GB1246668A - Creation of Inventions and Patents with Artificial Intelligence

GB1246668A – Semiconductor assemblies and a method for manufacturing semiconductor assemblies
– Google Patents

GB1246668A – Semiconductor assemblies and a method for manufacturing semiconductor assemblies
– Google Patents
Semiconductor assemblies and a method for manufacturing semiconductor assemblies

Info

Publication number
GB1246668A

GB1246668A
GB03602/71A
GB1360271A
GB1246668A
GB 1246668 A
GB1246668 A
GB 1246668A
GB 03602/71 A
GB03602/71 A
GB 03602/71A
GB 1360271 A
GB1360271 A
GB 1360271A
GB 1246668 A
GB1246668 A
GB 1246668A
Authority
GB
United Kingdom
Prior art keywords
sept
semiconductor assemblies
conductor
elements
semi
Prior art date
1967-09-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Application number
GB03602/71A
Inventor
Masanobu Suenaga
Tetsuo Machii
Takahiro Sawano
Takehiko Kobayashi
Tadao Dengo
Tetsuzo Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toshiba Corp

Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1967-09-06
Filing date
1968-09-06
Publication date
1971-09-15

1967-09-27
Priority claimed from JP42061666A
external-priority
patent/JPS5111475B1/ja

1968-09-06
Application filed by Tokyo Shibaura Electric Co Ltd
filed
Critical
Tokyo Shibaura Electric Co Ltd

1971-09-15
Publication of GB1246668A
publication
Critical
patent/GB1246668A/en

Status
Expired
legal-status
Critical
Current

Links

Espacenet

Global Dossier

Discuss

Classifications

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer

H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 – H01L21/326, e.g. sealing of a cap to a base of a container

H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed

H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof

H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate

H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/02—Containers; Seals

H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls

H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

H01L23/3157—Partial encapsulation or coating

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L23/00—Details of semiconductor or other solid state devices

H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 – H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

H—ELECTRICITY

H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

H02K—DYNAMO-ELECTRIC MACHINES

H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection

H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification

H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores

H02K11/05—Rectifiers associated with casings, enclosures or brackets

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto

H—ELECTRICITY

H01—ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/0001—Technical content checked by a classifier

H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1,246,668. Semi-conductor devices. TOKYO SHIBAURA ELECTRIC CO. Ltd. 6 Sept., 1968 [6 Sept., 1967; 27 Sept., 1967; 14 Feb., 1968], No. 13602/71. Divided out of 1,246,667. Heading H1K. The disclosure of the present Specification is entirely contained in Specification 1,246,667 but the claims relate to an assembly of semiconductor elements situated between an electrode plate and a parallel further plate which is either conductive or is insulating and carries a conductor strip thereon, the electrodes of the elements being connected to the plates or to the conductor strip thereon, and the plates being at least partially held together by an organic, insulating adhesive which laterally surrounds and seals the semi-conductor elements.

GB03602/71A
1967-09-06
1968-09-06
Semiconductor assemblies and a method for manufacturing semiconductor assemblies

Expired

GB1246668A
(en)

Applications Claiming Priority (5)

Application Number
Priority Date
Filing Date
Title

JP5676867

1967-09-06

JP42061666A

JPS5111475B1
(en)

1967-09-27
1967-09-27

JP883668

1968-02-14

DE1764872A

DE1764872C3
(en)

1967-09-06
1968-08-22

Process for the manufacture of semiconductor rectifiers

US5985370A

1970-06-25
1970-06-25

Publications (1)

Publication Number
Publication Date

GB1246668A
true

GB1246668A
(en)

1971-09-15

Family
ID=27509955
Family Applications (2)

Application Number
Title
Priority Date
Filing Date

GB36505/68A
Expired

GB1246667A
(en)

1967-09-06
1968-09-06
Semiconductor apparatus and method for manufacturing semiconductor apparatus

GB03602/71A
Expired

GB1246668A
(en)

1967-09-06
1968-09-06
Semiconductor assemblies and a method for manufacturing semiconductor assemblies

Family Applications Before (1)

Application Number
Title
Priority Date
Filing Date

GB36505/68A
Expired

GB1246667A
(en)

1967-09-06
1968-09-06
Semiconductor apparatus and method for manufacturing semiconductor apparatus

Country Status (5)

Country
Link

US
(2)

US3648121A
(en)

DE
(1)

DE1764872C3
(en)

FR
(1)

FR1579178A
(en)

GB
(2)

GB1246667A
(en)

NL
(1)

NL148744B
(en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

JPS4846559U
(en)

1971-09-30
1973-06-18

DE2237366A1
(en)

1972-07-29
1974-02-14
Semikron Gleichrichterbau

SEMI-CONDUCTOR ARRANGEMENT

IT985859B
(en)

1973-05-07
1974-12-20
Int Rectifier Corp Italiana Sp

THREE-PHASE RECTIFIER UNIT FOR VEHICLE ALTERNATORS WITH AUXILIARY EXCITATION CIRCUIT

US3889285A
(en)

1974-02-20
1975-06-10
Ford Motor Co
Canister diode having improved environment protective insulation

US3939558A
(en)

1975-02-10
1976-02-24
Bourns, Inc.
Method of forming an electrical network package

