GB1447524A – Method and apparatus for the assembly of semiconductor devices
– Google Patents
GB1447524A – Method and apparatus for the assembly of semiconductor devices
– Google Patents
Method and apparatus for the assembly of semiconductor devices
Info
Publication number
GB1447524A
GB1447524A
GB4749573A
GB4749573A
GB1447524A
GB 1447524 A
GB1447524 A
GB 1447524A
GB 4749573 A
GB4749573 A
GB 4749573A
GB 4749573 A
GB4749573 A
GB 4749573A
GB 1447524 A
GB1447524 A
GB 1447524A
Authority
GB
United Kingdom
Prior art keywords
strip
lead frame
pattern
patterns
soldering
Prior art date
1973-01-02
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4749573A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1973-01-02
Filing date
1973-10-11
Publication date
1976-08-25
1973-10-11
Application filed by Texas Instruments Inc
filed
Critical
Texas Instruments Inc
1976-08-25
Publication of GB1447524A
publication
Critical
patent/GB1447524A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/93—Batch processes
H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 – H01L21/326, e.g. sealing of a cap to a base of a container
H01L21/52—Mounting semiconductor bodies in containers
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
H01L21/67005—Apparatus not specifically provided for elsewhere
H01L21/67011—Apparatus for manufacture or treatment
H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49517—Additional leads
H01L23/49531—Additional leads the additional leads being a wiring board
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49541—Geometry of the lead-frame
H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
H01L23/495—Lead-frames or other flat leads
H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L24/42—Wire connectors; Manufacturing methods related thereto
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, “first-level” interconnects; Manufacturing methods related thereto
H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
H01L2224/321—Disposition
H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/838—Bonding techniques
H01L2224/83801—Soldering or alloying
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01005—Boron [B]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01006—Carbon [C]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01013—Aluminum [Al]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01014—Silicon [Si]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01019—Potassium [K]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01023—Vanadium [V]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01027—Cobalt [Co]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01029—Copper [Cu]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01033—Arsenic [As]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01039—Yttrium [Y]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/01—Chemical elements
H01L2924/01082—Lead [Pb]
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/014—Solder alloys
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/10—Details of semiconductor or other solid state devices to be connected
H01L2924/11—Device type
H01L2924/14—Integrated circuits
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/181—Encapsulation
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/30—Technical effects
H01L2924/35—Mechanical effects
H01L2924/351—Thermal stress
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/02—Details
H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Abstract
1447524 Soldering TEXAS INSTRUMENTS Inc 11 Oct 1973 [2 Jan 1973] 47495/73 Heading B3R [Also in Division H1] Apparatus for soldering successive copper wiring patterns (not shown), secured to a strip 11 of polyimide plastics and each having connected thereto a semi-conductor chip 31 (see Division H1), to a lead frame strip 21, comprises a punch 33 which co-operates with a die 35 to remove the film-supported pattern from the strip 11, and transfers it to a position on strip 21 in which tinned ends of the pattern contact tinned pads on the lead frame. A heated bonding tool 41 is then elevated to contact strip 21 to form solder-reflow joints between pattern and lead frame. A sprocket wheel 32 engages apertures (not shown) in strip 11 to advance the patterns, and a vacuum applied to a bore 36 in punch 33 retains the patterns during transfer.
GB4749573A
1973-01-02
1973-10-11
Method and apparatus for the assembly of semiconductor devices
Expired
GB1447524A
(en)
Applications Claiming Priority (1)
Application Number
Priority Date
Filing Date
Title
US320349A
US3859718A
(en)
1973-01-02
1973-01-02
Method and apparatus for the assembly of semiconductor devices
Publications (1)
Publication Number
Publication Date
GB1447524A
true
GB1447524A
(en)
1976-08-25
Family
ID=23246002
Family Applications (1)
Application Number
Title
Priority Date
Filing Date
GB4749573A
Expired
GB1447524A
(en)
1973-01-02
1973-10-11
Method and apparatus for the assembly of semiconductor devices
Country Status (14)
Country
Link
US
(1)
US3859718A
(en)
JP
(2)
JPS5751732B2
(en)
KR
(1)
KR780000595B1
(en)
BR
(1)
BR7309074D0
(en)
CA
(1)
CA1086430A
(en)
DD
(1)
DD107812A5
(en)
DE
(1)
DE2363833A1
(en)
FR
(1)
FR2212642B1
(en)
GB
(1)
GB1447524A
(en)
HU
(1)
HU167861B
(en)
IT
(1)
IT991996B
(en)
PH
(1)
PH9927A
(en)
PL
(1)
PL87007B1
(en)
RO
(1)
RO64695A
(en)
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2124433A
(en)
*
1982-07-07
1984-02-15
Int Standard Electric Corp
Electronic component assembly
Families Citing this family (18)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3949925A
(en)
*
1974-10-03
1976-04-13
The Jade Corporation
Outer lead bonder
CA1052912A
(en)
*
1975-07-07
1979-04-17
National Semiconductor Corporation
Gang bonding interconnect tape for semiconductive devices and method of making same
US4099660A
(en)
*
1975-10-31
1978-07-11
National Semiconductor Corporation
Apparatus for and method of shaping interconnect leads
US4166562A
(en)
*
1977-09-01
1979-09-04
The Jade Corporation
Assembly system for microcomponent devices such as semiconductor devices
US4330790A
(en)
*
1980-03-24
1982-05-18
National Semiconductor Corporation
Tape operated semiconductor device packaging
EP0064496A1
(en)
*
1980-11-07
1982-11-17
Mostek Corporation
Multiple terminal two conductor layer burn-in tape
US4331831A
(en)
*
1980-11-28
1982-05-25
Bell Telephone Laboratories, Incorporated
Package for semiconductor integrated circuits
US4409733A
(en)
*
1981-01-26
1983-10-18
Integrated Machine Development
Means and method for processing integrated circuit element
US4754912A
(en)
*
1984-04-05
1988-07-05
National Semiconductor Corporation
Controlled collapse thermocompression gang bonding
JPS60229345A
(en)
*
1984-04-27
1985-11-14
Toshiba Corp
Semiconductor device
DE3686990T2
(en)
*
1985-08-23
1993-04-22
Nec Corp
METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT WHILE A FILM CARRIER TAPE IS APPLIED.
