GB1352557A – Wire scribed circuit boards
– Google Patents
GB1352557A – Wire scribed circuit boards
– Google Patents
Wire scribed circuit boards
Info
Publication number
GB1352557A
GB1352557A
GB2517971*A
GB2517971A
GB1352557A
GB 1352557 A
GB1352557 A
GB 1352557A
GB 2517971 A
GB2517971 A
GB 2517971A
GB 1352557 A
GB1352557 A
GB 1352557A
Authority
GB
United Kingdom
Prior art keywords
circuit boards
wire scribed
scribed circuit
indium
solder
Prior art date
1970-03-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2517971*A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1970-03-05
Filing date
1971-04-19
Publication date
1974-05-08
1971-04-19
Application filed by Kollmorgen Corp
filed
Critical
Kollmorgen Corp
1974-05-08
Publication of GB1352557A
publication
Critical
patent/GB1352557A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K13/04—Mounting of components, e.g. of leadless components
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K13/04—Mounting of components, e.g. of leadless components
H05K13/043—Feeding one by one by other means than belts
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K7/00—Constructional details common to different types of electric apparatus
H05K7/02—Arrangements of circuit components or wiring on supporting structure
H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
H01L2924/191—Disposition
H01L2924/19101—Disposition of discrete passive components
H01L2924/19107—Disposition of discrete passive components off-chip wires
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/03—Use of materials for the substrate
H05K1/0313—Organic insulating material
H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
H05K2201/10227—Other objects, e.g. metallic pieces
H05K2201/10287—Metal wires as connectors or conductors
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
H05K3/42—Plated through-holes or plated via connections
Abstract
1352557 Soldering KOLLMORGEN CORP 19 April 1971 [5 March 1970] 25179/71 Heading B3R [Also in Divisions H1 and H2] Through connections in a circuit board consisting of a dielectric board to which are adhered wires 14 Fig. 1G of copper coated with tin, indium or solder are made by projectile pins 23 also coated with tin, indium or solder. The board is heated to fuse the coatings.
GB2517971*A
1970-03-05
1971-04-19
Wire scribed circuit boards
Expired
GB1352557A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US1674270A
1970-03-05
1970-03-05
Publications (1)
Publication Number
Publication Date
GB1352557A
true
GB1352557A
(en)
1974-05-08
Family
ID=21778714
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB2517971*A
Expired
GB1352557A
(en)
1970-03-05
1971-04-19
Wire scribed circuit boards
Country Status (7)
Country
Link
JP
(2)
JPS5550399B1
(en)
AT
(1)
AT312731B
(en)
CA
(1)
CA932478A
(en)
DE
(1)
DE2111396B2
(en)
FR
(1)
FR2084258A5
(en)
GB
(1)
GB1352557A
(en)
NL
(1)
NL173907C
(en)
Cited By (8)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US7971339B2
(en)
2006-09-26
2011-07-05
Hid Global Gmbh
Method and apparatus for making a radio frequency inlay
US8028923B2
(en)
2007-11-14
2011-10-04
Smartrac Ip B.V.
Electronic inlay structure and method of manufacture thereof
US8090407B2
(en)
2007-06-27
2012-01-03
On Track Innovations Ltd.
Contactless smart SIM
US8286332B2
(en)
2006-09-26
2012-10-16
Hid Global Gmbh
Method and apparatus for making a radio frequency inlay
US8413316B2
(en)
2007-09-18
2013-04-09
Hid Global Ireland Teoranta
Method for bonding a wire conductor laid on a substrate
WO2013179051A2
(en)
*
2012-05-31
2013-12-05
Zytronic Displays Limited
Multi-touch sensing panel production method
US8646675B2
(en)
2004-11-02
2014-02-11
Hid Global Gmbh
Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
US10078402B2
(en)
2012-05-31
2018-09-18
Zytronic Displays Limited
Touch sensitive displays
Families Citing this family (20)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2185915B1
(en)
*
1972-05-25
1975-08-29
Commissariat Energie Atomique
FR2304247A1
(en)
*
1975-03-12
1976-10-08
Commissariat Energie Atomique
METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS
US4065850A
(en)
*
1975-08-13
1978-01-03
Kollmorgen Technologies Corporation
Method of making multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
ZA781637B
(en)
*
1977-06-20
1979-02-28
Kollmorgen Tech Corp
Wire scribed circuit board and method for the manufacture thereof
ZA775455B
(en)
*
1977-08-09
1978-07-26
Kollmorgen Tech Corp
Improved methods and apparatus for making scribed circuit boards
FR2424646A1
(en)
*
1978-04-28
1979-11-23
Commissariat Energie Atomique
CONNECTION PROCESS OF CONNECTION TERMINALS OF ELECTRICAL ASSEMBLIES
FR2458978A2
(en)
*
1979-06-07
1981-01-02
Commissariat Energie Atomique
METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS
