GB1286206A – Epoxy resin compositions
– Google Patents
GB1286206A – Epoxy resin compositions
– Google Patents
Epoxy resin compositions
Info
Publication number
GB1286206A
GB1286206A
GB25040/70A
GB2504070A
GB1286206A
GB 1286206 A
GB1286206 A
GB 1286206A
GB 25040/70 A
GB25040/70 A
GB 25040/70A
GB 2504070 A
GB2504070 A
GB 2504070A
GB 1286206 A
GB1286206 A
GB 1286206A
Authority
GB
United Kingdom
Prior art keywords
tetraphenylborate
epoxy resin
filler
triphenylphosphonium
granularity
Prior art date
1969-05-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25040/70A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1969-05-26
Filing date
1970-05-22
Publication date
1972-08-23
1970-05-22
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd
filed
Critical
Hitachi Chemical Co Ltd
1972-08-23
Publication of GB1286206A
publication
Critical
patent/GB1286206A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
C—CHEMISTRY; METALLURGY
C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
C08G59/72—Complexes of boron halides
Abstract
1286206 Curing epoxy resins HITACHI Ltd and HITACHI CHEMICAL CO Ltd 22 May 1970 [26 May 1969 (2)] 25040/70 Heading C3B A curable composition comprises an epoxy resin, a polycarboxylic acid anhydride and a curing promoter of formula in which M is P or As; R 1 to R 4 which may be the same or different are each alkyl, hydroxyethyl, alkenyl or aryl; R 5 is alkyl, alkenyl or aryl or when M is M and R 1 , R 2 , R 3 and R 4 are Ph, R 4 is 2-hydroxyethyl or Examples of suitable anhydrides are methylendomethylenetetrahydrophthalic, hexa- or tetrahydrophthalic, dodecenyl – succinic, phthalic or trimellitic anhydrides. Examples of I are tetraphenylphosphonium tetraphenylborate, (n – butyl)triphenylphosphonium tetraphenylborate, (ethyl)triphenylphosphonium tetraphenylborate, tetra – n – butylphosphonium borate, p – xylene – bis – (triphenylphosphonium) tetraphenylborate and tetraphenylarsonium tetraphenylborate. The composition may also comprise a filler, e.g. 5-60% by volume of the total composition of a filler having a granularity of <44 Á and 10-70% by volume of a filler having granularity>64 Á. I may be present at 0À1-10 parts by wt. per 100 parts by wt. of epoxy resin. The anhydride may be present at 0À001-1À5 moles per epoxide equivalent of the epoxy resin. Uses.-Electrical insulation.
GB25040/70A
1969-05-26
1970-05-22
Epoxy resin compositions
Expired
GB1286206A
(en)
Applications Claiming Priority (2)
Application Number
Priority Date
Filing Date
Title
JP4019069
1969-05-26
JP4018969
1969-05-26
Publications (1)
Publication Number
Publication Date
GB1286206A
true
GB1286206A
(en)
1972-08-23
Family
ID=26379633
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB25040/70A
Expired
GB1286206A
(en)
1969-05-26
1970-05-22
Epoxy resin compositions
Country Status (2)
Country
Link
US
(1)
US3637572A
(en)
GB
(1)
GB1286206A
(en)
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE3151540A1
(en)
*
1980-12-29
1982-08-19
Ciba-Geigy GmbH, 7867 Wehr
Use of transparent anhydride-curable casting epoxy resins
Families Citing this family (13)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3979355A
(en)
*
1974-02-13
1976-09-07
Westinghouse Electric Corporation
Arsonium latent catalysts for curing epoxy resins
US4175973A
(en)
*
1974-05-02
1979-11-27
General Electric Company
Curable compositions
US4175963A
(en)
*
1974-05-02
1979-11-27
General Electric Company
Method of exposing and curing an epoxy composition containing an aromatic onium salt
GB1512982A
(en)
*
1974-05-02
1978-06-01
Gen Electric
Salts
US3947395A
(en)
*
1974-05-07
1976-03-30
Hitachi, Ltd.
Epoxy surface coating compositions
US4472540A
(en)
*
1982-07-14
1984-09-18
American Olean Tile Company
Wide joint latex grout composition
JPS61268750A
(en)
*
1985-05-22
1986-11-28
Shin Etsu Chem Co Ltd
Epoxy resin composition for semiconductor sealing use
JP2524011B2
(en)
*
1991-05-23
1996-08-14
株式会社日立製作所
Thermosetting resin composition for high-voltage coil casting, mold coil and panel obtained by casting and curing with the composition
GB9224854D0
(en)
*
1992-11-27
1993-01-13
Ciba Geigy Ag
Moulding process
JP4288940B2
(en)
*
2002-12-06
2009-07-01
日亜化学工業株式会社
Epoxy resin composition
JP5679701B2
(en)
*
2010-06-07
2015-03-04
日東電工株式会社
Optical epoxy resin composition, optical component using the same, and optical semiconductor device obtained using the same
KR101326960B1
(en)
*
2011-05-20
2013-11-13
엘지이노텍 주식회사
Epoxy resin compound and radiant heat circuit board using the same
US9480166B2
(en)
*
2013-04-16
2016-10-25
E I Du Pont De Nemours And Company
Method of manufacturing non-firing type electrode
1970
1970-05-21
US
US39224A
patent/US3637572A/en
not_active
Expired – Lifetime
1970-05-22
GB
GB25040/70A
patent/GB1286206A/en
not_active
Expired
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE3151540A1
(en)
*
1980-12-29
1982-08-19
Ciba-Geigy GmbH, 7867 Wehr
Use of transparent anhydride-curable casting epoxy resins
Also Published As
Publication number
Publication date
US3637572A
(en)
1972-01-25
DE2025469A1
(en)
1970-12-03
DE2025469B2
(en)
1975-07-10
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Legal Events
Date
Code
Title
Description
1973-01-04
PS
Patent sealed [section 19, patents act 1949]
1990-06-20
PE20
Patent expired after termination of 20 years
