GB1153002A – Vibratory Bonding methods and apparatus
– Google Patents
GB1153002A – Vibratory Bonding methods and apparatus
– Google Patents
Vibratory Bonding methods and apparatus
Info
Publication number
GB1153002A
GB1153002A
GB2695166A
GB2695166A
GB1153002A
GB 1153002 A
GB1153002 A
GB 1153002A
GB 2695166 A
GB2695166 A
GB 2695166A
GB 2695166 A
GB2695166 A
GB 2695166A
GB 1153002 A
GB1153002 A
GB 1153002A
Authority
GB
United Kingdom
Prior art keywords
bonding
pulse
signal
microseconds
gold
Prior art date
1965-07-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2695166A
Inventor
Frank Wamboldt Christensen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1965-07-19
Filing date
1966-06-16
Publication date
1969-05-21
1966-06-16
Application filed by Western Electric Co Inc
filed
Critical
Western Electric Co Inc
1969-05-21
Publication of GB1153002A
publication
Critical
patent/GB1153002A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
H01L21/67005—Apparatus not specifically provided for elsewhere
H01L21/67011—Apparatus for manufacture or treatment
H01L21/67138—Apparatus for wiring semiconductor or solid state device
B—PERFORMING OPERATIONS; TRANSPORTING
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/78—Apparatus for connecting with wire connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
H01L2224/45001—Core members of the connector
H01L2224/4501—Shape
H01L2224/45012—Cross-sectional shape
H01L2224/45015—Cross-sectional shape being circular
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
H01L2224/45001—Core members of the connector
H01L2224/45099—Material
H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
H01L2224/45124—Aluminium (Al) as principal constituent
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
H01L2224/45001—Core members of the connector
H01L2224/45099—Material
H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
H01L2224/45144—Gold (Au) as principal constituent
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/484—Connecting portions
H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/78—Apparatus for connecting with wire connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/102—Material of the semiconductor or solid state bodies
H01L2924/1025—Semiconducting materials
H01L2924/10251—Elemental semiconductors, i.e. Group IV
H01L2924/10253—Silicon [Si]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/30—Technical effects
H01L2924/301—Electrical effects
H01L2924/3011—Impedance
Abstract
1,153,002. Welding by pressure. WESTERN ELECTRIC CO. Inc. 16 June, 1966 [19 July, 1965], No. 26951/66. Heading B3R. [Also in Division H4] In joining two members by applying a pulse of vibratory energy to the members by a bonding head energized by an energy pulse of predetermined duration, the members are held in contact and the vibrations of the bonding head are damped after cessation of the energy pulse. An apparatus for bonding a fine wire e.g. of silicon-aluminium to a transistor stripe e.g. of gold with an optimum bond i.e. where the peel strength at least equals the tensile strength, comprises a sonotrode including a velocity transformer 21, Fig. 5, a tapered portion 22 carrying at one end a bonding tip 25 and a magnetostrictive transducer 23. A stub shaft 27 extending from the transformer 21 into a slot 29 in the portion 22 carries a disc shaped resonant damper 31 of lead, brass, plastic &c., which vibrates in dissonance with the sonotrode. The damper is positioned on an antinodal plane to absorb maximum energy and its edge is one quarter of a cycle out of phase with the rest of the apparatus. The bonding tip comprises a pair of parallel cylindrical members 36 forming a groove 38 to receive the wire. The magnetostrictive transducer may be replaced by piezo-electric, e.g. quartz crystals, or electrostrictive e.g. barium titanate transducers. In one modification, a pair of spaced dampers are mounted on the stub shaft and in another a large damper disc 62, Fig. 14, is mounted at the end of the velocity transformer 63 to form a step, the transformer is provided with circular grooves 68 which form a damper 69 between them and a narrow horn 66 carrying the bonding tip 67 has circular grooves 71 which form dampers 72 therebetween. A power supply to provide bonding pulses as short as 10 microseconds comprises a supply connected to an oscillator and electronic switch, an amplitude control and a power amplifier. The oscillator generates an oscillatory input signal having a frequency compatible with the resonant characteristics of the bonding apparatus and a portion of the signal is selected by the electronic switch to provide a short pulse oscillatory input signal which is stabilized by the amplitude control to provide a signal which is amplified to provide a short pulse bonding signal. Instead of the disc dampers described an eddy current brake in the form of a ferromagnetic member mounted on the bonding apparatus for movement perpendicular to the lines of flux of a magnet or an electrical circuit wherein a negative feedback loop is provided for feeding the signal generated by the vibrations of the transducer, which continue after the cessation of the short pulse signal, to the amplifier where they are fed back to the transducer out of phase may be used. It is stated that below a certain minimum pulse time and above a certain maximum pulse time optimum bonding is not obtained even though clamping pressure and applied power are increased. In examples where the minimum time is 450 microseconds a gold wire 291, Fig. 21, of a transistor is bonded to the gold plated iron-nickel-cobalt alloy header 294 with a clamping force of 18-24 grams and a pulse time of 650 microseconds at 60 KC per see., the gold wire 291 is bonded to a gold plated iron-nickel-cobalt post 296 with a clamping force of 21-34 grams and a pulse time of 650 microseconds at 60 KC per sec., and a gold wire 299 is bonded to a vapour plated aluminium stripe 297 on a silicon wafer 293 with a clamping force of 30-39 grams.
