GB1147645A – Housings for semi-conductor devices
– Google Patents
GB1147645A – Housings for semi-conductor devices
– Google Patents
Housings for semi-conductor devices
Info
Publication number
GB1147645A
GB1147645A
GB27901/65A
GB2790165A
GB1147645A
GB 1147645 A
GB1147645 A
GB 1147645A
GB 27901/65 A
GB27901/65 A
GB 27901/65A
GB 2790165 A
GB2790165 A
GB 2790165A
GB 1147645 A
GB1147645 A
GB 1147645A
Authority
GB
United Kingdom
Prior art keywords
semi
heat sink
screwed
conductor
alumina
Prior art date
1965-07-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB27901/65A
Inventor
John James Lawrence Weaver
Arnaud Michael Eccles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
English Electric Co Ltd
Original Assignee
English Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1965-07-01
Filing date
1965-07-01
Publication date
1969-04-02
1965-07-01
Application filed by English Electric Co Ltd
filed
Critical
English Electric Co Ltd
1965-07-01
Priority to GB27901/65A
priority
Critical
patent/GB1147645A/en
1966-06-24
Priority to FR66853A
priority
patent/FR1484506A/en
1966-06-29
Priority to DE19661539912
priority
patent/DE1539912A1/en
1966-07-01
Priority to CH956366A
priority
patent/CH462959A/en
1969-04-02
Publication of GB1147645A
publication
Critical
patent/GB1147645A/en
1969-04-21
Priority to US817724A
priority
patent/US3491271A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
1,147,645. Semi-conductor devices. ENGLISH ELECTRIC CO. Ltd. 29 June, 1966 [1 July, 1965], No. 27901/65. Heading H1K. A member 4, e.g. a beryllia pad, having a high thermal conductivity and a high resistivity, is resiliently clamped between a semi-conductor device, such as a diode 5, and a copper heat sink 1, a common envelope 16 being secured to the heat sink for hermetically sealing both the device and the member. The diode is surrounded by an alumina plug 8 and an alumina ring 9 having apertures for the silvered copper contacts 6, 7 and clamping pressure is exerted by a nut 14 screwed into the top of a steel bridge 10 (Fig. lb, not shown) the feet (11) of which are secured to a steel ring 3 brazed to the heat sink 1. In a modification (Fig. 2, not shown) the bridge 10 is replaced by a first stepped steel cylinder (28) into which the clamping nut (29) is screwed and a second stepped steel cylinder (33) which is screwed to the heat sink and is separated from the first cylinder (28) by an alumina ring (32). The invention may be employed for mounting other semi-conductor elements such as thyristors. The beryllia pad may be metallized on one or both sides and soldered to the adjacent surfaces to improve thermal contact.
GB27901/65A
1965-07-01
1965-07-01
Housings for semi-conductor devices
Expired
GB1147645A
(en)
Priority Applications (5)
Application Number
Priority Date
Filing Date
Title
GB27901/65A
GB1147645A
(en)
1965-07-01
1965-07-01
Housings for semi-conductor devices
FR66853A
FR1484506A
(en)
1965-07-01
1966-06-24
Housing for electrically conductive heat-emitting devices
DE19661539912
DE1539912A1
(en)
1965-07-01
1966-06-29
Housing for electrically conductive heat dissipation devices
CH956366A
CH462959A
(en)
1965-07-01
1966-07-01
Semiconductor device package, especially a diode or thyristor
US817724A
US3491271A
(en)
1965-07-01
1969-04-21
Housing for electrically conductive heat-dissipating devices
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB27901/65A
GB1147645A
(en)
1965-07-01
1965-07-01
Housings for semi-conductor devices
Publications (1)
Publication Number
Publication Date
GB1147645A
true
GB1147645A
(en)
1969-04-02
Family
ID=10267110
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB27901/65A
Expired
GB1147645A
(en)
1965-07-01
1965-07-01
Housings for semi-conductor devices
Country Status (4)
Country
Link
US
(1)
US3491271A
(en)
CH
(1)
CH462959A
(en)
DE
(1)
DE1539912A1
(en)
GB
(1)
GB1147645A
(en)
Families Citing this family (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3753190A
(en)
*
1969-06-10
1973-08-14
Mitsubishi Electric Corp
Current limiting device
US4396935A
(en)
*
1980-10-06
1983-08-02
Ncr Corporation
VLSI Packaging system
US4749821A
(en)
*
1986-07-10
1988-06-07
Fic Corporation
EMI/RFI shield cap assembly
US11776874B2
(en)
*
2020-03-24
2023-10-03
Solaredge Technologies Ltd.
Apparatus and method for holding a heat generating device
Family Cites Families (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2862159A
(en)
*
1954-10-29
1958-11-25
Raytheon Mfg Co
Conduction cooled rectifiers
DE1042762B
(en)
*
1955-02-26
1958-11-06
Siemens Ag
Surface rectifier or transistor, which has at least one of its electrodes in surface contact with a body which dissipates the heat loss
NL217849A
(en)
*
1956-06-12
BE638960A
(en)
*
1962-10-23
GB1000023A
(en)
*
1963-02-06
1965-08-04
Westinghouse Brake & Signal
Semi-conductor devices
FR1381184A
(en)
*
1963-02-06
1964-12-04
Westinghouse Brake & Signal
Asymmetric conductivity device
1965
1965-07-01
GB
GB27901/65A
patent/GB1147645A/en
not_active
Expired
1966
1966-06-29
DE
DE19661539912
patent/DE1539912A1/en
active
Pending
1966-07-01
CH
CH956366A
patent/CH462959A/en
unknown
1969
1969-04-21
US
US817724A
patent/US3491271A/en
not_active
Expired – Lifetime
Also Published As
Publication number
Publication date
US3491271A
(en)
1970-01-20
DE1539912A1
(en)
1969-06-12
CH462959A
(en)
1968-09-30
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