DE3035090C2
(en)
*
1979-09-28
1995-01-26
Cii Honeywell Bull
Device for wiring substrate surfaces
US4500389A
(en)
*
1981-04-14
1985-02-19
Kollmorgen Technologies Corporation
Process for the manufacture of substrates to interconnect electronic components
FR2507853A1
(en)
*
1981-06-12
1982-12-17
Brefdent Dominique
Re-usable printed circuit board system without etching – has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool
US4450623A
(en)
*
1981-12-18
1984-05-29
Kollmorgen Technologies Corporation
Process for the manufacture of circuit boards
EP0168602A1
(en)
*
1984-06-25
1986-01-22
Kollmorgen Technologies Corporation
Method for making interconnection circuit boards
US4711026A
(en)
*
1985-07-19
1987-12-08
Kollmorgen Technologies Corporation
Method of making wires scribed circuit boards
US4693778A
(en)
*
1985-07-19
1987-09-15
Kollmorgen Technologies Corporation
Apparatus for making scribed circuit boards and circuit board modifications
JPS6292495A
(en)
*
1985-09-13
1987-04-27
アドバンスト インターコネクション テクノロジー インコーポレイテッド
Manufacture of substrate for mutual connection of electronic parts and product manufactured by that method
DE3539040A1
(en)
*
1985-11-04
1987-05-07
Telefonbau & Normalzeit Gmbh
Track and circuit arrangement for printed circuit boards fitted with integrated circuits
US4972050A
(en)
*
1989-06-30
1990-11-20
Kollmorgen Corporation
Wire scribed circuit boards and methods of their manufacture
US6137054A
(en)
*
1994-01-25
2000-10-24
Yazaki Corporation
Wire-circuit sheet and electric junction box thereof
DE19705934C2
(en)
*
1997-02-15
2001-05-17
Cubit Electronics Gmbh
Method and device for introducing wire-shaped conductor wires into a substrate
JP4189707B2
(en)
*
1998-12-03
2008-12-03
日立化成工業株式会社
Wiring device and method of manufacturing wiring board using the same
Family Cites Families (4)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US2958018A
(en)
*
1955-11-07
1960-10-25
Donald O Kocmich
Capacitance operated electronic control
US3234629A
(en)
*
1962-06-14
1966-02-15
Defiance Printed Circuit Corp
Method for producing printed circuits
US3377698A
(en)
*
1964-09-21
1968-04-16
Gen Motors Corp
Method of making an electrical circuit
FR2001647A1
(en)
*
1968-02-07
1969-09-26
Photocircuits Corp
1970
1970-12-29
JP
JP12460570A
patent/JPS5550399B1/ja
active
Pending
1971
1971-03-04
CA
CA106912A
patent/CA932478A/en
not_active
Expired
1971-03-04
AT
AT188671A
patent/AT312731B/en
not_active
IP Right Cessation
1971-03-05
FR
FR7107725A
patent/FR2084258A5/fr
not_active
Expired
1971-03-05
NL
NLAANVRAGE7103009,A
patent/NL173907C/en
not_active
IP Right Cessation
1971-03-05
DE
DE19712111396
patent/DE2111396B2/en
not_active
Ceased
1971-04-19
GB
GB2517971*A
patent/GB1352557A/en
not_active
Expired
1973
1973-01-09
JP
JP549673A
patent/JPS5710592B1/ja
active
Pending
Cited By (12)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US8646675B2
(en)
2004-11-02
2014-02-11
Hid Global Gmbh
Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
US7971339B2
(en)
2006-09-26
2011-07-05
Hid Global Gmbh
Method and apparatus for making a radio frequency inlay
US8286332B2
(en)
2006-09-26
2012-10-16
Hid Global Gmbh
Method and apparatus for making a radio frequency inlay
US8090407B2
(en)
2007-06-27
2012-01-03
On Track Innovations Ltd.
Contactless smart SIM
US8413316B2
(en)
2007-09-18
2013-04-09
Hid Global Ireland Teoranta
Method for bonding a wire conductor laid on a substrate
US8028923B2
(en)
2007-11-14
2011-10-04
Smartrac Ip B.V.
Electronic inlay structure and method of manufacture thereof
WO2013179051A2
(en)
*
2012-05-31
2013-12-05
Zytronic Displays Limited
Multi-touch sensing panel production method
WO2013179051A3
(en)
*
2012-05-31
2014-02-27
Zytronic Displays Limited
Multi-touch sensing panel and corresponding production method
EP2856294A2
(en)
*
2012-05-31
2015-04-08
Zytronic Displays Limited
Multi-touch sensing panel and corresponding production method
CN104541237A
(en)
*
2012-05-31
2015-04-22
齐特罗尼克显示器有限公司
Multi-touch sensing panel and corresponding production method
US10078402B2
(en)
2012-05-31
2018-09-18
Zytronic Displays Limited
Touch sensitive displays
EP2856294B1
(en)
*
2012-05-31
2022-09-07
Zytronic Displays Limited
Multi-touch sensing panel and corresponding production method
Also Published As
Publication number
Publication date
NL173907C
(en)
1984-03-16
DE2111396B2
(en)
1976-04-29
DE2111396A1
(en)
1971-09-30
CA932478A
(en)
1973-08-21
AT312731B
(en)
1974-01-10
NL173907B
(en)
1983-10-17
NL7103009A
(en)
1971-09-07
FR2084258A5
(en)
1971-12-17
JPS5710592B1
(en)
1982-02-26
JPS5550399B1
(en)
1980-12-17
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Legal Events
Date
Code
Title
Description
1974-09-18
PS
Patent sealed
1991-05-22
PE20
Patent expired after termination of 20 years
