GB1383548A – Light emitting diode assembly
– Google Patents
GB1383548A – Light emitting diode assembly
– Google Patents
Light emitting diode assembly
Info
Publication number
GB1383548A
GB1383548A
GB3046272A
GB3046272A
GB1383548A
GB 1383548 A
GB1383548 A
GB 1383548A
GB 3046272 A
GB3046272 A
GB 3046272A
GB 3046272 A
GB3046272 A
GB 3046272A
GB 1383548 A
GB1383548 A
GB 1383548A
Authority
GB
United Kingdom
Prior art keywords
reflector
light emitting
emitting diode
diode
light
Prior art date
1972-06-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3046272A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1972-06-29
Filing date
1972-06-29
Publication date
1974-02-12
1972-06-29
Application filed by Plessey Co Ltd
filed
Critical
Plessey Co Ltd
1972-06-29
Priority to GB3046272A
priority
Critical
patent/GB1383548A/en
1973-06-25
Priority to US373593A
priority
patent/US3863075A/en
1974-02-12
Publication of GB1383548A
publication
Critical
patent/GB1383548A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
H01L33/52—Encapsulations
H01L33/54—Encapsulations having a particular shape
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/4805—Shape
H01L2224/4809—Loop shape
H01L2224/48091—Arched
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/481—Disposition
H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
H01L33/58—Optical field-shaping elements
H01L33/60—Reflective elements
Abstract
1383548 Electroluminescence PLESSEY CO Ltd 25 June 1973 [29 June 1972] 30462/72 Heading C4S [Also in Division F4] A light emitting diode assembly includes a dish-shaped light reflector formed at one end of and as an integral part of, a first electrical supply lead 2, a light emitting diode mounted within the reflector, a major proportion of the area of one side of the junction being in electrical contact with the reflector and a second supply lead 5, one end being, in contact with the other side of the junction, the diode, reflector and the one end of the lead being encapsulated in a bead of a light transparent material. The assembly may then be further encapsulated in epoxy outer member 10. In fabrication a U-shaped conductor (1) (Fig. 1, not shown) is dished at one free end, a light reflective contact material formed thereon, the diode mounted, a film of contact material formed on at least the other free end and connected to the diode (e.g. via fine wire (7), Fig. 2 (not shown), and after encapsulation, each limb severed at or near the base of the U. Member (1) may be Ni plated Cu, the reflective material, Au, connection made by a Au/Ge alloy solder, and the encapsulation 8 of an epoxy base resin. The part of member 10 behind the reflector may be of regular cross-section (e.g. circular). Opaque collar (11) enhances the appearance and minimizes the effects of meniscus 12 irregularities. In Figs. 4A, 4B (not shown) section (3) is formed by flattening, dishing and bending with intermediate annealing. The panel assembly of Fig. 5 (not shown) includes bush (13) with chamfered end (15) in panel (16) aperture, slot (17) facilitating mounting. Washer (14) chamfer (20) is the same angle as chamfer (19), reverse mounting of the washer accommodating a thicker panel. Flange (11a) cooperates with groove (22), and bush (13) may alternatively have three or four slots (17).
GB3046272A
1972-06-29
1972-06-29
Light emitting diode assembly
Expired
GB1383548A
(en)
Priority Applications (2)
Application Number
Priority Date
Filing Date
Title
GB3046272A
GB1383548A
(en)
1972-06-29
1972-06-29
Light emitting diode assembly
US373593A
US3863075A
(en)
1972-06-29
1973-06-25
Light emitting diode assembly
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
GB3046272A
GB1383548A
(en)
1972-06-29
1972-06-29
Light emitting diode assembly
Publications (1)
Publication Number
Publication Date
GB1383548A
true
GB1383548A
(en)
1974-02-12
Family
ID=10308078
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB3046272A
Expired
GB1383548A
(en)
1972-06-29
1972-06-29
Light emitting diode assembly
Country Status (2)
Country
Link
US
(1)
US3863075A
(en)
GB
(1)
GB1383548A
(en)
Cited By (3)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0290697A2
(en)
*
1987-05-12
1988-11-17
Shen-Yuan Chen
Light emitting diodes (LED) lamp and its quick manufacturing method
EP0374121A2
(en)
*
1988-12-16
1990-06-20
RSF-Elektronik Gesellschaft m.b.H.
Light-emitting diode
WO2008155368A1
(en)
*
2007-06-18
2008-12-24
Barco N.V.
Method and device for improving optical led performance
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1974-02-22
1977-09-16
Radiotechnique Compelec
US4013915A
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1975-10-23
1977-03-22
Bell Telephone Laboratories, Incorporated
Light emitting device mounting arrangement
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1975-12-08
1978-07-19
Savage J
Lens clip for led assembly
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1978-12-04
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Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
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1991-05-28
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1994-09-23
Neiman Sa
REMOTE CONTROL SYSTEM, PARTICULARLY FOR LOCKING / UNLOCKING DOORS FOR MOTOR VEHICLES.
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1994-04-07
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Rohm Co Ltd
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1997-10-21
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911 Emergency Products Inc
Warning signal light
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1998-03-19
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911 Emergency Products, Inc.
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1999-04-06
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E. P . Survivors Llc
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911 Emergency Products, Inc.
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2004-03-02
911Ep, Inc.
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1999-06-08
2000-12-14
911 Emergency Products, Inc.
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911Ep, Inc.
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1999-08-04
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Pederson John C.
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2012-05-29
Federal Law Enforcement Development Services, Inc.
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2002-08-23
2008-10-21
John C. Pederson
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2000-11-15
2002-05-23
Snowy Village, Inc.
Led warning light and communication system
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2002-10-30
2008-04-23
株式会社東芝
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2003-09-19
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Mattel Inc
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2006-05-25
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吴质朴
Light emitting diode and packaging method therefor
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2016-03-22
Federal Law Enforcement Development Services, Inc.
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2007-05-24
2008-12-04
Federal Law Enforcement Development Services, Inc.
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2007-05-24
2016-02-09
Federal Law Enforcement Development Services, Inc.
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2007-05-24
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Federal Law Enforcement Development Services, Inc.
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Federal Law Enforcement Development Services, Inc.
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GB
GB3046272A
patent/GB1383548A/en
not_active
Expired
1973
1973-06-25
US
US373593A
patent/US3863075A/en
not_active
Expired – Lifetime
Cited By (5)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
EP0290697A2
(en)
*
1987-05-12
1988-11-17
Shen-Yuan Chen
Light emitting diodes (LED) lamp and its quick manufacturing method
EP0290697A3
(en)
*
1987-05-12
1989-03-15
Shen-Yuan Chen
Light emitting diodes (led) lamp and its quick manufacturing method
EP0374121A2
(en)
*
1988-12-16
1990-06-20
RSF-Elektronik Gesellschaft m.b.H.
Light-emitting diode
EP0374121A3
(en)
*
1988-12-16
1991-01-16
RSF-Elektronik Gesellschaft m.b.H.
Light-emitting diode
WO2008155368A1
(en)
*
2007-06-18
2008-12-24
Barco N.V.
Method and device for improving optical led performance
Also Published As
Publication number
Publication date
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(en)
1975-01-28
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Legal Events
Date
Code
Title
Description
1975-06-25
PS
Patent sealed [section 19, patents act 1949]
1988-02-10
PCNP
Patent ceased through non-payment of renewal fee
