GB1462001A – Method of electrolytically nodularizing a metal surface
– Google Patents
GB1462001A – Method of electrolytically nodularizing a metal surface
– Google Patents
Method of electrolytically nodularizing a metal surface
Info
Publication number
GB1462001A
GB1462001A
GB12675A
GB12675A
GB1462001A
GB 1462001 A
GB1462001 A
GB 1462001A
GB 12675 A
GB12675 A
GB 12675A
GB 12675 A
GB12675 A
GB 12675A
GB 1462001 A
GB1462001 A
GB 1462001A
Authority
GB
United Kingdom
Prior art keywords
bath
plated
nodular
gpl
jan
Prior art date
1974-01-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12675A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
1974-01-07
Filing date
1975-01-02
Publication date
1977-01-19
1975-01-02
Application filed by Gould Inc
filed
Critical
Gould Inc
1977-01-19
Publication of GB1462001A
publication
Critical
patent/GB1462001A/en
Status
Expired
legal-status
Critical
Current
Links
Espacenet
Global Dossier
Discuss
Classifications
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
C—CHEMISTRY; METALLURGY
C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
C25D3/00—Electroplating: Baths therefor
C25D3/02—Electroplating: Baths therefor from solutions
C25D3/38—Electroplating: Baths therefor from solutions of copper
C—CHEMISTRY; METALLURGY
C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
C25D5/60—Electroplating characterised by the structure or texture of the layers
C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/03—Conductive materials
H05K2201/0332—Structure of the conductor
H05K2201/0335—Layered conductors or foils
H05K2201/0355—Metal foils
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/03—Metal processing
H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
H05K2203/0703—Plating
H05K2203/0723—Electroplating, e.g. finish plating
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Abstract
1462001 Nodular copper electro-plate; zincate-treating aluminium GOULD Inc 2 Jan 1975 [7 Jan 1974] 126/75 Headings C7B and C7F A nodular Cu layer is plated on a metal substrate from an acidic bath of pH<1 containing 5-70 gpl Cu, 3-50 NO 3 at 22-50‹C and a cathode c.d. of 50-300 ASF for 10-180 seconds. The bath may contain H 2 SO 4 the be associated with Na, K or NH . substrate an alloy thereof Ni. A subsequent layer Zn, In, brass, Ni, Co, Cr stainless steel applied. In examples Al foil is Cu plated pyrophosphate CN bath, nodular as above, chemically mechanically stripped off finally built up to 1.4 mil thickness on its rear surface using first bath. zincated before plating facilitate chemical stripping thereof, NaOH, ZnO, Fe C13 Rochelle salt. GB12675A 1974-01-07 1975-01-02 Method electrolytically nodularizing metal Expired GB1462001A (en) Applications Claiming Priority (1) Application Number Priority Date Filing Date Title US43134274A 1974-01-07 1974-01-07 Publications (1) Publication Number Publication Date GB1462001A true GB1462001A 1977-01-19 Family ID =23711503 Family Number Title Priority Date GB12675A Expired GB1462001A 1974-01-07 1975-01-02 Method Country Status (6) Country Link JP (1) JPS5756558B2 CA CA1044636A DE DE2500160C2 GB LU LU71602A1 SE SE7500053L Cited By (3) * by examiner, † third party Publication number Priority date Publication date Assignee Title US4846918A * 1988-02-24 1989-07-11 Psi Star Copper etching process product controlled nitrous acid reaction EP0996318A2 * 1998-10-19 2000-04-26 Mitsui Mining & Smelting Co., Ltd. Novel composite foil, producing same copper-clad laminate EP0996319A2 Ltd. Composite material used in making printed wiring boards Families Citing this family (7) * date Assignee Title US4169018A * 1978-01-16 1979-09-25 Gould Inc. Process electroforming copper US4468293A * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment improving bond strength JPS58224059A * 1982-06-22 1983-12-26 Tokai Rika Co Ltd Die casting machine US4515671A * 1983-01-24 1985-05-07 Olin US5670033A * 1993-04-19 1997-09-23 Electrocopper Products Limited Process powder, oxides RU2126312C1 * 1993-04-19 1999-02-20 ЭлектроКуппер Продактс Лимитед Method US5366612A * 1993-04-19 1994-11-22 Magma Copper Company Process Family Cites (1) * date Assignee Title US3857681A * 1971-08-03 1974-12-31 Yates Industries Copper products produced therefrom 1974 1974-12-18 CA CA216,635A patent>Download PDF in English
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