GB1300334A – Semi-conductor arrangement and method of production
– Google Patents
GB1300334A – Semi-conductor arrangement and method of production
– Google Patents
Semi-conductor arrangement and method of production
Info
Publication number
GB1300334A
GB1300334A
GB05121/70A
GB1512170A
GB1300334A
GB 1300334 A
GB1300334 A
GB 1300334A
GB 05121/70 A
GB05121/70 A
GB 05121/70A
GB 1512170 A
GB1512170 A
GB 1512170A
GB 1300334 A
GB1300334 A
GB 1300334A
Authority
GB
United Kingdom
Prior art keywords
conductor
semi
members
strip
wafer
Prior art date
1969-04-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB05121/70A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1969-04-01
Filing date
1970-03-31
Publication date
1972-12-20
1970-03-31
Application filed by Semikron GmbH and Co KG
filed
Critical
Semikron GmbH and Co KG
1972-12-20
Publication of GB1300334A
publication
Critical
patent/GB1300334A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49541—Geometry of the lead-frame
H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49541—Geometry of the lead-frame
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49541—Geometry of the lead-frame
H01L23/49548—Cross section geometry
H01L23/49551—Cross section geometry characterised by bent parts
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
Abstract
1300334 Semi-conductor devices SEMIKRON GES FUR GLEICHRICHTERBAU UND ELEKTRONIK mbH 31 March 1970 [1 April 1969] 15121/70 Heading H1K A semi-conductor arrangement, particularly for use in rectifier circuits, comprises a plurality of conductive members formed from a strip of conductive material, so that each member forms at least one conductor portion and contact portion, and a semi-conductor wafer contacted by a pair of the members. The contact portion 2a of one of the members, 2, is initially formed from a recess 1c of the contact part la of the co-operating member 1 by cutting or etching, and subsequently the intermediate port 2d of member 2 is bent at right angles to the plane of the strip so as to form a clamp between contacts parts 2a and la for the semi-conductor wafer 3 as shown. The wafer 3 may be soldered between the contact portions and subsequently encapsulated. By rearrangements of the members including members with a plurality of conductor and/or contact portions, bridge rectifiers, star design rectifiers &c. may be constructed. The strip may be of copper, brass, iron or an iron-nickel-cobalt alloy.
GB05121/70A
1969-04-01
1970-03-31
Semi-conductor arrangement and method of production
Expired
GB1300334A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
DE1916554A
DE1916554B2
(en)
1969-04-01
1969-04-01
Method for manufacturing semiconductor rectifier arrangements
Publications (1)
Publication Number
Publication Date
GB1300334A
true
GB1300334A
(en)
1972-12-20
Family
ID=5729950
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB05121/70A
Expired
GB1300334A
(en)
1969-04-01
1970-03-31
Semi-conductor arrangement and method of production
Country Status (7)
Country
Link
US
(1)
US3916433A
(en)
BR
(1)
BR7017351D0
(en)
CH
(1)
CH522956A
(en)
DE
(1)
DE1916554B2
(en)
ES
(1)
ES377012A1
(en)
FR
(1)
FR2042218A5
(en)
GB
(1)
GB1300334A
(en)
Families Citing this family (8)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2278160A1
(en)
*
1974-07-08
1976-02-06
Radiotechnique Compelec
COMB SHAPED CONNECTION TABS FOR POWER TRANSISTORS
US4009485A
(en)
*
1974-12-23
1977-02-22
General Electric Company
Semiconductor pellet assembly mounted on ceramic substrate
US4054814A
(en)
*
1975-10-31
1977-10-18
Western Electric Company, Inc.
Electroluminescent display and method of making
US4478588A
(en)
*
1978-03-06
1984-10-23
Amp Incorporated
Light emitting diode assembly
US4247864A
(en)
*
1978-03-06
1981-01-27
Amp Incorporated
Light emitting diode assembly
DE3245762A1
(en)
*
1982-03-13
1983-09-22
Brown, Boveri & Cie Ag, 6800 Mannheim
Modular semiconductor device
US4979017A
(en)
*
1989-02-23
1990-12-18
Adam Mii
Semiconductor element string structure
US5761028A
(en)
*
1996-05-02
1998-06-02
Chrysler Corporation
Transistor connection assembly having IGBT (X) cross ties
Family Cites Families (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3702954A
(en)
*
1967-07-21
1972-11-14
Siemens Ag
Semiconductor component and method of its production
US3500136A
(en)
*
1968-01-24
1970-03-10
Int Rectifier Corp
Contact structure for small area contact devices
US3569797A
(en)
*
1969-03-12
1971-03-09
Bendix Corp
Semiconductor device with preassembled mounting
1969
1969-04-01
DE
DE1916554A
patent/DE1916554B2/en
active
Granted
1970
1970-02-05
US
US008996A
patent/US3916433A/en
not_active
Expired – Lifetime
1970-02-18
ES
ES377012A
patent/ES377012A1/en
not_active
Expired
1970-03-10
BR
BR217351/70A
patent/BR7017351D0/en
unknown
1970-03-27
FR
FR7011113A
patent/FR2042218A5/fr
not_active
Expired
1970-03-31
GB
GB05121/70A
patent/GB1300334A/en
not_active
Expired
1970-04-01
CH
CH477470A
patent/CH522956A/en
not_active
IP Right Cessation
Also Published As
Publication number
Publication date
ES377012A1
(en)
1972-05-16
US3916433A
(en)
1975-10-28
DE1916554A1
(en)
1971-02-11
CH522956A
(en)
1972-05-15
DE1916554B2
(en)
1974-07-04
BR7017351D0
(en)
1973-01-16
FR2042218A5
(en)
1971-02-05
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Legal Events
Date
Code
Title
Description
1973-05-02
PS
Patent sealed [section 19, patents act 1949]
1976-10-27
PLNP
Patent lapsed through nonpayment of renewal fees