GB2695166A
1965-07-19
1966-06-16
Vibratory Bonding methods and apparatus
Expired
GB1153002A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US47299965
US3458921A
(en)
1965-07-19
1965-07-19
Short pulse vibratory bonding
Publications (1)
Publication Number
Publication Date
GB1153002A
true
GB1153002A
(en)
1969-05-21
Family
ID=23877760
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB2695166A
Expired
GB1153002A
(en)
1965-07-19
1966-06-16
Vibratory Bonding methods and apparatus
Country Status (7)
Country
Link
US
(1)
US3458921A
(en)
BE
(1)
BE684350A
(en)
DE
(1)
DE1577011A1
(en)
FR
(1)
FR1487050A
(en)
GB
(1)
GB1153002A
(en)
NL
(1)
NL6610145A
(en)
SE
(1)
SE333413B
(en)
Families Citing this family (12)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
NL162580B
(en)
*
1970-12-17
1980-01-15
Philips Nv
METHOD FOR ULTRASONIC WELDING OF WIRES ON THE METAL SURFACE OF A CARRIER.
US3791028A
(en)
*
1971-09-17
1974-02-12
Ibm
Ultrasonic bonding of cubic crystal-structure metals
US4047657A
(en)
*
1976-11-01
1977-09-13
Branson Ultrasonics Corporation
Method and apparatus for joining metal workpieces using high frequency vibratory energy
US4373653A
(en)
*
1981-09-10
1983-02-15
Raytheon Company
Method and apparatus for ultrasonic bonding
KR20030066344A
(en)
*
2002-02-01
2003-08-09
에섹 트레이딩 에스에이
Method for determining optimum bond parameters when bonding with a wire bonder
EP1332826A1
(en)
*
2002-02-01
2003-08-06
Esec Trading S.A.
Method for optimizing operating parameters of wire bonders
TWI229397B
(en)
*
2002-10-16
2005-03-11
Esec Trading Sa
Method for determining optimum bond parameters when bonding with a wire bonder
DE10347984A1
(en)
*
2003-10-15
2005-05-19
Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co
Vibration welding method with shortened settling time
US7044356B2
(en)
*
2003-12-11
2006-05-16
Texas Instruments Incorporated
Roller wire brake for wire bonding machine
DE102007054626A1
(en)
*
2007-11-12
2009-05-14
Hesse & Knipps Gmbh
Method and apparatus for ultrasonic bonding
DE102009059307A1
(en)
*
2009-12-23
2011-06-30
Schunk Sonosystems GmbH, 35435
Method for the electrically conductive connection of wires
US20120074206A1
(en)
*
2010-09-27
2012-03-29
Kulicke And Soffa Industries, Inc.
Methods of forming wire bonds for wire loops and conductive bumps
Family Cites Families (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3056192A
(en)
*
1957-12-30
1962-10-02
Sonobond Corp
Vibratory welding process and apparatus
US3017792A
(en)
*
1958-07-08
1962-01-23
Aeroprojects Inc
Vibratory device
BE621898A
(en)
*
1961-08-30
1900-01-01
US3158928A
(en)
*
1962-03-30
1964-12-01
Aeroprojects Inc
Method and means for operating a generating means coupled through a transducer to a vibratory energy work performing device
US3153850A
(en)
*
1962-07-18
1964-10-27
Daniel C Worlton
Method and device for controlling ultrasonic welding apparatus
US3341935A
(en)
*
1964-04-23
1967-09-19
Cavitron Ultrasonics Inc
Energy storage in high frequency vibratory devices
1965
1965-07-19
US
US47299965
patent/US3458921A/en
not_active
Expired – Lifetime
1966
1966-06-16
GB
GB2695166A
patent/GB1153002A/en
not_active
Expired
1966-07-18
SE
SE981666A
patent/SE333413B/xx
unknown
1966-07-18
DE
DE19661577011
patent/DE1577011A1/en
active
Pending
1966-07-19
NL
NL6610145A
patent/NL6610145A/xx
unknown
1966-07-19
BE
BE684350D
patent/BE684350A/xx
unknown
1966-07-19
FR
FR69985A
patent/FR1487050A/en
not_active
Expired
Also Published As
Publication number
Publication date
SE333413B
(en)
1971-03-15
BE684350A
(en)
1967-01-03
DE1577011A1
(en)
1969-07-10
NL6610145A
(en)
1967-01-20
US3458921A
(en)
1969-08-05
FR1487050A
(en)
1967-06-30
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Legal Events
Date
Code
Title
Description
1969-10-01
PS
Patent sealed [section 19, patents act 1949]
1975-01-08
PLNP
Patent lapsed through nonpayment of renewal fees
