GB1221914A – Manufacture of integrated circuits
– Google Patents
GB1221914A – Manufacture of integrated circuits
– Google Patents
Manufacture of integrated circuits
Info
Publication number
GB1221914A
GB1221914A
GB3006569A
GB3006569A
GB1221914A
GB 1221914 A
GB1221914 A
GB 1221914A
GB 3006569 A
GB3006569 A
GB 3006569A
GB 3006569 A
GB3006569 A
GB 3006569A
GB 1221914 A
GB1221914 A
GB 1221914A
Authority
GB
United Kingdom
Prior art keywords
chips
circuit
deposited
pattern
conductor pattern
Prior art date
1969-06-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3006569A
Inventor
Thomas Meirion Jackson
Alan Douglas Brisbane
Victor George Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1969-06-13
Filing date
1969-06-13
Publication date
1971-02-10
1969-06-13
Application filed by Standard Telephone and Cables PLC
filed
Critical
Standard Telephone and Cables PLC
1969-06-13
Priority to GB3006569A
priority
Critical
patent/GB1221914A/en
1971-02-10
Publication of GB1221914A
publication
Critical
patent/GB1221914A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01013—Aluminum [Al]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01014—Silicon [Si]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01033—Arsenic [As]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01042—Molybdenum [Mo]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01074—Tungsten [W]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 – H01L2924/0715
H01L2924/097—Glass-ceramics, e.g. devitrified glass
H01L2924/09701—Low temperature co-fired ceramic [LTCC]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/14—Integrated circuits
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
H01L2924/1901—Structure
H01L2924/1904—Component type
H01L2924/19041—Component type being a capacitor
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
H01L2924/1901—Structure
H01L2924/1904—Component type
H01L2924/19043—Component type being a resistor
Abstract
1,221,914. Circuit assemblies. STANDARD TELEPHONES & CABLES Ltd. 13 June, 1969, No. 30065/69. Heading HlR. In the manufacture of a hybrid circuit module, monolithic integrated circuit chips 11 are bonded in holes in a substrate, which may or may not be provided with the conductor pattern of the circuit, and a conducting pattern is deposited between terminals 14 on each of the chips and the substrate. In one method, the substrate, e.g. of glass or ceramic, is first provided with a first pattern of conductors, e.g. by evaporation, a dielectric layer 6 is then applied with appropriately spaced windows, a second pattern of conductors 10 is deposited so as to complete the conductor pattern of the circuit, the chips are bonded in the holes, and finally a conductor pattern 13 interconnecting terminals 14 on the chips to terminals 5 on the substrate is deposited, e.g. by evaporation and photographic techniques. Alternatively, the chips are first bonded in the holes and the conductor pattern is then deposited as above with the interconnection pattern 13 deposited simultaneously with the second conductor pattern. A dielectric layer (15), Fig. 8 (not shown), having windows for the chip terminals, may be deposited over the chips before the conductor pattern of the circuit is formed in the latter method. The completed circuit may then be encapsulated.