DE7512573U
(en)

1975-04-19
1975-09-04
Semikron Gesellschaft Fuer Gleichri

SEMI-CONDUCTOR RECTIFIER ARRANGEMENT

FR2395609A1
(en)

1977-06-24
1979-01-19
Radiotechnique Compelec

SOLAR CELL GENERATOR PANEL FLOODED IN A LAMINATE AND PROCESS FOR OBTAINING IT

DE2734571A1
(en)

1977-07-30
1979-02-15
Bosch Gmbh Robert

RECTIFIER ARRANGEMENT

US4218694A
(en)

1978-10-23
1980-08-19
Ford Motor Company
Rectifying apparatus including six semiconductor diodes sandwiched between ceramic wafers

FR2453500A1
(en)

1979-04-04
1980-10-31
Sev Alternateurs
Semiconductor rectifier for motor vehicle alternator – has diodes soldered to sockets on support plate, with extended contact cross=section

US4438561A
(en)

1981-10-01
1984-03-27
Rogers Corporation
Method of reworking printed circuit boards

US4531146A
(en)

1983-07-14
1985-07-23
Cutchaw John M
Apparatus for cooling high-density integrated circuit packages

US4606000A
(en)

1985-03-27
1986-08-12
General Motors Corporation
Bridge rectifier

DE3711192A1
(en)

1987-04-02
1988-10-13
Bosch Gmbh Robert

STORAGE AND COOLING DEVICE FOR RECTIFIER DIODES IN ELECTRICAL MACHINES

US5300809A
(en)

1989-12-12
1994-04-05
Sumitomo Special Metals Co., Ltd.
Heat-conductive composite material

JP2964654B2
(en)

1991-01-30
1999-10-18
住友電気工業株式会社

Wear evaluation test method

US5413964A
(en)

1991-06-24
1995-05-09
Digital Equipment Corporation
Photo-definable template for semiconductor chip alignment

JP2531928B2
(en)

1993-11-05
1996-09-04
株式会社東芝

Semiconductor stack

JP4479121B2
(en)

2001-04-25
2010-06-09
株式会社デンソー

Manufacturing method of semiconductor device

KR100570586B1
(en)

2002-12-17
2006-04-13
(주)아이블포토닉스
Method for fabricating film structure comprising ferroelectric single crystal layer

US20050156329A1
(en)

2003-12-24
2005-07-21
Sheen Charng G.
Semiconductor device by embedded package

DE102013216709B4
(en)

2013-08-22
2021-03-25
Infineon Technologies Ag

SEMICONDUCTOR ARRANGEMENT, METHOD FOR MANUFACTURING A NUMBER OF CHIP ASSEMBLIES AND METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT

CN108400214A
(en)

2013-10-11
2018-08-14
世迈克琉明有限公司
Semiconductor light-emitting elements

DE102015007586A1
(en)

2015-06-16
2016-12-22
Audi Ag

Energy transfer device

Family Cites Families (10)

* Cited by examiner, † Cited by third party

Publication number
Priority date
Publication date
Assignee
Title

US2994121A
(en)

1958-11-21
1961-08-01
Shockley William
Method of making a semiconductive switching array

BE584431A
(en)

1959-02-09

US3435516A
(en)

1959-05-06
1969-04-01
Texas Instruments Inc
Semiconductor structure fabrication

US3179854A
(en)

1961-04-24
1965-04-20
Rca Corp
Modular structures and methods of making them

NL279651A
(en)

1961-07-14

US3340347A
(en)

1964-10-12
1967-09-05
Corning Glass Works
Enclosed electronic device

US3349481A
(en)

1964-12-29
1967-10-31
Alpha Microelectronics Company
Integrated circuit sealing method and structure

US3476985A
(en)

1965-12-15
1969-11-04
Licentia Gmbh
Semiconductor rectifier unit

US3461549A
(en)

1966-03-09
1969-08-19
Matsushita Electronics Corp
Method for manufacturing semiconductor devices

US3509429A
(en)

1968-01-15
1970-04-28
Ibm
Heat sink assembly for semiconductor devices

1968

1968-07-03
US
US742292A
patent/US3648121A/en
not_active
Expired – Lifetime

1968-08-21
FR
FR1579178D
patent/FR1579178A/fr
not_active
Expired

1968-08-22
DE
DE1764872A
patent/DE1764872C3/en
not_active
Expired

1968-09-06
NL
NL686812708A
patent/NL148744B/en
not_active
IP Right Cessation

1968-09-06
GB
GB36505/68A
patent/GB1246667A/en
not_active
Expired

1968-09-06
GB
GB03602/71A
patent/GB1246668A/en
not_active
Expired

1970

1970-06-25
US
US00059853A
patent/US3715802A/en
not_active
Expired – Lifetime

Also Published As

Publication number
Publication date

NL148744B
(en)

1976-02-16

NL6812708A
(en)

1969-03-10

FR1579178A
(en)

1969-08-22

DE1764872B2
(en)

1979-08-30

US3715802A
(en)

1973-02-13

US3648121A
(en)

1972-03-07

GB1246667A
(en)

1971-09-15

DE1764872C3
(en)

1980-07-17

DE1764872A1
(en)

1971-11-25

Contact information