)
1989-11-28
Heated tool with heated support
GB939762A
(en)
1963-10-16
Method and apparatus for assembling a semi-conductor device
ES344740A2
(en)
1968-10-16
Ultrasonic bonding method
US6827253B2
(en)
2004-12-07
Method and means for rapid heat-sink soldering
US2987597A
(en)
1961-06-06
Electrical component assembly
GB1505357A
(en)
1978-03-30
Apparatus for welding elements to a substrate
NL6814014A
(en)
1969-04-08
US2794899A
(en)
1957-06-04
Apparatus for and method of forming p-n junction devices
US3878555A
(en)
1975-04-15
Semiconductor device mounted on an epoxy substrate
US2894112A
(en)
1959-07-07
Apparatus for attaching leads to orystals
None