GB1346950A – Production of schottky contacts
– Google Patents
GB1346950A – Production of schottky contacts
– Google Patents
Production of schottky contacts
Info
Publication number
GB1346950A
GB1346950A
GB5253571A
GB5253571A
GB1346950A
GB 1346950 A
GB1346950 A
GB 1346950A
GB 5253571 A
GB5253571 A
GB 5253571A
GB 5253571 A
GB5253571 A
GB 5253571A
GB 1346950 A
GB1346950 A
GB 1346950A
Authority
GB
United Kingdom
Prior art keywords
chromium
aluminium
etching
nov
thick
Prior art date
1970-11-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5253571A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1970-11-20
Filing date
1971-11-12
Publication date
1974-02-13
1971-11-12
Application filed by Siemens AG
filed
Critical
Siemens AG
1974-02-13
Publication of GB1346950A
publication
Critical
patent/GB1346950A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L24/02—Bonding areas ; Manufacturing methods related thereto
H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/02—Bonding areas; Manufacturing methods related thereto
H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/484—Connecting portions
H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/12—Passive devices, e.g. 2 terminal devices
H01L2924/1203—Rectifying Diode
H01L2924/12032—Schottky diode
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/14—Integrated circuits
Abstract
1346950 Etching SIEMENS AG 12 Nov 1971 [20 Nov 1970] 52535/71 Heading B6J [Also in Division H1] One or more Schottky contacts are made to one face of a semi-conductor body by depositing chromium over the face, masking the chromium at the contact sites with deposited aluminium, and then etching away the unmasked chromium in hydrochloric acid having a concentration of at least 1% by weight (preferably 6%). The aluminium may be restricted to the required areas either by vapour depositing it through a mask or by removing unrequired parts of an overall deposit by etching with phosphoric acid through a developed photoresist mask. Typically the chromium is from 20-100 mm. thick while the aluminium to which gold contact wires are to be thermo-compression or ultrasonically bonded, is from 50-150 mm. thick. The contacted body may be subdivided to provide a number of devices.
GB5253571A
1970-11-20
1971-11-12
Production of schottky contacts
Expired
GB1346950A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
DE2057204A
DE2057204C3
(en)
1970-11-20
1970-11-20
Process for the production of metal-semiconductor contacts
Publications (1)
Publication Number
Publication Date
GB1346950A
true
GB1346950A
(en)
1974-02-13
Family
ID=5788703
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB5253571A
Expired
GB1346950A
(en)
1970-11-20
1971-11-12
Production of schottky contacts
Country Status (10)
Country
Link
US
(1)
US3819432A
(en)
JP
(1)
JPS5316671B1
(en)
BE
(1)
BE775571A
(en)
CA
(1)
CA920723A
(en)
DE
(1)
DE2057204C3
(en)
FR
(1)
FR2115205B1
(en)
GB
(1)
GB1346950A
(en)
IT
(1)
IT940614B
(en)
LU
(1)
LU64296A1
(en)
NL
(1)
NL7115929A
(en)
Families Citing this family (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2360993A1
(en)
*
1976-08-03
1978-03-03
Lignes Telegraph Telephon
IMPROVEMENT OF THE MANUFACTURING PROCESSES OF GOLD-SILICON BARRIER SCHOTTKY DIODES
US4215156A
(en)
*
1977-08-26
1980-07-29
International Business Machines Corporation
Method for fabricating tantalum semiconductor contacts
US5254869A
(en)
*
1991-06-28
1993-10-19
Linear Technology Corporation
Aluminum alloy/silicon chromium sandwich schottky diode
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3094489A
(en)
*
1959-08-31
1963-06-18
Monsanto Chemicals
Method and composition for brightening aluminum
US3423205A
(en)
*
1964-10-30
1969-01-21
Bunker Ramo
Method of making thin-film circuits
US3368124A
(en)
*
1965-12-09
1968-02-06
Rca Corp
Semiconductor devices
US3597667A
(en)
*
1966-03-01
1971-08-03
Gen Electric
Silicon oxide-silicon nitride coatings for semiconductor devices
1970
1970-11-20
DE
DE2057204A
patent/DE2057204C3/en
not_active
Expired
1971
1971-11-12
GB
GB5253571A
patent/GB1346950A/en
not_active
Expired
1971-11-16
IT
IT3113471A
patent/IT940614B/en
active
1971-11-17
FR
FR7141083A
patent/FR2115205B1/fr
not_active
Expired
1971-11-18
NL
NL7115929A
patent/NL7115929A/xx
unknown
1971-11-18
LU
LU64296D
patent/LU64296A1/xx
unknown
1971-11-19
BE
BE775571A
patent/BE775571A/en
unknown
1971-11-19
CA
CA128072A
patent/CA920723A/en
not_active
Expired
1971-11-20
JP
JP9352971A
patent/JPS5316671B1/ja
active
Pending
1971-11-22
US
US20090071
patent/US3819432A/en
not_active
Expired – Lifetime
Also Published As
Publication number
Publication date
BE775571A
(en)
1972-03-16
LU64296A1
(en)
1972-06-02
DE2057204B2
(en)
1974-07-11
CA920723A
(en)
1973-02-06
US3819432A
(en)
1974-06-25
FR2115205A1
(en)
1972-07-07
NL7115929A
(en)
1972-05-24
JPS5316671B1
(en)
1978-06-02
FR2115205B1
(en)
1977-04-22
DE2057204C3
(en)
1975-02-27
IT940614B
(en)
1973-02-20
DE2057204A1
(en)
1972-06-08
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Legal Events
Date
Code
Title
Description
1974-07-03
PS
Patent sealed [section 19, patents act 1949]
1979-06-13
PCNP
Patent ceased through non-payment of renewal fee