GB3006569A
1969-06-13
1969-06-13
Manufacture of integrated circuits
Expired
GB1221914A
(en)
Priority Applications (1)
Application Number
Priority Date
Filing Date
Title
GB3006569A
GB1221914A
(en)
1969-06-13
1969-06-13
Manufacture of integrated circuits
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB3006569A
GB1221914A
(en)
1969-06-13
1969-06-13
Manufacture of integrated circuits
Publications (1)
Publication Number
Publication Date
GB1221914A
true
GB1221914A
(en)
1971-02-10
Family
ID=10301695
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB3006569A
Expired
GB1221914A
(en)
1969-06-13
1969-06-13
Manufacture of integrated circuits
Country Status (1)
Country
Link
GB
(1)
GB1221914A
(en)
Cited By (9)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2117570A
(en)
*
1982-04-01
1983-10-12
Standard Telephones Cables Ltd
Circuit boards
GB2130794A
(en)
*
1982-11-27
1984-06-06
Prutec Ltd
Electrical circuit assembly
GB2147148A
(en)
*
1983-09-27
1985-05-01
John Patrick Burke
Electronic circuit assembly
GB2153144A
(en)
*
1984-01-13
1985-08-14
Standard Telephones Cables Ltd
Circuit packaging
GB2183546A
(en)
*
1985-11-29
1987-06-10
Pitney Bowes Plc
Electronic postage meter
GB2199182A
(en)
*
1986-12-18
1988-06-29
Marconi Electronic Devices
Multilayer circuit arrangement
GB2204184A
(en)
*
1987-04-29
1988-11-02
Stanley Bracey
Mounting electronic components on substrates
GB2212669A
(en)
*
1987-11-20
1989-07-26
Junkosha Co Ltd
A printed circuit substrate
US4904887A
(en)
*
1982-06-30
1990-02-27
Fujitsu Limited
Semiconductor integrated circuit apparatus
1969
1969-06-13
GB
GB3006569A
patent/GB1221914A/en
not_active
Expired
Cited By (9)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2117570A
(en)
*
1982-04-01
1983-10-12
Standard Telephones Cables Ltd
Circuit boards
US4904887A
(en)
*
1982-06-30
1990-02-27
Fujitsu Limited
Semiconductor integrated circuit apparatus
GB2130794A
(en)
*
1982-11-27
1984-06-06
Prutec Ltd
Electrical circuit assembly
GB2147148A
(en)
*
1983-09-27
1985-05-01
John Patrick Burke
Electronic circuit assembly
GB2153144A
(en)
*
1984-01-13
1985-08-14
Standard Telephones Cables Ltd
Circuit packaging
GB2183546A
(en)
*
1985-11-29
1987-06-10
Pitney Bowes Plc
Electronic postage meter
GB2199182A
(en)
*
1986-12-18
1988-06-29
Marconi Electronic Devices
Multilayer circuit arrangement
GB2204184A
(en)
*
1987-04-29
1988-11-02
Stanley Bracey
Mounting electronic components on substrates
GB2212669A
(en)
*
1987-11-20
1989-07-26
Junkosha Co Ltd
A printed circuit substrate
Similar Documents
Publication
Publication Date
Title
GB1254795A
(en)
1971-11-24
Electrical connector assembly
GB1276095A
(en)
1972-06-01
Microcircuits and processes for their manufacture
JPH0220848Y2
(en)
1990-06-06
ES392704A1
(en)
1973-08-01
Method of manufacturing thick-film hybrid integrated circuits
GB1336938A
(en)
1973-11-14
Electrical fuse link
GB1373008A
(en)
1974-11-06
Electronic components
GB1362136A
(en)
1974-07-30
Transistor package
ATE51109T1
(en)
1990-03-15
ELECTRICAL THIN FILM CONNECTIONS FOR INTEGRATED CIRCUITS.
GB1221914A
(en)
1971-02-10
Manufacture of integrated circuits
JPS60161641A
(en)
1985-08-23
Circuit package and method of producing same
GB1451156A
(en)
1976-09-29
Packaging for integrated circuits
FR2011063A1
(en)
1970-02-27
JPS6427235A
(en)
1989-01-30
Device for interconnection of multiplex integrated circuits
GB1519653A
(en)
1978-08-02
Latching circuits
GB973417A
(en)
1964-10-28
Improvements in or relating to method of manufacturing printed circuits
GB2083285A
(en)
1982-03-17
Over/under dual in-line chip package
GB1445591A
(en)
1976-08-11
Mounting integrated circuit elements
GB1152809A
(en)
1969-05-21
Electric Circuit Assembly
GB1147469A
(en)
1969-04-02
Semiconductor devices, integrated circuits and methods for making same
GB1209901A
(en)
1970-10-21
Improvements relating to the mounting of integrated circuit assemblies
GB1223704A
(en)
1971-03-03
Semiconductor device
ES383504A1
(en)
1972-12-16
A high frequency integrated circuit having circuit elements in separate and mutually spaced isolation regions
US3533160A
(en)
1970-10-13
Air-isolated integrated circuits
GB1143531A
(en)
GB1146603A
(en)
1969-03-26
Method of producing a solid-state circuit
None