GB1360213A – Method of mounting a semi-conductor chip on a heat sink
– Google Patents
GB1360213A – Method of mounting a semi-conductor chip on a heat sink
– Google Patents
Method of mounting a semi-conductor chip on a heat sink
Info
Publication number
GB1360213A
GB1360213A
GB6174670A
GB6174670A
GB1360213A
GB 1360213 A
GB1360213 A
GB 1360213A
GB 6174670 A
GB6174670 A
GB 6174670A
GB 6174670 A
GB6174670 A
GB 6174670A
GB 1360213 A
GB1360213 A
GB 1360213A
Authority
GB
United Kingdom
Prior art keywords
semi
heat sink
layers
mounting
conductor chip
Prior art date
1971-12-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6174670A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1971-12-16
Filing date
1971-12-16
Publication date
1974-07-17
1971-12-16
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd
filed
Critical
Lucas Industries Ltd
1971-12-16
Priority to GB6174670A
priority
Critical
patent/GB1360213A/en
1974-07-17
Publication of GB1360213A
publication
Critical
patent/GB1360213A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
B—PERFORMING OPERATIONS; TRANSPORTING
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/02—Bonding areas; Manufacturing methods related thereto
H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L2224/04026—Bonding areas specifically adapted for layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/8319—Arrangement of the layer connectors prior to mounting
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/838—Bonding techniques
H01L2224/83801—Soldering or alloying
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01005—Boron [B]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01013—Aluminum [Al]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01024—Chromium [Cr]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01029—Copper [Cu]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01042—Molybdenum [Mo]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01079—Gold [Au]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01082—Lead [Pb]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/014—Solder alloys
Abstract
1360213 Semi-conductor devices JOSEPH LUCAS (INDUSTRIES) Ltd 16 Dec 1971 [30 Dec 1970] 61746/70 Heading H1K A semi-conductor body 11 having on one surface 11a at least one Al contact area 13 has on its opposite surface 11b successively deposited layers of Al 14, Cr, Ti or Mo 15, Ni 16 and a metal, such as Au 17, relatively resistant to oxidation. The layer 17 is then soldered, e.g. using a Pb-based solder 18, to a heat sink 12, e.g. of Cu. The layers 14-17 may be deposited by evaporation or sputtering. For a planar power transistor separate Al emitter and base contacts are provided on the surface 11a, the collector being contacted via the layers on the surface 11b.
GB6174670A
1971-12-16
1971-12-16
Method of mounting a semi-conductor chip on a heat sink
Expired
GB1360213A
(en)
Priority Applications (1)
Application Number
Priority Date
Filing Date
Title
GB6174670A
GB1360213A
(en)
1971-12-16
1971-12-16
Method of mounting a semi-conductor chip on a heat sink
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB6174670A
GB1360213A
(en)
1971-12-16
1971-12-16
Method of mounting a semi-conductor chip on a heat sink
Publications (1)
Publication Number
Publication Date
GB1360213A
true
GB1360213A
(en)
1974-07-17
Family
ID=10487400
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB6174670A
Expired
GB1360213A
(en)
1971-12-16
1971-12-16
Method of mounting a semi-conductor chip on a heat sink
Country Status (1)
Country
Link
GB
(1)
GB1360213A
(en)
Cited By (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2383522A1
(en)
*
1977-03-08
1978-10-06
Ates Componenti Elettron
PROCESS FOR FORMING METALLIZED ZONES ON A SERIES OF SEMICONDUCTOR DEVICES
EP0070435A2
(en)
*
1981-07-02
1983-01-26
Matsushita Electronics Corporation
Semiconductor device comprising a semiconductor substrate bonded to a mounting means
EP0384971A1
(en)
*
1989-02-28
1990-09-05
Rockwell International Corporation
Barrier disk
US5076486A
(en)
*
1989-02-28
1991-12-31
Rockwell International Corporation
Barrier disk
US20120171814A1
(en)
*
2010-12-31
2012-07-05
Samsung Electronics Co., Ltd.
Semiconductor packages and methods of fabricating the same
1971
1971-12-16
GB
GB6174670A
patent/GB1360213A/en
not_active
Expired
Cited By (7)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
FR2383522A1
(en)
*
1977-03-08
1978-10-06
Ates Componenti Elettron
PROCESS FOR FORMING METALLIZED ZONES ON A SERIES OF SEMICONDUCTOR DEVICES
EP0070435A2
(en)
*
1981-07-02
1983-01-26
Matsushita Electronics Corporation
Semiconductor device comprising a semiconductor substrate bonded to a mounting means
EP0070435A3
(en)
*
1981-07-02
1984-11-21
Matsushita Electronics Corporation
Semiconductor device comprising a semiconductor substrate bonded to a mounting means
EP0384971A1
(en)
*
1989-02-28
1990-09-05
Rockwell International Corporation
Barrier disk
US5076486A
(en)
*
1989-02-28
1991-12-31
Rockwell International Corporation
Barrier disk
US20120171814A1
(en)
*
2010-12-31
2012-07-05
Samsung Electronics Co., Ltd.
Semiconductor packages and methods of fabricating the same
US9059072B2
(en)
2010-12-31
2015-06-16
Samsung Electronics Co., Ltd.
Semiconductor packages and methods of fabricating the same
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Legal Events
Date
Code
Title
Description
1974-11-27
PS
Patent sealed
1983-07-27
PCNP
Patent ceased through non-payment of renewal fee
