GB1243097A – Improvements in or relating to methods of producing patterns of electrical connectors
– Google Patents
GB1243097A – Improvements in or relating to methods of producing patterns of electrical connectors
– Google Patents
Improvements in or relating to methods of producing patterns of electrical connectors
Info
Publication number
GB1243097A
GB1243097A
GB02927/69A
GB1292769A
GB1243097A
GB 1243097 A
GB1243097 A
GB 1243097A
GB 02927/69 A
GB02927/69 A
GB 02927/69A
GB 1292769 A
GB1292769 A
GB 1292769A
GB 1243097 A
GB1243097 A
GB 1243097A
Authority
GB
United Kingdom
Prior art keywords
pillars
substrate
areas
electrical connectors
pattern
Prior art date
1969-03-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB02927/69A
Inventor
Yener Gurler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1969-03-12
Filing date
1969-03-12
Publication date
1971-08-18
1969-03-12
Application filed by Fujitsu Services Ltd
filed
Critical
Fujitsu Services Ltd
1969-03-12
Priority to GB02927/69A
priority
Critical
patent/GB1243097A/en
1971-08-18
Publication of GB1243097A
publication
Critical
patent/GB1243097A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/3457—Solder materials or compositions; Methods of application thereof
H05K3/3473—Plating of solder
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H—ELECTRICITY
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
H01L2224/13001—Core members of the bump connector
H01L2224/13099—Material
H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
H01L2224/13111—Tin [Sn] as principal constituent
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
H01L2224/818—Bonding techniques
H01L2224/81801—Soldering or alloying
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/0105—Tin [Sn]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01074—Tungsten [W]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01079—Gold [Au]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01082—Lead [Pb]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/14—Integrated circuits
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/03—Metal processing
H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0703—Plating
H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
Abstract
1,243,097. Semi-conductor devices. INTERNATIONAL COMPUTERS Ltd. 23 Feb., 1970 [12 March, 1969], No. 12927/69. Heading H1K. A method of producing a pattern of electrical connectors on an integrated circuit 1 comprises forming a pattern of conductive areas 2 on one surface of the circuit 1 and also forming a corresponding pattern of pillars 3 of conductive material on a temporary substrate 4, aligning the circuit 1 and substrate 4 so that the pillars contact the areas 2, and conductively bonding the pillars to the areas 2 subsequently removing the substrate 4. The pillars 3 may be of tin/lead alloy, and capped with gold on one or both ends. They may be formed by deposition of material through an apertured mask. The substrate 4 may be of oxidized stainless steel. Ultrasonic bonding may be used to bond areas 2 to pillars 3.
GB02927/69A
1969-03-12
1969-03-12
Improvements in or relating to methods of producing patterns of electrical connectors
Expired
GB1243097A
(en)
Priority Applications (1)
Application Number
Priority Date
Filing Date
Title
GB02927/69A
GB1243097A
(en)
1969-03-12
1969-03-12
Improvements in or relating to methods of producing patterns of electrical connectors
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB02927/69A
GB1243097A
(en)
1969-03-12
1969-03-12
Improvements in or relating to methods of producing patterns of electrical connectors
Publications (1)
Publication Number
Publication Date
GB1243097A
true
GB1243097A
(en)
1971-08-18
Family
ID=10013693
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB02927/69A
Expired
GB1243097A
(en)
1969-03-12
1969-03-12
Improvements in or relating to methods of producing patterns of electrical connectors
Country Status (1)
Country
Link
GB
(1)
GB1243097A
(en)
Cited By (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0018557A1
(en)
*
1979-05-07
1980-11-12
International Business Machines Corporation
Apparatus and method for dressing a chip site on a substrate
EP0039160A2
(en)
*
1980-04-29
1981-11-04
Minnesota Mining And Manufacturing Company
Methods for bonding conductive bumps to electronic circuitry
EP0048829A2
(en)
*
1980-09-26
1982-04-07
Licentia Patent-Verwaltungs-GmbH
Method of making electrical contacts on a silicon solar cell
1969
1969-03-12
GB
GB02927/69A
patent/GB1243097A/en
not_active
Expired
Cited By (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0018557A1
(en)
*
1979-05-07
1980-11-12
International Business Machines Corporation
Apparatus and method for dressing a chip site on a substrate
EP0039160A2
(en)
*
1980-04-29
1981-11-04
Minnesota Mining And Manufacturing Company
Methods for bonding conductive bumps to electronic circuitry
EP0039160A3
(en)
*
1980-04-29
1982-08-25
Minnesota Mining And Manufacturing Company
Methods for bonding conductive bumps to electronic circuitry
EP0048829A2
(en)
*
1980-09-26
1982-04-07
Licentia Patent-Verwaltungs-GmbH
Method of making electrical contacts on a silicon solar cell
EP0048829A3
(en)
*
1980-09-26
1982-12-08
Licentia Patent-Verwaltungs-GmbH
Method of making electrical contacts on a silicon solar cell
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