FR2590052B1
(en)
*
1985-11-08
1991-03-01
Eurotechnique Sa
METHOD FOR RECYCLING A CARD COMPRISING A COMPONENT, CARD PROVIDED FOR RECYCLE
US5038453A
(en)
*
1988-07-22
1991-08-13
Rohm Co., Ltd.
Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
US4985988A
(en)
*
1989-11-03
1991-01-22
Motorola, Inc.
Method for assembling, testing, and packaging integrated circuits
US5528397A
(en)
*
1991-12-03
1996-06-18
Kopin Corporation
Single crystal silicon transistors for display panels
US6087195A
(en)
1998-10-15
2000-07-11
Handy & Harman
Method and system for manufacturing lamp tiles
JP5167779B2
(en)
*
2007-11-16
2013-03-21
ルネサスエレクトロニクス株式会社
Manufacturing method of semiconductor device
US20160056095A1
(en)
*
2014-08-25
2016-02-25
Infineon Technologies Ag
Leadframe Strip with Sawing Enhancement Feature
Family Cites Families (6)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
US3544857A
(en)
*
1966-08-16
1970-12-01
Signetics Corp
Integrated circuit assembly with lead structure and method
US3442432A
(en)
*
1967-06-15
1969-05-06
Western Electric Co
Bonding a beam-leaded device to a substrate
US3689991A
(en)
*
1968-03-01
1972-09-12
Gen Electric
A method of manufacturing a semiconductor device utilizing a flexible carrier
US3698074A
(en)
*
1970-06-29
1972-10-17
Motorola Inc
Contact bonding and packaging of integrated circuits
US3698073A
(en)
*
1970-10-13
1972-10-17
Motorola Inc
Contact bonding and packaging of integrated circuits
US3793714A
(en)
*
1971-05-27
1974-02-26
Texas Instruments Inc
Integrated circuit assembly using etched metal patterns of flexible insulating film
1973
1973-01-02
US
US320349A
patent/US3859718A/en
not_active
Expired – Lifetime
1973-07-23
CA
CA177,075A
patent/CA1086430A/en
not_active
Expired
1973-08-01
IT
IT51785/73A
patent/IT991996B/en
active
1973-08-20
DD
DD173056A
patent/DD107812A5/xx
unknown
1973-08-31
HU
HUTE737A
patent/HU167861B/hu
unknown
1973-09-19
JP
JP48105860A
patent/JPS5751732B2/ja
not_active
Expired
1973-10-02
FR
FR7335188A
patent/FR2212642B1/fr
not_active
Expired
1973-10-11
GB
GB4749573A
patent/GB1447524A/en
not_active
Expired
1973-10-17
KR
KR7301720A
patent/KR780000595B1/en
active
1973-11-20
BR
BR9074/73A
patent/BR7309074D0/en
unknown
1973-11-20
PL
PL1973166647A
patent/PL87007B1/pl
unknown
1973-12-11
RO
RO7376955A
patent/RO64695A/en
unknown
1973-12-19
PH
PH15329A
patent/PH9927A/en
unknown
1973-12-21
DE
DE2363833A
patent/DE2363833A1/en
active
Granted
1982
1982-03-10
JP
JP57037882A
patent/JPS57164556A/en
active
Pending
Cited By (1)
* Cited by examiner, † Cited by third party
Publication number
Priority date
Publication date
Assignee
Title
GB2124433A
(en)
*
1982-07-07
1984-02-15
Int Standard Electric Corp
Electronic component assembly
Also Published As
Publication number
Publication date
PL87007B1
(en)
1976-06-30
IT991996B
(en)
1975-08-30
FR2212642A1
(en)
1974-07-26
JPS57164556A
(en)
1982-10-09
DE2363833C2
(en)
1987-01-22
KR780000595B1
(en)
1978-11-23
RO64695A
(en)
1980-06-15
JPS4999477A
(en)
1974-09-19
CA1086430A
(en)
1980-09-23
FR2212642B1
(en)
1978-11-10
US3859718A
(en)
1975-01-14
HU167861B
(en)
1975-12-25
PH9927A
(en)
1976-06-14
BR7309074D0
(en)
1974-10-22
JPS5751732B2
(en)
1982-11-04
DD107812A5
(en)
1974-08-12
DE2363833A1
(en)
1974-07-04
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Legal Events
Date
Code
Title
Description
1977-01-19
PS
Patent sealed [section 19, patents act 1949]
1993-11-10
PE20
Patent expired after termination of 20 years
Effective date:
19931010
