GB1155407A – Improvements in or relating to Electrical Components
– Google Patents
GB1155407A – Improvements in or relating to Electrical Components
– Google Patents
Improvements in or relating to Electrical Components
Info
Publication number
GB1155407A
GB1155407A
GB34297/66A
GB3429766A
GB1155407A
GB 1155407 A
GB1155407 A
GB 1155407A
GB 34297/66 A
GB34297/66 A
GB 34297/66A
GB 3429766 A
GB3429766 A
GB 3429766A
GB 1155407 A
GB1155407 A
GB 1155407A
Authority
GB
United Kingdom
Prior art keywords
components
substrate
july
holes
metal
Prior art date
1965-07-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB34297/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS Corp
Original Assignee
CTS Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1965-07-30
Filing date
1966-07-29
Publication date
1969-06-18
1966-07-29
Application filed by CTS Corp
filed
Critical
CTS Corp
1969-06-18
Publication of GB1155407A
publication
Critical
patent/GB1155407A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
H01G4/00—Fixed capacitors; Processes of their manufacture
H01G4/002—Details
H01G4/228—Terminals
H01G4/242—Terminals the capacitive element surrounding the terminal
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
H01G4/00—Fixed capacitors; Processes of their manufacture
H01G4/002—Details
H01G4/228—Terminals
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/3405—Edge mounted components, e.g. terminals
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/03—Use of materials for the substrate
H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09145—Edge details
H05K2201/09163—Slotted edge
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09145—Edge details
H05K2201/09181—Notches in edge pads
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
H05K2201/10227—Other objects, e.g. metallic pieces
H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Abstract
1,155,407. Two-part couplings. CTS CORP. 29 July, 1966 [30 July, 1965], No. 34297/66. Addition to 1,117,621. Heading H2E. [Also in Division H1] In a circuit module of the kind disclosed in the parent Specification, in which electrical components are formed on a major surface of a ceramic substrate and terminal pins disposed in holes in an edge surface of the substrate are connected to the components by metallized pads around the holes and a further metallic deposit, e.g. solder, means are provided for spacing the metal of the pads and deposit from an adjacent module. As shown, Fig. 13, notches 133 are formed in the common edge of surfaces 132, 134 of a module substrate (the components being disposed on the surface opposite surface 134) so that metal 131 deposited around terminal pins on surface 132 is prevented from extending to surface 134. Alternatively the said common edge may be bevelled, or given a projecting shoulder; or surfaces 132, 134 may be displaced from the mutually orthogonal, i.e. to form a slightly acute angle.
GB34297/66A
1965-07-30
1966-07-29
Improvements in or relating to Electrical Components
Expired
GB1155407A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US475997A
US3346774A
(en)
1965-07-30
1965-07-30
Electrical component substrate with cavities for anchoring lead wires therein
Publications (1)
Publication Number
Publication Date
GB1155407A
true
GB1155407A
(en)
1969-06-18
Family
ID=23890064
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB34297/66A
Expired
GB1155407A
(en)
1965-07-30
1966-07-29
Improvements in or relating to Electrical Components
Country Status (2)
Country
Link
US
(1)
US3346774A
(en)
GB
(1)
GB1155407A
(en)
Families Citing this family (12)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3873890A
(en)
*
1973-08-20
1975-03-25
Allen Bradley Co
Terminal construction for electrical circuit device
EP0041949B1
(en)
*
1979-12-18
1987-06-10
CTS Corporation
Recessed circuit module and method of making
US4345300A
(en)
*
1980-04-07
1982-08-17
Cts Corporation
Recessed circuit module
US4400762A
(en)
*
1980-08-25
1983-08-23
Allen-Bradley Company
Edge termination for an electrical circuit device
US4543714A
(en)
*
1982-09-21
1985-10-01
Cts Corporation
Machine insertion of circuit module terminals
DE4135007C2
(en)
*
1990-10-25
1994-12-22
Cts Corp
SMD components with measures against solder bridge formation and thermal cycling
DE19809138A1
(en)
*
1998-03-04
1999-09-30
Philips Patentverwaltung
Printed circuit board with SMD components
US6194979B1
(en)
1999-03-18
2001-02-27
Cts Corporation
Ball grid array R-C network with high density
US7180186B2
(en)
*
2003-07-31
2007-02-20
Cts Corporation
Ball grid array package
US6946733B2
(en)
*
2003-08-13
2005-09-20
Cts Corporation
Ball grid array package having testing capability after mounting
JP4378387B2
(en)
*
2007-02-27
2009-12-02
Ｏｋｉセミコンダクタ株式会社
Semiconductor package and manufacturing method thereof
US20100294546A1
(en)
*
2009-05-22
2010-11-25
Sean Nickel
Circuit board and method for a low profile wire connection
Family Cites Families (12)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2663830A
(en)
*
1952-10-22
1953-12-22
Bell Telephone Labor Inc
Semiconductor signal translating device
US3002481A
(en)
*
1955-05-31
1961-10-03
Hughes Aircraft Co
Electrical component mounting device
BE549349A
(en)
*
1955-07-07
US3134049A
(en)
*
1958-05-13
1964-05-19
Globe Union Inc
Modular electrical units and assemblies thereof
US3052822A
(en)
*
1958-05-28
1962-09-04
Globe Union Inc
Modular electrical unit
US2989665A
(en)
*
1958-08-25
1961-06-20
Globe Union Inc
Electronic circuits
US3029495A
(en)
*
1959-04-06
1962-04-17
Norman J Doctor
Electrical interconnection of miniaturized modules
US3122679A
(en)
*
1959-10-05
1964-02-25
Hubert H Hoeltje Jr
Transistor mounting pad
US3105868A
(en)
*
1960-12-29
1963-10-01
Sylvania Electric Prod
Circuit packaging module
US3142000A
(en)
*
1961-02-15
1964-07-21
Radio Receptor Company Inc
Matrix for holding and making electrical connection with a plurality of electrical units
US3179854A
(en)
*
1961-04-24
1965-04-20
Rca Corp
Modular structures and methods of making them
US3177406A
(en)
*
1962-06-18
1965-04-06
Gen Instrument Corp
Multiple rectifier stack assembly
1965
1965-07-30
US
US475997A
patent/US3346774A/en
not_active
Expired – Lifetime
1966
1966-07-29
GB
GB34297/66A
patent/GB1155407A/en
not_active
Expired
Also Published As
Publication number
Publication date
US3346774A
(en)
1967-10-10
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