GB1341309A – Semiconductor units
– Google Patents
GB1341309A – Semiconductor units
– Google Patents
Semiconductor units
Info
Publication number
GB1341309A
GB1341309A
GB4487171A
GB4487171A
GB1341309A
GB 1341309 A
GB1341309 A
GB 1341309A
GB 4487171 A
GB4487171 A
GB 4487171A
GB 4487171 A
GB4487171 A
GB 4487171A
GB 1341309 A
GB1341309 A
GB 1341309A
Authority
GB
United Kingdom
Prior art keywords
yoke
spring washers
washers
bolts
semi
Prior art date
1970-09-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4487171A
Inventor
X Vogel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1970-09-29
Filing date
1971-09-27
Publication date
1973-12-19
1971-09-27
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri France SA
filed
Critical
BBC Brown Boveri AG Switzerland
1973-12-19
Publication of GB1341309A
publication
Critical
patent/GB1341309A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
H01L2023/4075—Mechanical elements
H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01013—Aluminum [Al]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01018—Argon [Ar]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01027—Cobalt [Co]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01033—Arsenic [As]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01039—Yttrium [Y]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01074—Tungsten [W]
Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00—Metal working
Y10T29/49—Method of mechanical manufacture
Y10T29/49002—Electrical device making
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Abstract
1341309 Semi-conductor devices BROWN BOVERI & CO Ltd 27 Sept 1971 [29 Sept 1970] 44871/71 Heading H1K A semi-conductor unit is assembled by first attaching a clamping device 11 to a cooling block 2 as shown and using it to clamp yoke 8 against an abutment formed by the rim of a cup 9 located in a recess in block 2 and containing dished spring washers 10. A semi-conductor device 1 and second cooling block 3 are then attached by bolts 6, 7 which engage threads in the yoke and the heads of which bear on block 7 via insulating spacers 12, plain washers and the spring washers 13, which can be compressed an amount equal to the desired room temperature clearance between the yoke and abutment 9. The bolts are tightened so as just not to compress spring washers 13. On releasing the clamping device the resilience of spring washers 10 raises the yoke giving the required clearance and fully compressing washers 13 Spring washers 13 could alternatively be disposed under nuts threaded on bolts 7 which would then slide in yoke 8.
GB4487171A
1970-09-29
1971-09-27
Semiconductor units
Expired
GB1341309A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
CH1456570A
CH522288A
(en)
1970-09-29
1970-09-29
Semiconductor device and method of manufacturing the same
Publications (1)
Publication Number
Publication Date
GB1341309A
true
GB1341309A
(en)
1973-12-19
Family
ID=4401891
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB4487171A
Expired
GB1341309A
(en)
1970-09-29
1971-09-27
Semiconductor units
Country Status (6)
Country
Link
US
(1)
US3740618A
(en)
CH
(1)
CH522288A
(en)
DE
(2)
DE7040956U
(en)
FR
(1)
FR2108055B1
(en)
GB
(1)
GB1341309A
(en)
SE
(1)
SE374980B
(en)
Families Citing this family (10)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB1381778A
(en)
*
1972-06-08
1975-01-29
Cableform Ltd
Semiconductor clamping means
FR2287107A1
(en)
*
1974-10-01
1976-04-30
Jeumont Schneider
PROCEDURE FOR TIGHTENING A POWER SEMICONDUCTOR HOUSING MOUNTED BETWEEN TWO RADIATORS AND DEVICE FOR IMPLEMENTING THIS PROCESS
CH593560A5
(en)
*
1976-01-22
1977-12-15
Bbc Brown Boveri & Cie
DE2942401C2
(en)
*
1979-10-19
1984-09-06
Siemens AG, 1000 Berlin und 8000 München
Semiconductor component with several semiconductor bodies
US4338652A
(en)
*
1980-02-26
1982-07-06
Westinghouse Electric Corp.
Stack module and stack loader therefor
US4414562A
(en)
*
1980-07-24
1983-11-08
Thermal Associates, Inc.
Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases
US4603344A
(en)
*
1984-07-30
1986-07-29
Sundstrand Corporation
Rotating rectifier assembly
JPH0225057A
(en)
*
1988-07-13
1990-01-26
Mitsubishi Electric Corp
Manufacture of semiconductor device
WO2008091987A2
(en)
*
2007-01-26
2008-07-31
Inductotherm Corp.
Compression clamping of semiconductor components
JP2014112583A
(en)
*
2012-12-05
2014-06-19
Toyota Motor Corp
Semiconductor module with cooler
Family Cites Families (8)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
DE411966C
(en)
*
1923-07-05
1925-04-09
Carl Taenzler
Crystal detector for electric waves
GB1000023A
(en)
*
1963-02-06
1965-08-04
Westinghouse Brake & Signal
Semi-conductor devices
US3447118A
(en)
*
1966-08-16
1969-05-27
Westinghouse Electric Corp
Stacking module for flat packaged electrical devices
FR1600561A
(en)
*
1968-01-26
1970-07-27
CH474153A
(en)
*
1968-05-16
1969-06-15
Bbc Brown Boveri & Cie
Method for producing a semiconductor unit by assembling a disk-shaped semiconductor element with two heat sinks and a semiconductor unit produced according to this method
DE1924011C3
(en)
*
1969-05-10
1979-02-01
Siemens Ag, 1000 Berlin Und 8000 Muenchen
Converter with two parallel rails separated by spacers
US3661013A
(en)
*
1969-12-23
1972-05-09
Electric Regulator Corp
Semiconductor assembly
US3651383A
(en)
*
1970-02-05
1972-03-21
Gen Electric
Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink
1970
1970-09-29
CH
CH1456570A
patent/CH522288A/en
not_active
IP Right Cessation
1970-11-05
DE
DE19707040956U
patent/DE7040956U/en
not_active
Expired
1970-11-05
DE
DE19702054393
patent/DE2054393A1/en
active
Pending
1971
1971-09-14
US
US00180415A
patent/US3740618A/en
not_active
Expired – Lifetime
1971-09-27
FR
FR7134614A
patent/FR2108055B1/fr
not_active
Expired
1971-09-27
GB
GB4487171A
patent/GB1341309A/en
not_active
Expired
1971-09-27
SE
SE7112215A
patent/SE374980B/xx
unknown
Also Published As
Publication number
Publication date
US3740618A
(en)
1973-06-19
FR2108055A1
(en)
1972-05-12
CH522288A
(en)
1972-06-15
FR2108055B1
(en)
1974-06-07
DE2054393A1
(en)
1972-03-30
DE7040956U
(en)
1972-06-15
SE374980B
(en)
1975-03-24
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Legal Events
Date
Code
Title
Description
1974-05-01
PS
Patent sealed [section 19, patents act 1949]
1980-11-12
746
Register noted ‘licences of right’ (sect. 46/1977)
1986-05-21
PCNP
Patent ceased through non-payment of renewal fee
